Details
| Originalsprache | Englisch |
|---|---|
| Titel des Sammelwerks | International Conference and Exhibition on Integration Issues of Miniaturized Systems 2017, SSI 2017 |
| Herausgeber/-innen | Thomas Otto |
| Seiten | 399-402 |
| Seitenumfang | 4 |
| ISBN (elektronisch) | 9783957350572 |
| Publikationsstatus | Veröffentlicht - 2017 |
| Veranstaltung | International Conference and Exhibition on Integration Issues of Miniaturized Systems 2017, SSI 2017 - Cork, Irland Dauer: 8 März 2017 → 9 März 2017 |
Publikationsreihe
| Name | International Conference and Exhibition on Integration Issues of Miniaturized Systems 2017, SSI 2017 |
|---|
ASJC Scopus Sachgebiete
- Informatik (insg.)
- Angewandte Informatik
- Informatik (insg.)
- Artificial intelligence
- Informatik (insg.)
- Computernetzwerke und -kommunikation
Zitieren
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- BibTex
- RIS
International Conference and Exhibition on Integration Issues of Miniaturized Systems 2017, SSI 2017. Hrsg. / Thomas Otto. 2017. S. 399-402 (International Conference and Exhibition on Integration Issues of Miniaturized Systems 2017, SSI 2017).
Publikation: Beitrag in Buch/Bericht/Sammelwerk/Konferenzband › Aufsatz in Konferenzband › Forschung › Peer-Review
}
TY - GEN
T1 - LED packaging with optimized heat dissipation for a micro LED array
AU - Kusch, Alexander
AU - Wurz, Marc
AU - Held, Marcel P.
AU - Wolf, Alexander
AU - Lachmayer, Roland
PY - 2017
Y1 - 2017
UR - http://www.scopus.com/inward/record.url?scp=85032297199&partnerID=8YFLogxK
M3 - Conference contribution
AN - SCOPUS:85032297199
T3 - International Conference and Exhibition on Integration Issues of Miniaturized Systems 2017, SSI 2017
SP - 399
EP - 402
BT - International Conference and Exhibition on Integration Issues of Miniaturized Systems 2017, SSI 2017
A2 - Otto, Thomas
T2 - International Conference and Exhibition on Integration Issues of Miniaturized Systems 2017, SSI 2017
Y2 - 8 March 2017 through 9 March 2017
ER -