Profile picture not found

Matthias Arndt

https://orcid.org/0000-0002-5385-5331
View graph of relations
1 - 12 out of 12Page size: 20

Publications

  1. 2023
  2. Published

    Detection of joining mechanisms at different locations of the wire/substrate interface during ultrasonic wire bonding via a PZT-based sensor array

    Long, Y., Arndt, M., Sun, C., Dencker, F., Wurz, M. & Twiefel, J., Mar 2023, In: Journal of Materials Processing Technology. 312, 117826.

    Research output: Contribution to journal › Article › Research › peer review

  3. Published

    Monitoring of the Flange Draw-In During Deep Drawing Processes Using a Thin-Film Inductive Sensor

    Fünfkirchler, T., Arndt, M., Hübner, S., Dencker, F., Wurz, M. C. & Behrens, B. A., 2 Feb 2023, Lecture Notes in Production Engineering. Springer Nature, p. 111-121 11 p. (Lecture Notes in Production Engineering; vol. Part F1163).

    Research output: Chapter in book/report/conference proceeding › Contribution to book/anthology › Research › peer review

  4. Published

    Manufacturing and Characterization of Piezoelectric Force Sensor Arrays for Investigation of Ultrasonic Wire Bonding

    Arndt, M., Long, Y., Hu, C., Dencker, F., Twiefel, J. & Wurz, M. C., 2023, MikroSystemTechnik Kongress 2023 - Mikroelektronik, Mikrosystemtechnik und ihre Anwendungen - Nachhaltigkeit und Technologiesouveranitat, Proceedings. VDE Verlag GmbH, p. 462-465 4 p.

    Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review

  5. 2022
  6. Published

    Impact of surface texture on ultrasonic wire bonding process

    Long, Y., Arndt, M., Dencker, F., Wurz, M., Twiefel, J. & Wallaschek, J., Sept 2022, In: Journal of Materials Research and Technology. 20, p. 1828-1838 11 p.

    Research output: Contribution to journal › Article › Research › peer review

  7. Published

    Entwicklung eines piezoelektrischen Kraftsensor-Arrays

    Arndt, M., Mar 2022, phi – Produktionstechnik Hannover informiert, 34.

    Research output: Contribution to specialist publication › Contribution in popular science journal › Transfer

  8. Published

    Tiefziehen mit integrierter induktiver Flanscheinzugssensorik in Dünnschichttechnik: Schlussbericht vom 28.02.2022 zu IGF-Vorhaben Nr. 20468 N : Berichtszeitraum: 01.03.2019 bis 31.08.2021

    Fünfkirchler, T., Pfeffer, C., Micke-Camuz, M., Arndt, M., Glukhovskoy, A., Künzler, C., Ottermann, R., Behrens, B., Maier, H. J. & Salomon, R., 2022, Düsseldorf. (Forschung für die Praxis / Forschungsvereinigung Stahlanwendung e.V; vol. 1217)

    Research output: Book/Report › Other report › Research

  9. 2021
  10. Published

    Simulationsgestützte Auslegung und Fertigung von piezoelektrischen Kraftsensor-Arrays zur Untersuchung des Ultraschall-Drahtbondprozesses

    Arndt, M., Wurz, M. C., Dencker, F., Long, Y. & Twiefel, J., 2021, MikroSystemTechnik Kongress 2021: Mikroelektronik, Mikrosystemtechnik und ihre Anwendungen - Innovative Produkte fur zukunftsfahige Markte, Proceedings. VDE Verlag GmbH, p. 742-745 4 p. (MikroSystemTechnik Kongress 2021: Mikroelektronik, Mikrosystemtechnik und ihre Anwendungen - Innovative Produkte fur zukunftsfahige Markte, Proceedings).

    Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review

  11. 2020
  12. Published

    Novel Piezoelectric Force Sensor Array for Investigation of Ultrasonic Wire Bonding

    Arndt, M., Long, Y., Dencker, F., Reimann, J., Twiefel, J. & Wurz, M. C., 2020, Proceedings: IEEE 70th Electronic Components and Technology Conference, ECTC 2020. Institute of Electrical and Electronics Engineers Inc., p. 276-283 8 p. 9159495. (Proceedings - Electronic Components and Technology Conference; vol. 2020-June).

    Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review

  13. Published

    Optical Platform for Highly Precise Optical Components

    Bengsch, S., Fischer, E., De Wall, S., Schelm, T., Arndt, M. & Wurz, M. C., 2020, Proceedings: IEEE 70th Electronic Components and Technology Conference, ECTC 2020. Institute of Electrical and Electronics Engineers Inc., p. 2191-2196 6 p. 9159477. (Proceedings - Electronic Components and Technology Conference; vol. 2020-June).

    Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review

  14. 2019
  15. Published

    Novel Eddy-Current Sensor for Industrial Deep-Drawing Applications

    Arndt, M., Dencker, F. & Wurz, M. C., Oct 2019, 2019 IEEE Sensors, SENSORS 2019: Proceedings. Institute of Electrical and Electronics Engineers Inc., 4 p. 8956948. (Proceedings of IEEE Sensors; vol. 2019-October).

    Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review

  16. Published

    Simulationsgestützte Auslegung und Fertigung von werkzeugintegrierten induktiven Sensoren

    Arndt, M., Dencker, F. & Wurz, M. C., 2019, MikroSystemTechnik Kongress 2019: Mikroelektronik | MEMS-MOEMS | Systemintegration - Saulen der Digitalisierung und kunstlichen Intelligenz, Proceedings. VDE Verlag GmbH, p. 673-676 4 p.

    Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review

  17. 2017
  18. Published

    Mikrofluidische Galvanik zur Herstellung magnetoresistiver Schichten

    Rechel, M., Taptimthong, P., Arndt, M. & Wurz, M. C., 2017, MikroSystemTechnik Kongress 2017 "MEMS, Mikroelektronik, Systeme", Proceedings. VDE Verlag GmbH, p. 313-316 4 p. (MikroSystemTechnik Kongress 2017 "MEMS, Mikroelektronik, Systeme", Proceedings).

    Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review