Details
| Originalsprache | Englisch |
|---|---|
| Seiten (von - bis) | 9-12 |
| Seitenumfang | 4 |
| Fachzeitschrift | Manufacturing Letters |
| Jahrgang | 36 |
| Frühes Online-Datum | 13 Jan. 2023 |
| Publikationsstatus | Veröffentlicht - Juli 2023 |
Abstract
In the present study, a novel approach is presented to achieve oxygen partial pressures corresponding to extremely high vacuum (XHV) to foster cold roll bonding. Cold roll bonding of Al/Al and Cu/Cu as well as the heterogeneous combination Al/Cu were investigated with a focus on the minimum degree of deformation required to form a solid bond. By applying XHV-adequate conditions, the minimum degree of deformation for the formation of a solid bond could be reduced by up to 35%. Furthermore, it was evident that the adhesion behaviour changed during bond formation in XHV-adequate conditions.
ASJC Scopus Sachgebiete
- Ingenieurwesen (insg.)
- Werkstoffmechanik
- Ingenieurwesen (insg.)
- Wirtschaftsingenieurwesen und Fertigungstechnik
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in: Manufacturing Letters, Jahrgang 36, 07.2023, S. 9-12.
Publikation: Beitrag in Fachzeitschrift › Artikel › Forschung › Peer-Review
}
TY - JOUR
T1 - A novel way to reduce the critical deformation for cold roll bonding
AU - Barienti, Khemais
AU - Werwein, Stefan
AU - Herbst, Sebastian
AU - Maier, Hans Jürgen
AU - Nürnberger, Florian
N1 - Funding Information: This research was funded by the Deutsche Forschungsgemeinschaft (DFG, German Research Foundation)—Project-ID 394563137—SFB 1368.
PY - 2023/7
Y1 - 2023/7
N2 - In the present study, a novel approach is presented to achieve oxygen partial pressures corresponding to extremely high vacuum (XHV) to foster cold roll bonding. Cold roll bonding of Al/Al and Cu/Cu as well as the heterogeneous combination Al/Cu were investigated with a focus on the minimum degree of deformation required to form a solid bond. By applying XHV-adequate conditions, the minimum degree of deformation for the formation of a solid bond could be reduced by up to 35%. Furthermore, it was evident that the adhesion behaviour changed during bond formation in XHV-adequate conditions.
AB - In the present study, a novel approach is presented to achieve oxygen partial pressures corresponding to extremely high vacuum (XHV) to foster cold roll bonding. Cold roll bonding of Al/Al and Cu/Cu as well as the heterogeneous combination Al/Cu were investigated with a focus on the minimum degree of deformation required to form a solid bond. By applying XHV-adequate conditions, the minimum degree of deformation for the formation of a solid bond could be reduced by up to 35%. Furthermore, it was evident that the adhesion behaviour changed during bond formation in XHV-adequate conditions.
KW - Aluminum
KW - Cold roll bonding
KW - Copper
KW - Rolling
KW - Silane
UR - http://www.scopus.com/inward/record.url?scp=85146431269&partnerID=8YFLogxK
U2 - 10.1016/j.mfglet.2022.12.006
DO - 10.1016/j.mfglet.2022.12.006
M3 - Article
AN - SCOPUS:85146431269
VL - 36
SP - 9
EP - 12
JO - Manufacturing Letters
JF - Manufacturing Letters
SN - 2213-8463
ER -