Details
| Original language | English |
|---|---|
| Title of host publication | MikroSystemTechnik Kongress 2021 |
| Subtitle of host publication | Mikroelektronik, Mikrosystemtechnik und ihre Anwendungen - Innovative Produkte fur zukunftsfahige Markte, Proceedings |
| Publisher | VDE Verlag GmbH |
| Pages | 27-30 |
| Number of pages | 4 |
| ISBN (Electronic) | 9783800756575 |
| Publication status | Published - 2021 |
| Event | MikroSystemTechnik Congress 2021: Microelectronics, Microsystems Engineering and their Applications - Innovative Products for Future-Oriented Markets - Stuttgart-Ludwigsburg, Germany Duration: 8 Nov 2021 → 10 Nov 2021 |
Abstract
Equipping large industrial components with metrological thin film sensors is challenging due to the size of the component, the locations of the sensor placement and the working environment, and is associated with considerable effort. A transfer process for conductive structures using polyvinyl alcohol (PVAL) as a transfer substrate was developed at the IMPT [2, 3]. To extend the existing range of applications to include conductive, functional metallic materials, the transfer of metallic thin films to metal surfaces is being investigated using two different joining strategies: on the one hand, bonding via self-assembling (SAMs) monolayers in combination with sol-gels and, on the other hand, via inorganic high-temperature adhesives.
ASJC Scopus subject areas
- Computer Science(all)
- Hardware and Architecture
- Engineering(all)
- Electrical and Electronic Engineering
- Materials Science(all)
- Electronic, Optical and Magnetic Materials
Cite this
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MikroSystemTechnik Kongress 2021: Mikroelektronik, Mikrosystemtechnik und ihre Anwendungen - Innovative Produkte fur zukunftsfahige Markte, Proceedings. VDE Verlag GmbH, 2021. p. 27-30.
Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review
}
TY - GEN
T1 - Film transfer from thin films to metal surfaces using sol-gels, self-assembling monolayers and water glass
AU - Basten, R.G.
AU - Zawacka, A.M.
AU - Bengsch, S.
AU - Prediger, M.S.
AU - Wurz, M.C.
PY - 2021
Y1 - 2021
N2 - Equipping large industrial components with metrological thin film sensors is challenging due to the size of the component, the locations of the sensor placement and the working environment, and is associated with considerable effort. A transfer process for conductive structures using polyvinyl alcohol (PVAL) as a transfer substrate was developed at the IMPT [2, 3]. To extend the existing range of applications to include conductive, functional metallic materials, the transfer of metallic thin films to metal surfaces is being investigated using two different joining strategies: on the one hand, bonding via self-assembling (SAMs) monolayers in combination with sol-gels and, on the other hand, via inorganic high-temperature adhesives.
AB - Equipping large industrial components with metrological thin film sensors is challenging due to the size of the component, the locations of the sensor placement and the working environment, and is associated with considerable effort. A transfer process for conductive structures using polyvinyl alcohol (PVAL) as a transfer substrate was developed at the IMPT [2, 3]. To extend the existing range of applications to include conductive, functional metallic materials, the transfer of metallic thin films to metal surfaces is being investigated using two different joining strategies: on the one hand, bonding via self-assembling (SAMs) monolayers in combination with sol-gels and, on the other hand, via inorganic high-temperature adhesives.
UR - http://www.scopus.com/inward/record.url?scp=85125189450&partnerID=8YFLogxK
M3 - Conference contribution
AN - SCOPUS:85125189450
SP - 27
EP - 30
BT - MikroSystemTechnik Kongress 2021
PB - VDE Verlag GmbH
T2 - MikroSystemTechnik Congress 2021
Y2 - 8 November 2021 through 10 November 2021
ER -