Details
| Originalsprache | Englisch |
|---|---|
| Titel des Sammelwerks | 2025 IEEE International Workshop on Integrated Power Packaging (IWIPP) |
| Auflage | 2025 |
| ISBN (elektronisch) | 979-8-3315-3360-1 |
| Publikationsstatus | Veröffentlicht - 8 Apr. 2025 |
| Veranstaltung | 2025 IEEE International Workshop on Integrated Power Packaging, IWIPP 2025 - University of Alabama, Tuscaloosa, USA / Vereinigte Staaten Dauer: 8 Apr. 2025 → 10 Apr. 2025 |
Publikationsreihe
| Name | Proceedings of the IEEE International Workshop on Integrated Power Packaging, IWIPP |
|---|---|
| ISSN (Print) | 2834-8362 |
Abstract
A 3D glass packaging solution has been developed as a power brick module for high-efficiency, high-power density 48 V DC-DC converters, which are essential for applications such as data centers, telecommunications, and autonomous driving. As compute power demands increase, transitioning from 12 V to 48 V architectures significantly reduces power distribution losses. By leveraging 3D heterogeneous integration, the presented design features vertical stacking of passive and active components, including an isolated supply, a digital signal isolator and a GaN half-bridge, within a modular power brick. The top placement allows for various cooling options for the thermal management, as the half-bridge is designed for high currents up to 35 A. The package employs three precisely structured glass substrates, utilizing selective laser-induced etching and laser ablation to form complex glass geometries and conductive paths. The electrical functionality of the circuit is validated in an 48 V application with an isolated ground. With the 3D integration in a glass-based package, a footprint reduction of 56% compared to a traditional planar PCB implementation is achieved. These advancements underscore the potential of glass substrates for enhancing power density and facilitating the integration of glass packages in future 48 V applications.
ASJC Scopus Sachgebiete
- Energie (insg.)
- Energieanlagenbau und Kraftwerkstechnik
- Ingenieurwesen (insg.)
- Elektrotechnik und Elektronik
- Werkstoffwissenschaften (insg.)
- Elektronische, optische und magnetische Materialien
Zitieren
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- BibTex
- RIS
2025 IEEE International Workshop on Integrated Power Packaging (IWIPP). 2025. Aufl. 2025. (Proceedings of the IEEE International Workshop on Integrated Power Packaging, IWIPP).
Publikation: Beitrag in Buch/Bericht/Sammelwerk/Konferenzband › Aufsatz in Konferenzband › Forschung › Peer-Review
}
TY - GEN
T1 - Miniaturized 3D Glass Package for High-Efficiency and High-Power Density 48V DC-DC Converters
AU - Koch, Jannik
AU - Winkler, Joseph
AU - Wicht, Bernhard
AU - Wurz, Marc Christopher
N1 - Publisher Copyright: © 2025 IEEE.
PY - 2025/4/8
Y1 - 2025/4/8
N2 - A 3D glass packaging solution has been developed as a power brick module for high-efficiency, high-power density 48 V DC-DC converters, which are essential for applications such as data centers, telecommunications, and autonomous driving. As compute power demands increase, transitioning from 12 V to 48 V architectures significantly reduces power distribution losses. By leveraging 3D heterogeneous integration, the presented design features vertical stacking of passive and active components, including an isolated supply, a digital signal isolator and a GaN half-bridge, within a modular power brick. The top placement allows for various cooling options for the thermal management, as the half-bridge is designed for high currents up to 35 A. The package employs three precisely structured glass substrates, utilizing selective laser-induced etching and laser ablation to form complex glass geometries and conductive paths. The electrical functionality of the circuit is validated in an 48 V application with an isolated ground. With the 3D integration in a glass-based package, a footprint reduction of 56% compared to a traditional planar PCB implementation is achieved. These advancements underscore the potential of glass substrates for enhancing power density and facilitating the integration of glass packages in future 48 V applications.
AB - A 3D glass packaging solution has been developed as a power brick module for high-efficiency, high-power density 48 V DC-DC converters, which are essential for applications such as data centers, telecommunications, and autonomous driving. As compute power demands increase, transitioning from 12 V to 48 V architectures significantly reduces power distribution losses. By leveraging 3D heterogeneous integration, the presented design features vertical stacking of passive and active components, including an isolated supply, a digital signal isolator and a GaN half-bridge, within a modular power brick. The top placement allows for various cooling options for the thermal management, as the half-bridge is designed for high currents up to 35 A. The package employs three precisely structured glass substrates, utilizing selective laser-induced etching and laser ablation to form complex glass geometries and conductive paths. The electrical functionality of the circuit is validated in an 48 V application with an isolated ground. With the 3D integration in a glass-based package, a footprint reduction of 56% compared to a traditional planar PCB implementation is achieved. These advancements underscore the potential of glass substrates for enhancing power density and facilitating the integration of glass packages in future 48 V applications.
KW - 3D integration
KW - 48 V
KW - Assembly
KW - DC-DC Converter
KW - Discrete Components
KW - Glass
KW - Packaging
UR - http://www.scopus.com/inward/record.url?scp=105006791705&partnerID=8YFLogxK
U2 - 10.1109/IWIPP61784.2025.10971568
DO - 10.1109/IWIPP61784.2025.10971568
M3 - Conference contribution
AN - SCOPUS:105006791705
SN - 979-8-3315-3361-8
T3 - Proceedings of the IEEE International Workshop on Integrated Power Packaging, IWIPP
BT - 2025 IEEE International Workshop on Integrated Power Packaging (IWIPP)
T2 - 2025 IEEE International Workshop on Integrated Power Packaging, IWIPP 2025
Y2 - 8 April 2025 through 10 April 2025
ER -