A coupled finite element–boundary element method for transient elastic dynamic analysis of electronic packaging structures

Research output: Contribution to journalArticleResearchpeer review

Authors

  • Yanpeng Gong
  • Yida He
  • Han Hu
  • Xiaoying Zhuang
  • Fei Qin
  • Hao Xu
  • Timon Rabczuk

Research Organisations

External Research Organisations

  • Beijing University of Technology
  • Tongji University
  • Bauhaus-Universität Weimar
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Details

Original languageEnglish
Article number119500
Number of pages15
JournalEngineering structures
Volume326
Early online date21 Dec 2024
Publication statusPublished - 1 Mar 2025

Abstract

Dynamic loading is a critical factor influencing the reliability of electronic packaging, necessitating the development of efficient and accurate numerical methods tailored for studying electronic packaging reliability. This paper presents a coupled finite element–boundary element approach suitable for analyzing transient elastic dynamic response problems in electronic packaging structures. The core concept involves integrating the boundary element method into the finite element framework, thereby reducing the number of elements required for the finite element analysis of intricate electronic packaging geometries. Additionally, to leverage the powerful pre-processing and post-processing capabilities offered by commercial finite element software, the boundary element method is integrated into Abaqus, forming a finite element–boundary element coupling algorithm within this platform. In the numerical analysis process, the structure under investigation is first partitioned into finite element and boundary element domains according to its geometric characteristics and material properties. These distinct domains are then modeled separately within Abaqus, where material properties and element types are assigned. Compared to traditional numerical analysis methodologies for electronic packaging structures, this coupled algorithm fully capitalizes on the robust pre-processing and secondary development capabilities of Abaqus, effectively combining the advantages of both the finite element and boundary element methods while reducing the number of elements required in the finite element analysis. Numerical examples demonstrate the efficacy of this coupled algorithm in analyzing dynamic problems prevalent in electronic packaging structures.

Keywords

    Abaqus implementation, Electronic packaging, FE–BE coupling method, Transient elastodynamics problem

ASJC Scopus subject areas

Cite this

A coupled finite element–boundary element method for transient elastic dynamic analysis of electronic packaging structures. / Gong, Yanpeng; He, Yida; Hu, Han et al.
In: Engineering structures, Vol. 326, 119500, 01.03.2025.

Research output: Contribution to journalArticleResearchpeer review

Gong Y, He Y, Hu H, Zhuang X, Qin F, Xu H et al. A coupled finite element–boundary element method for transient elastic dynamic analysis of electronic packaging structures. Engineering structures. 2025 Mar 1;326:119500. Epub 2024 Dec 21. doi: 10.1016/j.engstruct.2024.119500
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