Details
| Original language | English |
|---|---|
| Journal | IEEE Transactions on Biomedical Circuits and Systems |
| Publication status | E-pub ahead of print - 2024 |
Abstract
Hearing loss is one of the most common sensory deficiencies. Hearing aids with adaptable personalized signal processing can further enhance the social lives of those affected. To investigate the degree of possible improvements,high-level programmable,low-power,and portable behind-the-ear (BTE) research platforms are needed to conduct studies in the real world and not just in the laboratory. However,as the hearing aid market is very restrictive and,to the best of our knowledge,no research platforms in BTE size are available,this paper presents a fully embedded hearing aid prototype in a BTE form factor as one of the contributions. The device integrates wireless interfaces such as Bluetooth Low Energy (BLE) and Near Field Magnetic Induction (NFMI). Despite its small size and weight of only 5 grams,it can be used for studies lasting up to nine hours with state-of-the-art hearing algorithms. As a key component to achieve this low power consumption while executing these computationally demanding algorithms,this paper presents a newly designed Smart Hearing Aid Processor (SmartHeaP) System on Chip (SoC). It is a mixed-signal and application-specific integrated circuit (ASIC) with an adaptive body bias (ABB) unit fabricated in 22nm fully-depleted silicon-on-insulator (FD-SOI) technology. Furthermore,the SoC integrates two application-specific instruction set processors (ASIPs) designed using virtual prototyping approaches. The SoC is high-level pro- grammable and tailored to hearing aid applications,capable of running,e.g.,a binaural beamformer with a power consumption of 1.45 mW @ 5 MHz.
Keywords
- 22nm FD-SOI, ASIC, ASIP, Hearing Aid, Instruction Extension, Low Power, MATLAB, Research Platform, System on Chip (SoC), Tensilica, Virtual Prototype
ASJC Scopus subject areas
- Engineering(all)
- Biomedical Engineering
- Engineering(all)
- Electrical and Electronic Engineering
Sustainable Development Goals
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In: IEEE Transactions on Biomedical Circuits and Systems, 2024.
Research output: Contribution to journal › Article › Research › peer review
}
TY - JOUR
T1 - SmartHeaP- A High-level Programmable and Customized Hearing Aid System on Chip Integrated in a Research Hearing Aid Prototype
AU - Karrenbauer, Jens
AU - Schonewald, Sven
AU - Klein, Simon
AU - Kautz, Frederik
AU - Adiloglu, Kamil
AU - Kretzschmar, Claudia
AU - Bruns, Tobias
AU - Bluethgen, Hans Martin
AU - Blawat, Meinolf
AU - Benndorf, Jens
AU - Blume, Holger
N1 - Publisher Copyright: © 2007-2012 IEEE.
PY - 2024
Y1 - 2024
N2 - Hearing loss is one of the most common sensory deficiencies. Hearing aids with adaptable personalized signal processing can further enhance the social lives of those affected. To investigate the degree of possible improvements,high-level programmable,low-power,and portable behind-the-ear (BTE) research platforms are needed to conduct studies in the real world and not just in the laboratory. However,as the hearing aid market is very restrictive and,to the best of our knowledge,no research platforms in BTE size are available,this paper presents a fully embedded hearing aid prototype in a BTE form factor as one of the contributions. The device integrates wireless interfaces such as Bluetooth Low Energy (BLE) and Near Field Magnetic Induction (NFMI). Despite its small size and weight of only 5 grams,it can be used for studies lasting up to nine hours with state-of-the-art hearing algorithms. As a key component to achieve this low power consumption while executing these computationally demanding algorithms,this paper presents a newly designed Smart Hearing Aid Processor (SmartHeaP) System on Chip (SoC). It is a mixed-signal and application-specific integrated circuit (ASIC) with an adaptive body bias (ABB) unit fabricated in 22nm fully-depleted silicon-on-insulator (FD-SOI) technology. Furthermore,the SoC integrates two application-specific instruction set processors (ASIPs) designed using virtual prototyping approaches. The SoC is high-level pro- grammable and tailored to hearing aid applications,capable of running,e.g.,a binaural beamformer with a power consumption of 1.45 mW @ 5 MHz.
AB - Hearing loss is one of the most common sensory deficiencies. Hearing aids with adaptable personalized signal processing can further enhance the social lives of those affected. To investigate the degree of possible improvements,high-level programmable,low-power,and portable behind-the-ear (BTE) research platforms are needed to conduct studies in the real world and not just in the laboratory. However,as the hearing aid market is very restrictive and,to the best of our knowledge,no research platforms in BTE size are available,this paper presents a fully embedded hearing aid prototype in a BTE form factor as one of the contributions. The device integrates wireless interfaces such as Bluetooth Low Energy (BLE) and Near Field Magnetic Induction (NFMI). Despite its small size and weight of only 5 grams,it can be used for studies lasting up to nine hours with state-of-the-art hearing algorithms. As a key component to achieve this low power consumption while executing these computationally demanding algorithms,this paper presents a newly designed Smart Hearing Aid Processor (SmartHeaP) System on Chip (SoC). It is a mixed-signal and application-specific integrated circuit (ASIC) with an adaptive body bias (ABB) unit fabricated in 22nm fully-depleted silicon-on-insulator (FD-SOI) technology. Furthermore,the SoC integrates two application-specific instruction set processors (ASIPs) designed using virtual prototyping approaches. The SoC is high-level pro- grammable and tailored to hearing aid applications,capable of running,e.g.,a binaural beamformer with a power consumption of 1.45 mW @ 5 MHz.
KW - 22nm FD-SOI
KW - ASIC
KW - ASIP
KW - Hearing Aid
KW - Instruction Extension
KW - Low Power
KW - MATLAB
KW - Research Platform
KW - System on Chip (SoC)
KW - Tensilica
KW - Virtual Prototype
UR - http://www.scopus.com/inward/record.url?scp=85207447038&partnerID=8YFLogxK
U2 - 10.1109/TBCAS.2024.3481044
DO - 10.1109/TBCAS.2024.3481044
M3 - Article
AN - SCOPUS:85207447038
JO - IEEE Transactions on Biomedical Circuits and Systems
JF - IEEE Transactions on Biomedical Circuits and Systems
SN - 1932-4545
ER -