Details
| Original language | English |
|---|---|
| Article number | 116730 |
| Number of pages | 30 |
| Journal | Computer Methods in Applied Mechanics and Engineering |
| Volume | 420 |
| Early online date | 1 Jan 2024 |
| Publication status | Published - 15 Feb 2024 |
Abstract
To accurately address the thermally induced dynamic and steady-state crack propagation problems for homogeneous and heterogeneous materials involving crack branching, interfacial de-bonding and crack kinking, we propose the fully coupled thermo-mechanical dual-horizon peridynamic correspondence damage model (TM-DHPD). To this end, the integral coupled equations for TM-DHPD are firstly derived within the framework of thermodynamics. And then, the alternative dual-horizon peridynamic correspondence principle is used to derive the constitutive bond force state, heat flow state and their general linearizations. Moreover, the unified criterion for bond damage is proposed to characterize the internal bond damage in a single material and the interface bond damage in dissimilar materials. To ensure convergence and accuracy, the coupled equations are solved using the standard implicit method without the use of artificial damping. In both homogeneous and heterogeneous materials, some representative and challenging numerical cases are examined, such as dynamic crack branching in a centrally heated disk and multiple interface failure of thermal barrier coating. The numerical results are in good agreement with the available experimental results or the previous predictions, which shows the great potential of the proposed TM-DHPD in addressing the physics of numerous thermally induced fractures in the real-world engineering problems.
Keywords
- Crack branching, Heterogeneous materials, Interfacial de-bonding, Peridynamics, Thermally induced fractures
ASJC Scopus subject areas
- Engineering(all)
- Computational Mechanics
- Engineering(all)
- Mechanics of Materials
- Engineering(all)
- Mechanical Engineering
- Physics and Astronomy(all)
- Computer Science(all)
- Computer Science Applications
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In: Computer Methods in Applied Mechanics and Engineering, Vol. 420, 116730, 15.02.2024.
Research output: Contribution to journal › Article › Research › peer review
}
TY - JOUR
T1 - The fully coupled thermo-mechanical dual-horizon peridynamic correspondence damage model for homogeneous and heterogeneous materials
AU - Bie, Yehui
AU - Ren, Huilong
AU - Rabczuk, Timon
AU - Quoc Bui, Tinh
AU - Wei, Yueguang
N1 - Funding Information: This work is supported by the National Natural Science Foundation of China (Grant nos. 11890681, 12032001 and 11521202 ).
PY - 2024/2/15
Y1 - 2024/2/15
N2 - To accurately address the thermally induced dynamic and steady-state crack propagation problems for homogeneous and heterogeneous materials involving crack branching, interfacial de-bonding and crack kinking, we propose the fully coupled thermo-mechanical dual-horizon peridynamic correspondence damage model (TM-DHPD). To this end, the integral coupled equations for TM-DHPD are firstly derived within the framework of thermodynamics. And then, the alternative dual-horizon peridynamic correspondence principle is used to derive the constitutive bond force state, heat flow state and their general linearizations. Moreover, the unified criterion for bond damage is proposed to characterize the internal bond damage in a single material and the interface bond damage in dissimilar materials. To ensure convergence and accuracy, the coupled equations are solved using the standard implicit method without the use of artificial damping. In both homogeneous and heterogeneous materials, some representative and challenging numerical cases are examined, such as dynamic crack branching in a centrally heated disk and multiple interface failure of thermal barrier coating. The numerical results are in good agreement with the available experimental results or the previous predictions, which shows the great potential of the proposed TM-DHPD in addressing the physics of numerous thermally induced fractures in the real-world engineering problems.
AB - To accurately address the thermally induced dynamic and steady-state crack propagation problems for homogeneous and heterogeneous materials involving crack branching, interfacial de-bonding and crack kinking, we propose the fully coupled thermo-mechanical dual-horizon peridynamic correspondence damage model (TM-DHPD). To this end, the integral coupled equations for TM-DHPD are firstly derived within the framework of thermodynamics. And then, the alternative dual-horizon peridynamic correspondence principle is used to derive the constitutive bond force state, heat flow state and their general linearizations. Moreover, the unified criterion for bond damage is proposed to characterize the internal bond damage in a single material and the interface bond damage in dissimilar materials. To ensure convergence and accuracy, the coupled equations are solved using the standard implicit method without the use of artificial damping. In both homogeneous and heterogeneous materials, some representative and challenging numerical cases are examined, such as dynamic crack branching in a centrally heated disk and multiple interface failure of thermal barrier coating. The numerical results are in good agreement with the available experimental results or the previous predictions, which shows the great potential of the proposed TM-DHPD in addressing the physics of numerous thermally induced fractures in the real-world engineering problems.
KW - Crack branching
KW - Heterogeneous materials
KW - Interfacial de-bonding
KW - Peridynamics
KW - Thermally induced fractures
UR - http://www.scopus.com/inward/record.url?scp=85181168096&partnerID=8YFLogxK
U2 - 10.1016/j.cma.2023.116730
DO - 10.1016/j.cma.2023.116730
M3 - Article
AN - SCOPUS:85181168096
VL - 420
JO - Computer Methods in Applied Mechanics and Engineering
JF - Computer Methods in Applied Mechanics and Engineering
SN - 0045-7825
M1 - 116730
ER -