Details
| Originalsprache | Englisch |
|---|---|
| Titel des Sammelwerks | 2022 IEEE International Solid-State Circuits Conference, ISSCC 2022 |
| Herausgeber (Verlag) | Institute of Electrical and Electronics Engineers Inc. |
| Seiten | 230-232 |
| Seitenumfang | 3 |
| ISBN (elektronisch) | 9781665428002 |
| ISBN (Print) | 978-1-6654-2801-9 |
| Publikationsstatus | Veröffentlicht - 2022 |
| Veranstaltung | 2022 IEEE International Solid-State Circuits Conference, ISSCC 2022 - San Francisco, USA / Vereinigte Staaten Dauer: 20 Feb. 2022 → 26 Feb. 2022 |
Publikationsreihe
| Name | Digest of Technical Papers - IEEE International Solid-State Circuits Conference |
|---|---|
| Band | 2022-February |
| ISSN (Print) | 0193-6530 |
Abstract
This paper presents an efficient and compact offline chip-scale power supply in 0.18m high-voltage (HV) silicon-on-insulator (SOI) technology, suitable to supply IoT nodes, sensors, RF transceivers, LED strings, etc. from the 120/230V AC mains (Fig. 14.2.1). Main innovations include a voltage-interval-based dual-mode AC-DC conversion and an active zero-crossing buffer in the AC interface, which significantly reduces the size of the HV buffer capacitor Cb and enables on-chip integration. The converter supports both AC-DC and DC-DC conversion with an input voltage range of 15 to 325V.
ASJC Scopus Sachgebiete
- Werkstoffwissenschaften (insg.)
- Elektronische, optische und magnetische Materialien
- Ingenieurwesen (insg.)
- Elektrotechnik und Elektronik
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- BibTex
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2022 IEEE International Solid-State Circuits Conference, ISSCC 2022. Institute of Electrical and Electronics Engineers Inc., 2022. S. 230-232 (Digest of Technical Papers - IEEE International Solid-State Circuits Conference; Band 2022-February).
Publikation: Beitrag in Buch/Bericht/Sammelwerk/Konferenzband › Aufsatz in Konferenzband › Forschung › Peer-Review
}
TY - GEN
T1 - A 110V/230V 0.3W Offline Chip-Scale Power Supply with Integrated Active Zero-Crossing Buffer and Voltage-Interval-Based Dual-Mode Control
AU - Rindfleisch, Christoph
AU - Wicht, Bernhard
N1 - Funding Information: The authors would like to thank X-FAB for partially funding the IC fabrication.
PY - 2022
Y1 - 2022
N2 - This paper presents an efficient and compact offline chip-scale power supply in 0.18m high-voltage (HV) silicon-on-insulator (SOI) technology, suitable to supply IoT nodes, sensors, RF transceivers, LED strings, etc. from the 120/230V AC mains (Fig. 14.2.1). Main innovations include a voltage-interval-based dual-mode AC-DC conversion and an active zero-crossing buffer in the AC interface, which significantly reduces the size of the HV buffer capacitor Cb and enables on-chip integration. The converter supports both AC-DC and DC-DC conversion with an input voltage range of 15 to 325V.
AB - This paper presents an efficient and compact offline chip-scale power supply in 0.18m high-voltage (HV) silicon-on-insulator (SOI) technology, suitable to supply IoT nodes, sensors, RF transceivers, LED strings, etc. from the 120/230V AC mains (Fig. 14.2.1). Main innovations include a voltage-interval-based dual-mode AC-DC conversion and an active zero-crossing buffer in the AC interface, which significantly reduces the size of the HV buffer capacitor Cb and enables on-chip integration. The converter supports both AC-DC and DC-DC conversion with an input voltage range of 15 to 325V.
UR - http://www.scopus.com/inward/record.url?scp=85128287500&partnerID=8YFLogxK
U2 - 10.1109/ISSCC42614.2022.9731692
DO - 10.1109/ISSCC42614.2022.9731692
M3 - Conference contribution
AN - SCOPUS:85128287500
SN - 978-1-6654-2801-9
T3 - Digest of Technical Papers - IEEE International Solid-State Circuits Conference
SP - 230
EP - 232
BT - 2022 IEEE International Solid-State Circuits Conference, ISSCC 2022
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 2022 IEEE International Solid-State Circuits Conference, ISSCC 2022
Y2 - 20 February 2022 through 26 February 2022
ER -