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A review of computational modelling approaches to compressive failure in laminates

Publikation: Beitrag in FachzeitschriftArtikelForschung

Autorschaft

Organisationseinheiten

Externe Organisationen

  • Safran Tech / Modeling & Simulation Établissement Paris Saclay
  • École normale supérieure Paris-Saclay (ENS Paris-Saclay)

Details

OriginalspracheEnglisch
Aufsatznummer107663
FachzeitschriftComposites Science and Technology
Jahrgang181
Frühes Online-Datum23 Mai 2019
PublikationsstatusVeröffentlicht - 8 Sept. 2019

Abstract

Microbuckling is an important failure mode for fibre reinforced composites loaded under compression and the topic has received substantial attention of the research community. This effort led to a good understanding of the basic mechanisms behind the microbuckling phenomenon. However in spite of the well-developed theory, the ability to accurately predict failure loads and other related properties based on available data has not been attained yet. This may be attributed to a number of factors, arising at different scales. Consequently, numerous computational models and methods were put forward in the literature to approach this objective and this survey attempts to provide an overview of these developments. A concise reminder of the phenomenology and theoretical basis is also included to make the present survey self-contained.

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A review of computational modelling approaches to compressive failure in laminates. / Daum, Benedikt Alois; Feld, N.; Allix, Olivier et al.
in: Composites Science and Technology, Jahrgang 181, 107663, 08.09.2019.

Publikation: Beitrag in FachzeitschriftArtikelForschung

Daum BA, Feld N, Allix O, Rolfes R. A review of computational modelling approaches to compressive failure in laminates. Composites Science and Technology. 2019 Sep 8;181:107663. Epub 2019 Mai 23. doi: 10.1016/j.compscitech.2019.05.020
Daum, Benedikt Alois ; Feld, N. ; Allix, Olivier et al. / A review of computational modelling approaches to compressive failure in laminates. in: Composites Science and Technology. 2019 ; Jahrgang 181.
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