Details
| Originalsprache | Englisch |
|---|---|
| Aufsatznummer | 119500 |
| Seitenumfang | 15 |
| Fachzeitschrift | Engineering structures |
| Jahrgang | 326 |
| Frühes Online-Datum | 21 Dez. 2024 |
| Publikationsstatus | Elektronisch veröffentlicht (E-Pub) - 21 Dez. 2024 |
Abstract
Dynamic loading is a critical factor influencing the reliability of electronic packaging, necessitating the development of efficient and accurate numerical methods tailored for studying electronic packaging reliability. This paper presents a coupled finite element–boundary element approach suitable for analyzing transient elastic dynamic response problems in electronic packaging structures. The core concept involves integrating the boundary element method into the finite element framework, thereby reducing the number of elements required for the finite element analysis of intricate electronic packaging geometries. Additionally, to leverage the powerful pre-processing and post-processing capabilities offered by commercial finite element software, the boundary element method is integrated into Abaqus, forming a finite element–boundary element coupling algorithm within this platform. In the numerical analysis process, the structure under investigation is first partitioned into finite element and boundary element domains according to its geometric characteristics and material properties. These distinct domains are then modeled separately within Abaqus, where material properties and element types are assigned. Compared to traditional numerical analysis methodologies for electronic packaging structures, this coupled algorithm fully capitalizes on the robust pre-processing and secondary development capabilities of Abaqus, effectively combining the advantages of both the finite element and boundary element methods while reducing the number of elements required in the finite element analysis. Numerical examples demonstrate the efficacy of this coupled algorithm in analyzing dynamic problems prevalent in electronic packaging structures.
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in: Engineering structures, Jahrgang 326, 119500, 01.03.2025.
Publikation: Beitrag in Fachzeitschrift › Artikel › Forschung › Peer-Review
}
TY - JOUR
T1 - A coupled finite element–boundary element method for transient elastic dynamic analysis of electronic packaging structures
AU - Gong, Yanpeng
AU - He, Yida
AU - Hu, Han
AU - Zhuang, Xiaoying
AU - Qin, Fei
AU - Xu, Hao
AU - Rabczuk, Timon
N1 - Publisher Copyright: © 2024 Elsevier Ltd
PY - 2024/12/21
Y1 - 2024/12/21
N2 - Dynamic loading is a critical factor influencing the reliability of electronic packaging, necessitating the development of efficient and accurate numerical methods tailored for studying electronic packaging reliability. This paper presents a coupled finite element–boundary element approach suitable for analyzing transient elastic dynamic response problems in electronic packaging structures. The core concept involves integrating the boundary element method into the finite element framework, thereby reducing the number of elements required for the finite element analysis of intricate electronic packaging geometries. Additionally, to leverage the powerful pre-processing and post-processing capabilities offered by commercial finite element software, the boundary element method is integrated into Abaqus, forming a finite element–boundary element coupling algorithm within this platform. In the numerical analysis process, the structure under investigation is first partitioned into finite element and boundary element domains according to its geometric characteristics and material properties. These distinct domains are then modeled separately within Abaqus, where material properties and element types are assigned. Compared to traditional numerical analysis methodologies for electronic packaging structures, this coupled algorithm fully capitalizes on the robust pre-processing and secondary development capabilities of Abaqus, effectively combining the advantages of both the finite element and boundary element methods while reducing the number of elements required in the finite element analysis. Numerical examples demonstrate the efficacy of this coupled algorithm in analyzing dynamic problems prevalent in electronic packaging structures.
AB - Dynamic loading is a critical factor influencing the reliability of electronic packaging, necessitating the development of efficient and accurate numerical methods tailored for studying electronic packaging reliability. This paper presents a coupled finite element–boundary element approach suitable for analyzing transient elastic dynamic response problems in electronic packaging structures. The core concept involves integrating the boundary element method into the finite element framework, thereby reducing the number of elements required for the finite element analysis of intricate electronic packaging geometries. Additionally, to leverage the powerful pre-processing and post-processing capabilities offered by commercial finite element software, the boundary element method is integrated into Abaqus, forming a finite element–boundary element coupling algorithm within this platform. In the numerical analysis process, the structure under investigation is first partitioned into finite element and boundary element domains according to its geometric characteristics and material properties. These distinct domains are then modeled separately within Abaqus, where material properties and element types are assigned. Compared to traditional numerical analysis methodologies for electronic packaging structures, this coupled algorithm fully capitalizes on the robust pre-processing and secondary development capabilities of Abaqus, effectively combining the advantages of both the finite element and boundary element methods while reducing the number of elements required in the finite element analysis. Numerical examples demonstrate the efficacy of this coupled algorithm in analyzing dynamic problems prevalent in electronic packaging structures.
KW - Abaqus implementation
KW - Electronic packaging
KW - FE–BE coupling method
KW - Transient elastodynamics problem
UR - http://www.scopus.com/inward/record.url?scp=85212589046&partnerID=8YFLogxK
U2 - 10.1016/j.engstruct.2024.119500
DO - 10.1016/j.engstruct.2024.119500
M3 - Article
AN - SCOPUS:85212589046
VL - 326
JO - Engineering structures
JF - Engineering structures
SN - 0141-0296
M1 - 119500
ER -