Approaches for a Solely Electroless Metallization of Through-Glass Vias

Publikation: Beitrag in Buch/Bericht/Sammelwerk/KonferenzbandAufsatz in KonferenzbandForschungPeer-Review

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OriginalspracheEnglisch
Titel des Sammelwerks2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)
Seiten889-897
Seitenumfang9
ISBN (elektronisch)978-1-6654-7943-1
PublikationsstatusVeröffentlicht - 2022

Publikationsreihe

NameProceedings - Electronic Components and Technology Conference
Band2022-May
ISSN (Print)0569-5503

Abstract

With the ever increasing demand for miniaturization in microfabrication, three dimensional integration is considered the key for progress and reliable vertical interconnect accesses (vias) are crucial. Glass substrates are potent alternatives for silicon in 3-D technologies with their comparable characteristics, their advantage of inherent isolation, and low insertion losses. Through-Glass Vias (TGVs) are commonly metallized using PVD, CVD, or electroless deposition for a seed layer followed by the electrodeposition of copper. Inspired by molded interconnect devices (MID) technologies, the goal of this paper is a solely electroless TGV filling on the basis of three priming approaches: self-assembling monolayers of (3-mercap-topropyl) trimethoxysilane (MPTMS), a photocatalytic layer of titanium tetraisopropoxide (TTiP) and a sol-gel process. Priming with a TBuT solution proved to be particularly suitable. This coating has high-temperature resistance, good adhesion in the TGVs, and allows a solely electroless filling with a layer stack of NiCuNiAu and CuNiAu.

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Approaches for a Solely Electroless Metallization of Through-Glass Vias. / Zawacka, Aleksandra Monika; Prediger, Maren Susanne; Kassner, Alexander et al.
2022 IEEE 72nd Electronic Components and Technology Conference (ECTC). 2022. S. 889-897 (Proceedings - Electronic Components and Technology Conference; Band 2022-May).

Publikation: Beitrag in Buch/Bericht/Sammelwerk/KonferenzbandAufsatz in KonferenzbandForschungPeer-Review

Zawacka, AM, Prediger, MS, Kassner, A, Dencker, FE & Wurz, M 2022, Approaches for a Solely Electroless Metallization of Through-Glass Vias. in 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC). Proceedings - Electronic Components and Technology Conference, Bd. 2022-May, S. 889-897. https://doi.org/10.1109/ectc51906.2022.00145
Zawacka, A. M., Prediger, M. S., Kassner, A., Dencker, F. E., & Wurz, M. (2022). Approaches for a Solely Electroless Metallization of Through-Glass Vias. In 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) (S. 889-897). (Proceedings - Electronic Components and Technology Conference; Band 2022-May). https://doi.org/10.1109/ectc51906.2022.00145
Zawacka AM, Prediger MS, Kassner A, Dencker FE, Wurz M. Approaches for a Solely Electroless Metallization of Through-Glass Vias. in 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC). 2022. S. 889-897. (Proceedings - Electronic Components and Technology Conference). doi: 10.1109/ectc51906.2022.00145
Zawacka, Aleksandra Monika ; Prediger, Maren Susanne ; Kassner, Alexander et al. / Approaches for a Solely Electroless Metallization of Through-Glass Vias. 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC). 2022. S. 889-897 (Proceedings - Electronic Components and Technology Conference).
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abstract = "With the ever increasing demand for miniaturization in microfabrication, three dimensional integration is considered the key for progress and reliable vertical interconnect accesses (vias) are crucial. Glass substrates are potent alternatives for silicon in 3-D technologies with their comparable characteristics, their advantage of inherent isolation, and low insertion losses. Through-Glass Vias (TGVs) are commonly metallized using PVD, CVD, or electroless deposition for a seed layer followed by the electrodeposition of copper. Inspired by molded interconnect devices (MID) technologies, the goal of this paper is a solely electroless TGV filling on the basis of three priming approaches: self-assembling monolayers of (3-mercap-topropyl) trimethoxysilane (MPTMS), a photocatalytic layer of titanium tetraisopropoxide (TTiP) and a sol-gel process. Priming with a TBuT solution proved to be particularly suitable. This coating has high-temperature resistance, good adhesion in the TGVs, and allows a solely electroless filling with a layer stack of NiCuNiAu and CuNiAu.",
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N1 - Funding Information: The research presented was the content of the master thesis project of Aleksandra M. Zawacka, which serves as preliminary result for the subproject “miniaturized vacuum pumping technology for the use in compact sensor system” within the collaborative research project InnoVaQ. The project is funded by the German Federal Ministry of Education and Research (BMBF); funding string 13N15919.

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N2 - With the ever increasing demand for miniaturization in microfabrication, three dimensional integration is considered the key for progress and reliable vertical interconnect accesses (vias) are crucial. Glass substrates are potent alternatives for silicon in 3-D technologies with their comparable characteristics, their advantage of inherent isolation, and low insertion losses. Through-Glass Vias (TGVs) are commonly metallized using PVD, CVD, or electroless deposition for a seed layer followed by the electrodeposition of copper. Inspired by molded interconnect devices (MID) technologies, the goal of this paper is a solely electroless TGV filling on the basis of three priming approaches: self-assembling monolayers of (3-mercap-topropyl) trimethoxysilane (MPTMS), a photocatalytic layer of titanium tetraisopropoxide (TTiP) and a sol-gel process. Priming with a TBuT solution proved to be particularly suitable. This coating has high-temperature resistance, good adhesion in the TGVs, and allows a solely electroless filling with a layer stack of NiCuNiAu and CuNiAu.

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