Details
| Titel in Übersetzung | AMR sensors on flexible substrate for the measurement of deformations of a hardmagnetic particle-elastomer composite |
|---|---|
| Originalsprache | Deutsch |
| Titel des Sammelwerks | MikroSystemTechnik Kongress 2019 |
| Untertitel | Mikroelektronik | MEMS-MOEMS | Systemintegration - Saulen der Digitalisierung und kunstlichen Intelligenz, Proceedings |
| Herausgeber (Verlag) | VDE Verlag GmbH |
| Seiten | 111-114 |
| Seitenumfang | 4 |
| Auflage | 1. |
| ISBN (elektronisch) | 9783800751297 |
| ISBN (Print) | 9783800750900 |
| Publikationsstatus | Veröffentlicht - 2019 |
| Veranstaltung | MikroSystemTechnik Kongress 2019: Mikroelektronik, MEMS-MOEMS, Systemintegration - Saulen der Digitalisierung und kunstlichen Intelligenz - Berlin, Deutschland Dauer: 28 Okt. 2019 → 30 Okt. 2019 |
Abstract
Measurement techniques for force and mechanical pressure measurements makes use of several physical principles, including capacity, piezoelectricity, and optical systems, but not yet of magnetoresistivity. Within the advancing development of a previously studied demonstrator system, magnetoresistive sensors were manufactured and characterized in an array embedded in a flexible substrate and optimization parameters were identified. The sensor concept includes a composite of hard magnetic particles and elastomer, whose magnetic behavior was investigated in dependence of the filling degree and the composition ratio of base agent to curing agent. Based on the results, the concept can be adjusted toward application-based properties and can be further investigated.
ASJC Scopus Sachgebiete
- Informatik (insg.)
- Hardware und Architektur
- Ingenieurwesen (insg.)
- Elektrotechnik und Elektronik
- Ingenieurwesen (insg.)
- Steuerungs- und Systemtechnik
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- BibTex
- RIS
MikroSystemTechnik Kongress 2019: Mikroelektronik | MEMS-MOEMS | Systemintegration - Saulen der Digitalisierung und kunstlichen Intelligenz, Proceedings. 1. Aufl. VDE Verlag GmbH, 2019. S. 111-114.
Publikation: Beitrag in Buch/Bericht/Sammelwerk/Konferenzband › Aufsatz in Konferenzband › Forschung › Peer-Review
}
TY - GEN
T1 - AMR Sensoren auf flexiblem substrat zur Messung von Verformungen eines hartmagnetischen Partikel-Elastomerverbunds
AU - Prediger, Maren S.
AU - Wittek, Christian Gabriel R.
AU - Owiss, Ghadeer
AU - Wurz, Marc Christopher
PY - 2019
Y1 - 2019
N2 - Measurement techniques for force and mechanical pressure measurements makes use of several physical principles, including capacity, piezoelectricity, and optical systems, but not yet of magnetoresistivity. Within the advancing development of a previously studied demonstrator system, magnetoresistive sensors were manufactured and characterized in an array embedded in a flexible substrate and optimization parameters were identified. The sensor concept includes a composite of hard magnetic particles and elastomer, whose magnetic behavior was investigated in dependence of the filling degree and the composition ratio of base agent to curing agent. Based on the results, the concept can be adjusted toward application-based properties and can be further investigated.
AB - Measurement techniques for force and mechanical pressure measurements makes use of several physical principles, including capacity, piezoelectricity, and optical systems, but not yet of magnetoresistivity. Within the advancing development of a previously studied demonstrator system, magnetoresistive sensors were manufactured and characterized in an array embedded in a flexible substrate and optimization parameters were identified. The sensor concept includes a composite of hard magnetic particles and elastomer, whose magnetic behavior was investigated in dependence of the filling degree and the composition ratio of base agent to curing agent. Based on the results, the concept can be adjusted toward application-based properties and can be further investigated.
UR - http://www.scopus.com/inward/record.url?scp=85096778039&partnerID=8YFLogxK
M3 - Aufsatz in Konferenzband
AN - SCOPUS:85096778039
SN - 9783800750900
SP - 111
EP - 114
BT - MikroSystemTechnik Kongress 2019
PB - VDE Verlag GmbH
T2 - MikroSystemTechnik Kongress 2019
Y2 - 28 October 2019 through 30 October 2019
ER -