Profile information

Alexander Kassner

https://orcid.org/0000-0002-1630-6464
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Publications

  1. 2023
  2. Published

    Novel Glass-Silicon Emitter Chip for Field Emission Applications

    Buchta, A. M., Kassner, A., Voß, J., Leopold, T., Petring, J., Diekmann, L., Dencker, F. & Wurz, M. C., 27 Jul 2023, 2023 IEEE 36th International Vacuum Nanoelectronics Conference (IVNC). p. 207-209 3 p. ( International Vacuum Nanoelectronics Conference).

    Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review

  3. Published

    Micro-integrated optical systems and qualification of adhesive integration technologies for cold atomic quantum sensors

    Christ, M., Stiekel, A., Stölmacker, C., Zimmermann, C., Kassner, A., Wurz, M. & Krutzik, M., 12 Jul 2023, International Conference on Space Optics, ICSO 2022. Minoglou, K., Karafolas, N. & Cugny, B. (eds.). SPIE, 1277718. (Proceedings of SPIE - The International Society for Optical Engineering; vol. 12777).

    Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review

  4. Published

    Miniaturized quantum systems for inertial measurement units

    Kassner, A., Diekmann, L., Künzler, C., Petring, J., Droese, N., Dencker, F., Heine, H., Abend, S., Gersemann, M., Rasel, E. M., Herr, W., Schubert, C. & Wurz, M. C., 2023, 2023 DGON Inertial Sensors and Systems (ISS). Hecker, P. (ed.). (International Symposium on Inertial Sensors and Systems).

    Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review

  5. 2022
  6. Published

    Nonevaporable getter-MEMS for generating UHV conditions in small volumina

    Diekmann, L. F., Kassner, A., Dencker, F. & Wurz, M. C., Sept 2022, In: Journal of Vacuum Science and Technology B. 40, 5, 054202.

    Research output: Contribution to journal › Article › Research › peer review

  7. Published

    Approaches for a Solely Electroless Metallization of Through-Glass Vias

    Zawacka, A. M., Prediger, M. S., Kassner, A., Dencker, F. E. & Wurz, M., 2022, 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC). p. 889-897 9 p. (Proceedings - Electronic Components and Technology Conference; vol. 2022-May).

    Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review

  8. 2021
  9. Published

    Sensorbauteil, Halbzeug, Verfahren zur Anbringung und zur Herstellung eines Sensorbauteils

    Dencker, F., Wurz, M. C., Maier, H. J., Ottermann, R., Kassner, A. & Klaas, D., 25 Feb 2021, IPC No. G01N 27/ 04 A I, Patent No. DE102019122623, Priority date 22 Aug 2019, Priority No. DE201910122623

    Research output: Patent

  10. Published

    Mikrotechnologische Fertigung von integrierten optischen Gittern mittels Lift-Off-Prozess für den Einsatz in Atominterferometern

    de Wall, S., Kassner, A., Dencker, F., Künzler, C., Diekmann, L. & Würz, M. C., 2021, MikroSystemTechnik Kongress 2021: Mikroelektronik, Mikrosystemtechnik und ihre Anwendungen - Innovative Produkte fur zukunftsfahige Markte, Proceedings. VDE Verlag GmbH, p. 466-468 3 p. (MikroSystemTechnik Kongress 2021: Mikroelektronik, Mikrosystemtechnik und ihre Anwendungen - Innovative Produkte fur zukunftsfahige Markte, Proceedings).

    Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review

  11. 2020
  12. Published

    Mikrotechnologische Fertigung von integrierten optischen Gittern für den Einsatz in Atominterferometern

    de Wall, S., Kassner, A., Dencker, F., Künzler, C., Heine, H., Herr, W., Christ, M., Krutzik, M., Rasel, E. M. & Wurz, M. C., 2020, GMM-Fb. 97: Mikro-Nano-Integration. Berlin: VDE Verlag GmbH, p. 56-59 4 p. (GMM-Fachberichte).

    Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review

  13. 2019
  14. Published

    Integrated atomic quantum technologies in demanding environments: development and qualification of miniaturized optical setups and integration technologies for UHV and space operation

    Christ, M., Kassner, A., Smol, R., Bawamia, A., Heine, H., Herr, W., Peters, A., Wurz, M. C., Rasel, E. M., Wicht, A. & Krutzik, M., 1 Dec 2019, In: CEAS Space Journal. 11, 4, p. 561-566 6 p.

    Research output: Contribution to journal › Article › Research › peer review

  15. Published

    Integrated Atomic Quantum Technologies in Demanding Environments: Development and Qualification of Miniaturized Optical Setups and Integration Technologies for UHV and Space Operation

    Christ, M., Kassner, A., Smol, R., Bawamia, A. I., Peters, A., Wurz, M. C., Rasel, E. M., Wicht, A. & Krutzik, M., 12 Jul 2019, International Conference on Space Optics, ICSO 2018: Proceedings. Sodnik, Z., Karafolas, N. & Cugny, B. (eds.). SPIE, 8 p. 1118088. (Proceedings of SPIE - The International Society for Optical Engineering; vol. 11180).

    Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review

  16. Published

    Atomchips mit integrierten optischen Gittern zur Erzeugung von Bose-Einstein-Kondensaten

    Kassner, A., Dencker, F., Künzler, C., Heine, H., Herr, W., Christ, M., Krutzik, M., Rasel, E. M. & Wurz, M., 2019, MikroSystemTechnik Kongress 2019: Mikroelektronik | MEMS-MOEMS | Systemintegration - Saulen der Digitalisierung und kunstlichen Intelligenz, Proceedings. VDE Verlag GmbH, p. 541-544 4 p.

    Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review

  17. Published

    Atom chip technology for use under UHV conditions

    Kassner, A., Rechel, M., Heine, H., Herr, W., Christ, M., Krutzik, M., Rasel, E. M. & Wurz, M. C., 2019, Smart Systems Integration 2019: International Conference and Exhibition on Integration Issues of Miniaturized Systems, SSI 2019. Otto, T. (ed.). VDE Verlag GmbH, p. 69-75 7 p.

    Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review

  18. 2018
  19. Published

    Next Generation Atom Chip Development

    Wurz, M. C., Papakonstantinou, A., Heine, H., Kassner, A., Rechel, M., Herr, W., Ertmer, W., Rasel, E. M. & Le Gonidec, M., 2018.

    Research output: Contribution to conference › Paper › Research

  20. 2017
  21. Published

    Atom-Chip based BEC sources for compact and transportable experiments

    Wurz, M. C., Heine, H., Matthias, J., Grove, N., Sahelgozin, M., Kassner, A., Rechel, M., Abend, S., Seidel, S. T., Herr, W., Wurz, M. C., Müller, J., Ertmer, W. & Rasel, E. M., 2017.

    Research output: Contribution to conference › Poster › Research

  22. 2016

  23. Magnetorelaxometry of few Fe3O4 nanoparticles at 77 K employing a self-compensated SQUID magnetometer

    Guillaume, A., Scholtyssek, J. M., Lak, A., Kassner, A., Ludwig, F. & Schilling, M., 15 Jun 2016, In: Journal of Magnetism and Magnetic Materials. 408, p. 46-50 5 p.

    Research output: Contribution to journal › Article › Research › peer review