Publications
- 2023
- Published
Detection of joining mechanisms at different locations of the wire/substrate interface during ultrasonic wire bonding via a PZT-based sensor array
Long, Y., Arndt, M., Sun, C., Dencker, F., Wurz, M. & Twiefel, J., Mar 2023, In: Journal of Materials Processing Technology. 312, 117826.Research output: Contribution to journal › Article › Research › peer review
- Published
Monitoring of the Flange Draw-In During Deep Drawing Processes Using a Thin-Film Inductive Sensor
Fünfkirchler, T., Arndt, M., Hübner, S., Dencker, F., Wurz, M. C. & Behrens, B. A., 2 Feb 2023, Lecture Notes in Production Engineering. Springer Nature, p. 111-121 11 p. (Lecture Notes in Production Engineering; vol. Part F1163).Research output: Chapter in book/report/conference proceeding › Contribution to book/anthology › Research › peer review
- 2022
- Published
Impact of surface texture on ultrasonic wire bonding process
Long, Y., Arndt, M., Dencker, F., Wurz, M., Twiefel, J. & Wallaschek, J., Sept 2022, In: Journal of Materials Research and Technology. 20, p. 1828-1838 11 p.Research output: Contribution to journal › Article › Research › peer review
- Published
Entwicklung eines piezoelektrischen Kraftsensor-Arrays
Arndt, M., Mar 2022, phi – Produktionstechnik Hannover informiert, 34.Research output: Contribution to specialist publication › Contribution in popular science journal › Transfer
- Published
Tiefziehen mit integrierter induktiver Flanscheinzugssensorik in Dünnschichttechnik: Schlussbericht vom 28.02.2022 zu IGF-Vorhaben Nr. 20468 N : Berichtszeitraum: 01.03.2019 bis 31.08.2021
Fünfkirchler, T., Pfeffer, C., Micke-Camuz, M., Arndt, M., Glukhovskoy, A., Künzler, C., Ottermann, R., Behrens, B., Maier, H. J. & Salomon, R., 2022, Düsseldorf. (Forschung für die Praxis / Forschungsvereinigung Stahlanwendung e.V; vol. 1217)Research output: Book/Report › Other report › Research
- 2021
- Published
Simulationsgestützte Auslegung und Fertigung von piezoelektrischen Kraftsensor-Arrays zur Untersuchung des Ultraschall-Drahtbondprozesses
Arndt, M., Wurz, M. C., Dencker, F., Long, Y. & Twiefel, J., 2021, MikroSystemTechnik Kongress 2021: Mikroelektronik, Mikrosystemtechnik und ihre Anwendungen - Innovative Produkte fur zukunftsfahige Markte, Proceedings. VDE Verlag GmbH, p. 742-745 4 p. (MikroSystemTechnik Kongress 2021: Mikroelektronik, Mikrosystemtechnik und ihre Anwendungen - Innovative Produkte fur zukunftsfahige Markte, Proceedings).Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review
- 2020
- Published
Novel Piezoelectric Force Sensor Array for Investigation of Ultrasonic Wire Bonding
Arndt, M., Long, Y., Dencker, F., Reimann, J., Twiefel, J. & Wurz, M. C., 2020, Proceedings: IEEE 70th Electronic Components and Technology Conference, ECTC 2020. Institute of Electrical and Electronics Engineers Inc., p. 276-283 8 p. 9159495. (Proceedings - Electronic Components and Technology Conference; vol. 2020-June).Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review
- Published
Optical Platform for Highly Precise Optical Components
Bengsch, S., Fischer, E., De Wall, S., Schelm, T., Arndt, M. & Wurz, M. C., 2020, Proceedings: IEEE 70th Electronic Components and Technology Conference, ECTC 2020. Institute of Electrical and Electronics Engineers Inc., p. 2191-2196 6 p. 9159477. (Proceedings - Electronic Components and Technology Conference; vol. 2020-June).Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review
- 2019
- Published
Novel Eddy-Current Sensor for Industrial Deep-Drawing Applications
Arndt, M., Dencker, F. & Wurz, M. C., Oct 2019, 2019 IEEE Sensors, SENSORS 2019: Proceedings. Institute of Electrical and Electronics Engineers Inc., 4 p. 8956948. (Proceedings of IEEE Sensors; vol. 2019-October).Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review
- Published
Simulationsgestützte Auslegung und Fertigung von werkzeugintegrierten induktiven Sensoren
Arndt, M., Dencker, F. & Wurz, M. C., 2019, MikroSystemTechnik Kongress 2019: Mikroelektronik | MEMS-MOEMS | Systemintegration - Saulen der Digitalisierung und kunstlichen Intelligenz, Proceedings. VDE Verlag GmbH, p. 673-676 4 p.Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review
- 2017
- Published
Mikrofluidische Galvanik zur Herstellung magnetoresistiver Schichten
Rechel, M., Taptimthong, P., Arndt, M. & Wurz, M. C., 2017, MikroSystemTechnik Kongress 2017 "MEMS, Mikroelektronik, Systeme", Proceedings. VDE Verlag GmbH, p. 313-316 4 p. (MikroSystemTechnik Kongress 2017 "MEMS, Mikroelektronik, Systeme", Proceedings).Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review