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Simulation-based prediction of reliability and robustness of interconnect systems for semiconductor applications

Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review

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External Research Organisations

  • X-FAB Silicon Foundries SE

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Original languageEnglish
Title of host publication2012 13th International Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2012
Publication statusPublished - 2012
Event2012 13th International Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2012 - Cascais, Portugal
Duration: 16 Apr 2012 → 18 Apr 2012

Publication series

Name2012 13th International Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2012

Abstract

The article at hand presents the results of thermoelectrical simulations of migration effects in integrated interconnect systems in comparison to measurement data. The simulation concept will be described and the output values as mass flux divergence and time-to-failure (TTF) will be discussed. Based on the example of via chain structures, different geometry factors have been investigated with respect to the impact on the robustness. The simulation can support the reliability prediction and the determination of failure mechanisms in terms of process qualification and design optimization.

Keywords

    electromigration, interconnect, robustness, thermoelectrical simulation

ASJC Scopus subject areas

Cite this

Simulation-based prediction of reliability and robustness of interconnect systems for semiconductor applications. / Ackermann, M.; Hein, V.; Weide-Zaage, K.
2012 13th International Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2012. 2012. 6191800 (2012 13th International Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2012).

Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review

Ackermann, M, Hein, V & Weide-Zaage, K 2012, Simulation-based prediction of reliability and robustness of interconnect systems for semiconductor applications. in 2012 13th International Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2012., 6191800, 2012 13th International Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2012, 2012 13th International Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2012, Cascais, Portugal, 16 Apr 2012. https://doi.org/10.1109/ESimE.2012.6191800
Ackermann, M., Hein, V., & Weide-Zaage, K. (2012). Simulation-based prediction of reliability and robustness of interconnect systems for semiconductor applications. In 2012 13th International Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2012 Article 6191800 (2012 13th International Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2012). https://doi.org/10.1109/ESimE.2012.6191800
Ackermann M, Hein V, Weide-Zaage K. Simulation-based prediction of reliability and robustness of interconnect systems for semiconductor applications. In 2012 13th International Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2012. 2012. 6191800. (2012 13th International Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2012). doi: 10.1109/ESimE.2012.6191800
Ackermann, M. ; Hein, V. ; Weide-Zaage, K. / Simulation-based prediction of reliability and robustness of interconnect systems for semiconductor applications. 2012 13th International Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2012. 2012. (2012 13th International Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2012).
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