Novel Glass-Silicon Emitter Chip for Field Emission Applications

Publikation: Beitrag in Buch/Bericht/Sammelwerk/KonferenzbandAufsatz in KonferenzbandForschungPeer-Review

Forschungs-netzwerk anzeigen

Details

OriginalspracheEnglisch
Titel des Sammelwerks2023 IEEE 36th International Vacuum Nanoelectronics Conference (IVNC)
Seiten207-209
Seitenumfang3
ISBN (elektronisch)979-8-3503-0143-4
PublikationsstatusVeröffentlicht - 27 Juli 2023

Publikationsreihe

Name International Vacuum Nanoelectronics Conference
ISSN (Print)2164-2370
ISSN (elektronisch)2380-6311

Abstract

This work presents the design and fabrication of a novel emitter chip comprising a silicon electron source with pyramidal structures and a glass extraction electrode. The emitters were fabricated using a wafer dicing technique. The glass extraction electrode was manufactured by Laser Induced Deep Etching (LIDE), metallized, and bonded onto the silicon chip using laser-assisted bonding. Current-voltage experiments confirm the excellent performance of the diced emitters, highlighting their potential for a wide range of applications.

ASJC Scopus Sachgebiete

Zitieren

Novel Glass-Silicon Emitter Chip for Field Emission Applications. / Buchta, Aleksandra M.; Kassner, Alexander; Voß, Julia et al.
2023 IEEE 36th International Vacuum Nanoelectronics Conference (IVNC). 2023. S. 207-209 ( International Vacuum Nanoelectronics Conference).

Publikation: Beitrag in Buch/Bericht/Sammelwerk/KonferenzbandAufsatz in KonferenzbandForschungPeer-Review

Buchta, AM, Kassner, A, Voß, J, Leopold, T, Petring, J, Diekmann, L, Dencker, F & Wurz, MC 2023, Novel Glass-Silicon Emitter Chip for Field Emission Applications. in 2023 IEEE 36th International Vacuum Nanoelectronics Conference (IVNC). International Vacuum Nanoelectronics Conference, S. 207-209. https://doi.org/10.1109/ivnc57695.2023.10188880
Buchta, A. M., Kassner, A., Voß, J., Leopold, T., Petring, J., Diekmann, L., Dencker, F., & Wurz, M. C. (2023). Novel Glass-Silicon Emitter Chip for Field Emission Applications. In 2023 IEEE 36th International Vacuum Nanoelectronics Conference (IVNC) (S. 207-209). ( International Vacuum Nanoelectronics Conference). https://doi.org/10.1109/ivnc57695.2023.10188880
Buchta AM, Kassner A, Voß J, Leopold T, Petring J, Diekmann L et al. Novel Glass-Silicon Emitter Chip for Field Emission Applications. in 2023 IEEE 36th International Vacuum Nanoelectronics Conference (IVNC). 2023. S. 207-209. ( International Vacuum Nanoelectronics Conference). doi: 10.1109/ivnc57695.2023.10188880
Buchta, Aleksandra M. ; Kassner, Alexander ; Voß, Julia et al. / Novel Glass-Silicon Emitter Chip for Field Emission Applications. 2023 IEEE 36th International Vacuum Nanoelectronics Conference (IVNC). 2023. S. 207-209 ( International Vacuum Nanoelectronics Conference).
Download
@inproceedings{9a5b51f77b92469993904cc8b7cc59b3,
title = "Novel Glass-Silicon Emitter Chip for Field Emission Applications",
abstract = "This work presents the design and fabrication of a novel emitter chip comprising a silicon electron source with pyramidal structures and a glass extraction electrode. The emitters were fabricated using a wafer dicing technique. The glass extraction electrode was manufactured by Laser Induced Deep Etching (LIDE), metallized, and bonded onto the silicon chip using laser-assisted bonding. Current-voltage experiments confirm the excellent performance of the diced emitters, highlighting their potential for a wide range of applications.",
keywords = "FEA, LIDE, dicing field emitters, glass extraction electrode, silicon field emitters",
author = "Buchta, {Aleksandra M.} and Alexander Kassner and Julia Vo{\ss} and Tobias Leopold and Julian Petring and Leonard Diekmann and Folke Dencker and Wurz, {Marc C.}",
note = "Funding Information: This work has been carried out as a part of the joint project {"}Innovative Vacuum Technology for Quantum Sensors{"} (InnoVaQ) funded by the German Federal Ministry of Education and Research (BMBF) as part of the funding program {"}Quantum Technologies – from basic research to market{"}. (Contract number: 13N15919).",
year = "2023",
month = jul,
day = "27",
doi = "10.1109/ivnc57695.2023.10188880",
language = "English",
isbn = "979-8-3503-0144-1",
series = " International Vacuum Nanoelectronics Conference",
pages = "207--209",
booktitle = "2023 IEEE 36th International Vacuum Nanoelectronics Conference (IVNC)",

}

Download

TY - GEN

T1 - Novel Glass-Silicon Emitter Chip for Field Emission Applications

AU - Buchta, Aleksandra M.

AU - Kassner, Alexander

AU - Voß, Julia

AU - Leopold, Tobias

AU - Petring, Julian

AU - Diekmann, Leonard

AU - Dencker, Folke

AU - Wurz, Marc C.

N1 - Funding Information: This work has been carried out as a part of the joint project "Innovative Vacuum Technology for Quantum Sensors" (InnoVaQ) funded by the German Federal Ministry of Education and Research (BMBF) as part of the funding program "Quantum Technologies – from basic research to market". (Contract number: 13N15919).

PY - 2023/7/27

Y1 - 2023/7/27

N2 - This work presents the design and fabrication of a novel emitter chip comprising a silicon electron source with pyramidal structures and a glass extraction electrode. The emitters were fabricated using a wafer dicing technique. The glass extraction electrode was manufactured by Laser Induced Deep Etching (LIDE), metallized, and bonded onto the silicon chip using laser-assisted bonding. Current-voltage experiments confirm the excellent performance of the diced emitters, highlighting their potential for a wide range of applications.

AB - This work presents the design and fabrication of a novel emitter chip comprising a silicon electron source with pyramidal structures and a glass extraction electrode. The emitters were fabricated using a wafer dicing technique. The glass extraction electrode was manufactured by Laser Induced Deep Etching (LIDE), metallized, and bonded onto the silicon chip using laser-assisted bonding. Current-voltage experiments confirm the excellent performance of the diced emitters, highlighting their potential for a wide range of applications.

KW - FEA

KW - LIDE

KW - dicing field emitters

KW - glass extraction electrode

KW - silicon field emitters

UR - http://www.scopus.com/inward/record.url?scp=85168674400&partnerID=8YFLogxK

U2 - 10.1109/ivnc57695.2023.10188880

DO - 10.1109/ivnc57695.2023.10188880

M3 - Conference contribution

SN - 979-8-3503-0144-1

T3 - International Vacuum Nanoelectronics Conference

SP - 207

EP - 209

BT - 2023 IEEE 36th International Vacuum Nanoelectronics Conference (IVNC)

ER -

Von denselben Autoren