Verification of Hygrothermal Simulations Using Silicone Encapsulated Climate Sensors in Continuously Operated IGBT Power Modules

Publikation: Beitrag in Buch/Bericht/Sammelwerk/KonferenzbandAufsatz in KonferenzbandForschungPeer-Review

Autoren

  • Soren Frohling
  • Benedikt Kostka
  • Johannes C. Wenzel
  • Katharina Fischer
  • Michael Hanf
  • Christian Zorn
  • Kirsten Dehning
  • Stefan Zimmermann
  • Nando Kaminski
  • Axel Mertens
  • Jan-Hendrik Peters

Externe Organisationen

  • Fraunhofer-Institut für Windenergiesysteme (IWES)
  • Universität Bremen
Forschungs-netzwerk anzeigen

Details

OriginalspracheEnglisch
Titel des SammelwerksICPE 2023-ECCE Asia
Untertitel11th International Conference on Power Electronics - Green World with Power Electronics
Herausgeber (Verlag)Institute of Electrical and Electronics Engineers Inc.
Seiten1361-1369
Seitenumfang9
ISBN (elektronisch)9788957083505
ISBN (Print)979-8-3503-3620-7
PublikationsstatusVeröffentlicht - 2023
Veranstaltung11th International Conference on Power Electronics - ECCE Asia, ICPE 2023-ECCE Asia - Jeju, Südkorea
Dauer: 22 Mai 202325 Mai 2023

Publikationsreihe

NameInternational Conference on Power Electronics
ISSN (Print)2150-6078
ISSN (elektronisch)2150-6086

Abstract

This paper presents measurements of temperature and humidity conditions in a power module during continuous pulse-width modulation (PWM) operation. Based on the results, a developed hygrothermal simulation model is validated. This can subsequently be used later to identify critical operating conditions which can create lifetime-reducing microclimates on the chip level. This approach enables the implementation of a condition monitoring system based on the microclimate inside the power module.

ASJC Scopus Sachgebiete

Zitieren

Verification of Hygrothermal Simulations Using Silicone Encapsulated Climate Sensors in Continuously Operated IGBT Power Modules. / Frohling, Soren; Kostka, Benedikt; Wenzel, Johannes C. et al.
ICPE 2023-ECCE Asia : 11th International Conference on Power Electronics - Green World with Power Electronics. Institute of Electrical and Electronics Engineers Inc., 2023. S. 1361-1369 (International Conference on Power Electronics).

Publikation: Beitrag in Buch/Bericht/Sammelwerk/KonferenzbandAufsatz in KonferenzbandForschungPeer-Review

Frohling, S, Kostka, B, Wenzel, JC, Fischer, K, Hanf, M, Zorn, C, Dehning, K, Zimmermann, S, Kaminski, N, Mertens, A & Peters, J-H 2023, Verification of Hygrothermal Simulations Using Silicone Encapsulated Climate Sensors in Continuously Operated IGBT Power Modules. in ICPE 2023-ECCE Asia : 11th International Conference on Power Electronics - Green World with Power Electronics. International Conference on Power Electronics, Institute of Electrical and Electronics Engineers Inc., S. 1361-1369, 11th International Conference on Power Electronics - ECCE Asia, ICPE 2023-ECCE Asia, Jeju, Südkorea, 22 Mai 2023. https://doi.org/10.23919/ICPE2023-ECCEAsia54778.2023.10213687
Frohling, S., Kostka, B., Wenzel, J. C., Fischer, K., Hanf, M., Zorn, C., Dehning, K., Zimmermann, S., Kaminski, N., Mertens, A., & Peters, J.-H. (2023). Verification of Hygrothermal Simulations Using Silicone Encapsulated Climate Sensors in Continuously Operated IGBT Power Modules. In ICPE 2023-ECCE Asia : 11th International Conference on Power Electronics - Green World with Power Electronics (S. 1361-1369). (International Conference on Power Electronics). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.23919/ICPE2023-ECCEAsia54778.2023.10213687
Frohling S, Kostka B, Wenzel JC, Fischer K, Hanf M, Zorn C et al. Verification of Hygrothermal Simulations Using Silicone Encapsulated Climate Sensors in Continuously Operated IGBT Power Modules. in ICPE 2023-ECCE Asia : 11th International Conference on Power Electronics - Green World with Power Electronics. Institute of Electrical and Electronics Engineers Inc. 2023. S. 1361-1369. (International Conference on Power Electronics). doi: 10.23919/ICPE2023-ECCEAsia54778.2023.10213687
Frohling, Soren ; Kostka, Benedikt ; Wenzel, Johannes C. et al. / Verification of Hygrothermal Simulations Using Silicone Encapsulated Climate Sensors in Continuously Operated IGBT Power Modules. ICPE 2023-ECCE Asia : 11th International Conference on Power Electronics - Green World with Power Electronics. Institute of Electrical and Electronics Engineers Inc., 2023. S. 1361-1369 (International Conference on Power Electronics).
Download
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title = "Verification of Hygrothermal Simulations Using Silicone Encapsulated Climate Sensors in Continuously Operated IGBT Power Modules",
abstract = "This paper presents measurements of temperature and humidity conditions in a power module during continuous pulse-width modulation (PWM) operation. Based on the results, a developed hygrothermal simulation model is validated. This can subsequently be used later to identify critical operating conditions which can create lifetime-reducing microclimates on the chip level. This approach enables the implementation of a condition monitoring system based on the microclimate inside the power module.",
keywords = "Degradation, IGBT, Reliability, Silicone gel",
author = "Soren Frohling and Benedikt Kostka and Wenzel, {Johannes C.} and Katharina Fischer and Michael Hanf and Christian Zorn and Kirsten Dehning and Stefan Zimmermann and Nando Kaminski and Axel Mertens and Jan-Hendrik Peters",
note = "Funding Information: This work is part of the project ReCoWind and was funded by the Federal Ministry for Economic Affairs and Climate Action on the basis of a decision by the German Bundestag. Grant number: 0324336A/C/E. ; 11th International Conference on Power Electronics - ECCE Asia, ICPE 2023-ECCE Asia ; Conference date: 22-05-2023 Through 25-05-2023",
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series = "International Conference on Power Electronics",
publisher = "Institute of Electrical and Electronics Engineers Inc.",
pages = "1361--1369",
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Download

TY - GEN

T1 - Verification of Hygrothermal Simulations Using Silicone Encapsulated Climate Sensors in Continuously Operated IGBT Power Modules

AU - Frohling, Soren

AU - Kostka, Benedikt

AU - Wenzel, Johannes C.

AU - Fischer, Katharina

AU - Hanf, Michael

AU - Zorn, Christian

AU - Dehning, Kirsten

AU - Zimmermann, Stefan

AU - Kaminski, Nando

AU - Mertens, Axel

AU - Peters, Jan-Hendrik

N1 - Funding Information: This work is part of the project ReCoWind and was funded by the Federal Ministry for Economic Affairs and Climate Action on the basis of a decision by the German Bundestag. Grant number: 0324336A/C/E.

PY - 2023

Y1 - 2023

N2 - This paper presents measurements of temperature and humidity conditions in a power module during continuous pulse-width modulation (PWM) operation. Based on the results, a developed hygrothermal simulation model is validated. This can subsequently be used later to identify critical operating conditions which can create lifetime-reducing microclimates on the chip level. This approach enables the implementation of a condition monitoring system based on the microclimate inside the power module.

AB - This paper presents measurements of temperature and humidity conditions in a power module during continuous pulse-width modulation (PWM) operation. Based on the results, a developed hygrothermal simulation model is validated. This can subsequently be used later to identify critical operating conditions which can create lifetime-reducing microclimates on the chip level. This approach enables the implementation of a condition monitoring system based on the microclimate inside the power module.

KW - Degradation

KW - IGBT

KW - Reliability

KW - Silicone gel

UR - http://www.scopus.com/inward/record.url?scp=85170650964&partnerID=8YFLogxK

U2 - 10.23919/ICPE2023-ECCEAsia54778.2023.10213687

DO - 10.23919/ICPE2023-ECCEAsia54778.2023.10213687

M3 - Conference contribution

AN - SCOPUS:85170650964

SN - 979-8-3503-3620-7

T3 - International Conference on Power Electronics

SP - 1361

EP - 1369

BT - ICPE 2023-ECCE Asia

PB - Institute of Electrical and Electronics Engineers Inc.

T2 - 11th International Conference on Power Electronics - ECCE Asia, ICPE 2023-ECCE Asia

Y2 - 22 May 2023 through 25 May 2023

ER -

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