Loading [MathJax]/extensions/tex2jax.js

Lignin as a Climate-Friendly Raw Material and its Possible Use in Microelectronic

Research output: Chapter in book/report/conference proceedingConference contributionResearchpeer review

Authors

Research Organisations

Details

Original languageEnglish
Title of host publication2025 Pan Pacific Strategic Electronics Symposium, Pan Pacific 2025
PublisherInstitute of Electrical and Electronics Engineers Inc.
ISBN (electronic)9781944543358
ISBN (print)979-8-3315-1198-2
Publication statusPublished - 27 Jan 2025
Event2025 Pan Pacific Strategic Electronics Symposium, Pan Pacific 2025 - Maui, United States
Duration: 27 Jan 202530 Jan 2025

Abstract

Lignin is one of the most common biopolymers in nature and the second most abundant natural polymer on earth. It is an aromatic biomacromolecule which offers huge potential as raw material for biopolymers. In the paper, applications for lignin and other sustainable materials are described. The occurrence in the different plants as well as the application fields and producers for lignin as a biocompatible material are mentioned. Lignin based epoxy PCB boards were manufactured first from IBM in 2001. Furthermore, flexible electronic materials as well as transistors were manufactured using lignin. At the TU Dresden, completely biodegradable nature inspirited circuit boards have been developed. These called 'Leaftronics' use the natural structure of leaves to produce electronic substrates. Another new biodegradable alternative to FR-4 is the patented Soluboard® from the British start-up Jiva Materials. A vertical sandwich structure of Mo/lignin and PVA film/A forming a synaptic transistor array with lignin as dielectric was described as well. A collection of material data for a possible simulation of the lignin-based components are given.

Keywords

    Biocompatibility, Biopolymer, Lignin, PCB

ASJC Scopus subject areas

Cite this

Lignin as a Climate-Friendly Raw Material and its Possible Use in Microelectronic. / Weide-Zaage, Kirsten; Lühring, Beatrice.
2025 Pan Pacific Strategic Electronics Symposium, Pan Pacific 2025. Institute of Electrical and Electronics Engineers Inc., 2025.

Research output: Chapter in book/report/conference proceedingConference contributionResearchpeer review

Weide-Zaage, K & Lühring, B 2025, Lignin as a Climate-Friendly Raw Material and its Possible Use in Microelectronic. in 2025 Pan Pacific Strategic Electronics Symposium, Pan Pacific 2025. Institute of Electrical and Electronics Engineers Inc., 2025 Pan Pacific Strategic Electronics Symposium, Pan Pacific 2025, Maui, Hawaii, United States, 27 Jan 2025. https://doi.org/10.23919/PanPacific65826.2025.10908943
Weide-Zaage, K., & Lühring, B. (2025). Lignin as a Climate-Friendly Raw Material and its Possible Use in Microelectronic. In 2025 Pan Pacific Strategic Electronics Symposium, Pan Pacific 2025 Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.23919/PanPacific65826.2025.10908943
Weide-Zaage K, Lühring B. Lignin as a Climate-Friendly Raw Material and its Possible Use in Microelectronic. In 2025 Pan Pacific Strategic Electronics Symposium, Pan Pacific 2025. Institute of Electrical and Electronics Engineers Inc. 2025 doi: 10.23919/PanPacific65826.2025.10908943
Weide-Zaage, Kirsten ; Lühring, Beatrice. / Lignin as a Climate-Friendly Raw Material and its Possible Use in Microelectronic. 2025 Pan Pacific Strategic Electronics Symposium, Pan Pacific 2025. Institute of Electrical and Electronics Engineers Inc., 2025.
Download
@inproceedings{025f65a8f7e044bd825672886c648510,
title = "Lignin as a Climate-Friendly Raw Material and its Possible Use in Microelectronic",
abstract = "Lignin is one of the most common biopolymers in nature and the second most abundant natural polymer on earth. It is an aromatic biomacromolecule which offers huge potential as raw material for biopolymers. In the paper, applications for lignin and other sustainable materials are described. The occurrence in the different plants as well as the application fields and producers for lignin as a biocompatible material are mentioned. Lignin based epoxy PCB boards were manufactured first from IBM in 2001. Furthermore, flexible electronic materials as well as transistors were manufactured using lignin. At the TU Dresden, completely biodegradable nature inspirited circuit boards have been developed. These called 'Leaftronics' use the natural structure of leaves to produce electronic substrates. Another new biodegradable alternative to FR-4 is the patented Soluboard{\textregistered} from the British start-up Jiva Materials. A vertical sandwich structure of Mo/lignin and PVA film/A forming a synaptic transistor array with lignin as dielectric was described as well. A collection of material data for a possible simulation of the lignin-based components are given.",
keywords = "Biocompatibility, Biopolymer, Lignin, PCB",
author = "Kirsten Weide-Zaage and Beatrice L{\"u}hring",
note = "Publisher Copyright: {\textcopyright} 2025 SMTA.; 2025 Pan Pacific Strategic Electronics Symposium, Pan Pacific 2025, Pan Pacific 2025 ; Conference date: 27-01-2025 Through 30-01-2025",
year = "2025",
month = jan,
day = "27",
doi = "10.23919/PanPacific65826.2025.10908943",
language = "English",
isbn = "979-8-3315-1198-2",
booktitle = "2025 Pan Pacific Strategic Electronics Symposium, Pan Pacific 2025",
publisher = "Institute of Electrical and Electronics Engineers Inc.",
address = "United States",

}

Download

TY - GEN

T1 - Lignin as a Climate-Friendly Raw Material and its Possible Use in Microelectronic

AU - Weide-Zaage, Kirsten

AU - Lühring, Beatrice

N1 - Publisher Copyright: © 2025 SMTA.

PY - 2025/1/27

Y1 - 2025/1/27

N2 - Lignin is one of the most common biopolymers in nature and the second most abundant natural polymer on earth. It is an aromatic biomacromolecule which offers huge potential as raw material for biopolymers. In the paper, applications for lignin and other sustainable materials are described. The occurrence in the different plants as well as the application fields and producers for lignin as a biocompatible material are mentioned. Lignin based epoxy PCB boards were manufactured first from IBM in 2001. Furthermore, flexible electronic materials as well as transistors were manufactured using lignin. At the TU Dresden, completely biodegradable nature inspirited circuit boards have been developed. These called 'Leaftronics' use the natural structure of leaves to produce electronic substrates. Another new biodegradable alternative to FR-4 is the patented Soluboard® from the British start-up Jiva Materials. A vertical sandwich structure of Mo/lignin and PVA film/A forming a synaptic transistor array with lignin as dielectric was described as well. A collection of material data for a possible simulation of the lignin-based components are given.

AB - Lignin is one of the most common biopolymers in nature and the second most abundant natural polymer on earth. It is an aromatic biomacromolecule which offers huge potential as raw material for biopolymers. In the paper, applications for lignin and other sustainable materials are described. The occurrence in the different plants as well as the application fields and producers for lignin as a biocompatible material are mentioned. Lignin based epoxy PCB boards were manufactured first from IBM in 2001. Furthermore, flexible electronic materials as well as transistors were manufactured using lignin. At the TU Dresden, completely biodegradable nature inspirited circuit boards have been developed. These called 'Leaftronics' use the natural structure of leaves to produce electronic substrates. Another new biodegradable alternative to FR-4 is the patented Soluboard® from the British start-up Jiva Materials. A vertical sandwich structure of Mo/lignin and PVA film/A forming a synaptic transistor array with lignin as dielectric was described as well. A collection of material data for a possible simulation of the lignin-based components are given.

KW - Biocompatibility

KW - Biopolymer

KW - Lignin

KW - PCB

UR - http://www.scopus.com/inward/record.url?scp=105000713384&partnerID=8YFLogxK

U2 - 10.23919/PanPacific65826.2025.10908943

DO - 10.23919/PanPacific65826.2025.10908943

M3 - Conference contribution

AN - SCOPUS:105000713384

SN - 979-8-3315-1198-2

BT - 2025 Pan Pacific Strategic Electronics Symposium, Pan Pacific 2025

PB - Institute of Electrical and Electronics Engineers Inc.

T2 - 2025 Pan Pacific Strategic Electronics Symposium, Pan Pacific 2025

Y2 - 27 January 2025 through 30 January 2025

ER -

By the same author(s)