Fabrication of a Low Profile Planar Transformer Using Molded Interconnect Device Technology

Publikation: Beitrag in Buch/Bericht/Sammelwerk/KonferenzbandAufsatz in KonferenzbandForschung

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OriginalspracheEnglisch
Titel des Sammelwerks2022 IEEE 9th Electronics System-Integration Technology Conference, ESTC 2022 - Proceedings
Herausgeber (Verlag)Institute of Electrical and Electronics Engineers Inc.
Seiten129-133
Seitenumfang5
ISBN (elektronisch)9781665489478
ISBN (Print)978-1-6654-8948-5
PublikationsstatusVeröffentlicht - Sept. 2022
Veranstaltung9th IEEE Electronics System-Integration Technology Conference, ESTC 2022 - Sibiu, Rumänien
Dauer: 13 Sept. 202216 Sept. 2022

Publikationsreihe

Name2022 IEEE 9th Electronics System-Integration Technology Conference, ESTC 2022 - Proceedings

Abstract

The need for high frequency charging technology for hybrid and electric cars as well as any kind of handheld devices is increasing steadily. Furthermore, frequencies of 500 kHz and above as well as new GaN converters allow a decrease in components size and footprint of the power devices. In this work a novel fabrication method for planar transformer with a height of less than 2.5 mm is presented. The transformers are produced inside a PEEK substrate by utilizing injection molding, laser structuring and electroless plating. The magnetic core consists of multiple laser-cut ferrite sheets. The trans-formers show results of up to 27 μH in a frequency range from 1 kHz to 1 MHz, which corresponds to 4.5 μH/cm2, and a coupling factor of over 95%. In comparison to wire wound transformers, multiple complex process as the winding itself can be replaced by less complex process like laser structuring and electroless plating. These processes allow the production in batch, which can lower the cost in an industrial production below of wire wound transformers.

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Fabrication of a Low Profile Planar Transformer Using Molded Interconnect Device Technology. / Bierwirth, Tim Nils; Dencker, Folke; Fischer, Eike Christian et al.
2022 IEEE 9th Electronics System-Integration Technology Conference, ESTC 2022 - Proceedings. Institute of Electrical and Electronics Engineers Inc., 2022. S. 129-133 (2022 IEEE 9th Electronics System-Integration Technology Conference, ESTC 2022 - Proceedings).

Publikation: Beitrag in Buch/Bericht/Sammelwerk/KonferenzbandAufsatz in KonferenzbandForschung

Bierwirth, TN, Dencker, F, Fischer, EC & Wurz, MC 2022, Fabrication of a Low Profile Planar Transformer Using Molded Interconnect Device Technology. in 2022 IEEE 9th Electronics System-Integration Technology Conference, ESTC 2022 - Proceedings. 2022 IEEE 9th Electronics System-Integration Technology Conference, ESTC 2022 - Proceedings, Institute of Electrical and Electronics Engineers Inc., S. 129-133, 9th IEEE Electronics System-Integration Technology Conference, ESTC 2022, Sibiu, Rumänien, 13 Sept. 2022. https://doi.org/10.1109/ESTC55720.2022.9939495
Bierwirth, T. N., Dencker, F., Fischer, E. C., & Wurz, M. C. (2022). Fabrication of a Low Profile Planar Transformer Using Molded Interconnect Device Technology. In 2022 IEEE 9th Electronics System-Integration Technology Conference, ESTC 2022 - Proceedings (S. 129-133). (2022 IEEE 9th Electronics System-Integration Technology Conference, ESTC 2022 - Proceedings). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/ESTC55720.2022.9939495
Bierwirth TN, Dencker F, Fischer EC, Wurz MC. Fabrication of a Low Profile Planar Transformer Using Molded Interconnect Device Technology. in 2022 IEEE 9th Electronics System-Integration Technology Conference, ESTC 2022 - Proceedings. Institute of Electrical and Electronics Engineers Inc. 2022. S. 129-133. (2022 IEEE 9th Electronics System-Integration Technology Conference, ESTC 2022 - Proceedings). doi: 10.1109/ESTC55720.2022.9939495
Bierwirth, Tim Nils ; Dencker, Folke ; Fischer, Eike Christian et al. / Fabrication of a Low Profile Planar Transformer Using Molded Interconnect Device Technology. 2022 IEEE 9th Electronics System-Integration Technology Conference, ESTC 2022 - Proceedings. Institute of Electrical and Electronics Engineers Inc., 2022. S. 129-133 (2022 IEEE 9th Electronics System-Integration Technology Conference, ESTC 2022 - Proceedings).
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