A Composite of Polyether Ether Ketone and Silica-Coated Copper Particles for Creating Tailored Conductive Tracks via Laser Printing

Publikation: Beitrag in FachzeitschriftArtikelForschungPeer-Review

Forschungs-netzwerk anzeigen

Details

OriginalspracheEnglisch
Aufsatznummer2300264
FachzeitschriftMacromolecular Materials and Engineering
Jahrgang309
Ausgabenummer2
PublikationsstatusVeröffentlicht - 15 Feb. 2024

Abstract

Conventional substrates for optoelectronic systems include inorganic or organic carrier materials; however, these systems are typically subjected to environmentally harmful multistep processes to prepare printed circuit boards. To mitigate these issues, the present article reports a polyether ether ketone (PEEK)-based composite densely filled with copper microparticles, prepared using a simple, cost-effective, and sustainable synthesis method. The material exhibits high thermal conductivity but is electrically nonconductive prior to undergoing laser treatment. To prevent the composite from exhibiting electrical conductivity, the copper particles are coated with a thin silica layer through a sol–gel reaction. The thermal stability of PEEK and the Cu–PEEK composites with Cu contents of up to 70 vol%, which are prepared via heat melding, is investigated by thermogravimetric analysis, differential scanning calorimetry, and Fourier-transform infrared spectroscopy to clarify the manner in which copper affects the chemical structure of the polymer. The developed composite exhibits a significantly higher thermal conductivity than that of the unfilled PEEK polymer. This paper also describes the effects of laser treatment on the surface morphology. Overall, this study suggests that conductive tracks with low electrical resistance can be created on electrically insulating substrates with high thermal conductivity.

ASJC Scopus Sachgebiete

Zitieren

A Composite of Polyether Ether Ketone and Silica-Coated Copper Particles for Creating Tailored Conductive Tracks via Laser Printing. / Schnettger, Alexander; Holländer, Ulrich; Maier, Hans J.
in: Macromolecular Materials and Engineering, Jahrgang 309, Nr. 2, 2300264, 15.02.2024.

Publikation: Beitrag in FachzeitschriftArtikelForschungPeer-Review

Download
@article{f8b37af1d67e4c5dbed1107ad9278f4e,
title = "A Composite of Polyether Ether Ketone and Silica-Coated Copper Particles for Creating Tailored Conductive Tracks via Laser Printing",
abstract = "Conventional substrates for optoelectronic systems include inorganic or organic carrier materials; however, these systems are typically subjected to environmentally harmful multistep processes to prepare printed circuit boards. To mitigate these issues, the present article reports a polyether ether ketone (PEEK)-based composite densely filled with copper microparticles, prepared using a simple, cost-effective, and sustainable synthesis method. The material exhibits high thermal conductivity but is electrically nonconductive prior to undergoing laser treatment. To prevent the composite from exhibiting electrical conductivity, the copper particles are coated with a thin silica layer through a sol–gel reaction. The thermal stability of PEEK and the Cu–PEEK composites with Cu contents of up to 70 vol%, which are prepared via heat melding, is investigated by thermogravimetric analysis, differential scanning calorimetry, and Fourier-transform infrared spectroscopy to clarify the manner in which copper affects the chemical structure of the polymer. The developed composite exhibits a significantly higher thermal conductivity than that of the unfilled PEEK polymer. This paper also describes the effects of laser treatment on the surface morphology. Overall, this study suggests that conductive tracks with low electrical resistance can be created on electrically insulating substrates with high thermal conductivity.",
keywords = "copper, laser direct structuring, polyether ether ketone, sol–gel, thermal conductivity",
author = "Alexander Schnettger and Ulrich Holl{\"a}nder and Maier, {Hans J.}",
note = "Funding information: This study was funded by the Deutsche Forschungsgemeinde under Germany's Excellence Strategy program at the Cluster of Excellence PhoenixD (Leibniz Universit{\"a}t Hannover; EXC 2122, Project ID 390833453).",
year = "2024",
month = feb,
day = "15",
doi = "10.1002/mame.202300264",
language = "English",
volume = "309",
journal = "Macromolecular Materials and Engineering",
issn = "1438-7492",
publisher = "Wiley-VCH Verlag",
number = "2",

}

Download

TY - JOUR

T1 - A Composite of Polyether Ether Ketone and Silica-Coated Copper Particles for Creating Tailored Conductive Tracks via Laser Printing

AU - Schnettger, Alexander

AU - Holländer, Ulrich

AU - Maier, Hans J.

N1 - Funding information: This study was funded by the Deutsche Forschungsgemeinde under Germany's Excellence Strategy program at the Cluster of Excellence PhoenixD (Leibniz Universität Hannover; EXC 2122, Project ID 390833453).

PY - 2024/2/15

Y1 - 2024/2/15

N2 - Conventional substrates for optoelectronic systems include inorganic or organic carrier materials; however, these systems are typically subjected to environmentally harmful multistep processes to prepare printed circuit boards. To mitigate these issues, the present article reports a polyether ether ketone (PEEK)-based composite densely filled with copper microparticles, prepared using a simple, cost-effective, and sustainable synthesis method. The material exhibits high thermal conductivity but is electrically nonconductive prior to undergoing laser treatment. To prevent the composite from exhibiting electrical conductivity, the copper particles are coated with a thin silica layer through a sol–gel reaction. The thermal stability of PEEK and the Cu–PEEK composites with Cu contents of up to 70 vol%, which are prepared via heat melding, is investigated by thermogravimetric analysis, differential scanning calorimetry, and Fourier-transform infrared spectroscopy to clarify the manner in which copper affects the chemical structure of the polymer. The developed composite exhibits a significantly higher thermal conductivity than that of the unfilled PEEK polymer. This paper also describes the effects of laser treatment on the surface morphology. Overall, this study suggests that conductive tracks with low electrical resistance can be created on electrically insulating substrates with high thermal conductivity.

AB - Conventional substrates for optoelectronic systems include inorganic or organic carrier materials; however, these systems are typically subjected to environmentally harmful multistep processes to prepare printed circuit boards. To mitigate these issues, the present article reports a polyether ether ketone (PEEK)-based composite densely filled with copper microparticles, prepared using a simple, cost-effective, and sustainable synthesis method. The material exhibits high thermal conductivity but is electrically nonconductive prior to undergoing laser treatment. To prevent the composite from exhibiting electrical conductivity, the copper particles are coated with a thin silica layer through a sol–gel reaction. The thermal stability of PEEK and the Cu–PEEK composites with Cu contents of up to 70 vol%, which are prepared via heat melding, is investigated by thermogravimetric analysis, differential scanning calorimetry, and Fourier-transform infrared spectroscopy to clarify the manner in which copper affects the chemical structure of the polymer. The developed composite exhibits a significantly higher thermal conductivity than that of the unfilled PEEK polymer. This paper also describes the effects of laser treatment on the surface morphology. Overall, this study suggests that conductive tracks with low electrical resistance can be created on electrically insulating substrates with high thermal conductivity.

KW - copper

KW - laser direct structuring

KW - polyether ether ketone

KW - sol–gel

KW - thermal conductivity

UR - http://www.scopus.com/inward/record.url?scp=85174949405&partnerID=8YFLogxK

U2 - 10.1002/mame.202300264

DO - 10.1002/mame.202300264

M3 - Article

AN - SCOPUS:85174949405

VL - 309

JO - Macromolecular Materials and Engineering

JF - Macromolecular Materials and Engineering

SN - 1438-7492

IS - 2

M1 - 2300264

ER -

Von denselben Autoren