Details
| Original language | English |
|---|---|
| Title of host publication | Current Trends and Open Problems in Computational Mechanics |
| Publisher | Springer International Publishing AG |
| Pages | 1-14 |
| Number of pages | 14 |
| ISBN (electronic) | 9783030873127 |
| ISBN (print) | 9783030873110 |
| Publication status | E-pub ahead of print - 13 Mar 2022 |
Abstract
Miniaturization increases more complexity in Integrated Circuits (IC) as well as circuit boards. Several electronic components are assembled on a Printed Circuit Board (PCB). The board is a composite material of a fiber reinforced thermosetting polymer based matrix. Within and on the board, conducting traces and vertical interconnect access (via) carry out electrical signals. So-called Joule’s heat causes a cyclic occurrence of thermal stresses on vias and traces leading to plastic deformation and fatigue related damage. Multiphysics simulations make a study of this coupled and nonlinear system possible. We demonstrate an attempt to compute an electro-thermo-mechanical system and a damage problem by using finite element method in space and finite difference method in time.
Keywords
- Damage, Electro-thermo-mechanics, FEM, Multiphysics
ASJC Scopus subject areas
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Current Trends and Open Problems in Computational Mechanics. Springer International Publishing AG, 2022. p. 1-14.
Research output: Chapter in book/report/conference proceeding › Contribution to book/anthology › Research › peer review
}
TY - CHAP
T1 - Multiphysics Computation of Thermomechanical Fatigue in Electronics Under Electrical Loading
AU - Abali, Bilen Emek
AU - Aldakheel, Fadi
AU - Zohdi, Tarek I.
PY - 2022/3/13
Y1 - 2022/3/13
N2 - Miniaturization increases more complexity in Integrated Circuits (IC) as well as circuit boards. Several electronic components are assembled on a Printed Circuit Board (PCB). The board is a composite material of a fiber reinforced thermosetting polymer based matrix. Within and on the board, conducting traces and vertical interconnect access (via) carry out electrical signals. So-called Joule’s heat causes a cyclic occurrence of thermal stresses on vias and traces leading to plastic deformation and fatigue related damage. Multiphysics simulations make a study of this coupled and nonlinear system possible. We demonstrate an attempt to compute an electro-thermo-mechanical system and a damage problem by using finite element method in space and finite difference method in time.
AB - Miniaturization increases more complexity in Integrated Circuits (IC) as well as circuit boards. Several electronic components are assembled on a Printed Circuit Board (PCB). The board is a composite material of a fiber reinforced thermosetting polymer based matrix. Within and on the board, conducting traces and vertical interconnect access (via) carry out electrical signals. So-called Joule’s heat causes a cyclic occurrence of thermal stresses on vias and traces leading to plastic deformation and fatigue related damage. Multiphysics simulations make a study of this coupled and nonlinear system possible. We demonstrate an attempt to compute an electro-thermo-mechanical system and a damage problem by using finite element method in space and finite difference method in time.
KW - Damage
KW - Electro-thermo-mechanics
KW - FEM
KW - Multiphysics
UR - http://www.scopus.com/inward/record.url?scp=85137675196&partnerID=8YFLogxK
U2 - 10.1007/978-3-030-87312-7_1
DO - 10.1007/978-3-030-87312-7_1
M3 - Contribution to book/anthology
AN - SCOPUS:85137675196
SN - 9783030873110
SP - 1
EP - 14
BT - Current Trends and Open Problems in Computational Mechanics
PB - Springer International Publishing AG
ER -