Details
| Original language | English |
|---|---|
| Title of host publication | Integrated Optics |
| Subtitle of host publication | Devices, Materials, and Technologies XXIX |
| Editors | Sonia M. Garcia-Blanco, Pavel Cheben |
| Publisher | SPIE |
| ISBN (electronic) | 9781510684867 |
| Publication status | Published - 27 Jan 2025 |
| Event | Integrated Optics: Devices, Materials, and Technologies XXIX 2025 - San Francisco, United States Duration: 27 Jan 2025 → 30 Jan 2025 |
Publication series
| Name | Proceedings of SPIE - The International Society for Optical Engineering |
|---|---|
| Volume | 13369 |
| ISSN (Print) | 0277-786X |
| ISSN (electronic) | 1996-756X |
Abstract
Photonic integrated circuits represent a promising technology for creating compact and cost-effective optical devices with multiple functions on a single chip. The advancement of integrated photonics is driven by research on new material platforms and production techniques. Lithium niobate (LN) is particularly attractive due to its advantageous optical properties like nonlinearity and electro optic effect. Integrated LN waveguides have been historically fabricated using multi-step methods, including lithographic patterning and dry etching. Additive manufacturing, in contrast, allows for rapid single-step production. This paper presents a novel etchless fabrication process using multi-photon lithography to create strip-loaded waveguides on thin-film LN. It demonstrates the reusability of thin-film LN substrates by erasing and reprinting strips, promoting rapid and sustainable photonic chip production. The study includes strip widths between 1 and 5 µm and thin-film layer thicknesses of 300, 600 and 900 nm, with experimental data supported by numerical simulations. We report propagation losses below 1 dB/cm at 1550 nm. Additionally, advantages and disadvantages of different strip-loaded LN waveguide designs for photonic packaging, e.g. higher coupling losses for smaller LN layer thickness, are discussed.
Keywords
- additive manufacturing, Lithium niobate, Multi-photon lithography, photonic integrated chip, strip-loaded waveguide, TFLN, Two-photon polymerization
ASJC Scopus subject areas
- Materials Science(all)
- Electronic, Optical and Magnetic Materials
- Physics and Astronomy(all)
- Condensed Matter Physics
- Computer Science(all)
- Computer Science Applications
- Mathematics(all)
- Applied Mathematics
- Engineering(all)
- Electrical and Electronic Engineering
Cite this
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- Harvard
- Apa
- Vancouver
- BibTeX
- RIS
Integrated Optics: Devices, Materials, and Technologies XXIX. ed. / Sonia M. Garcia-Blanco; Pavel Cheben. SPIE, 2025. 1336914 (Proceedings of SPIE - The International Society for Optical Engineering; Vol. 13369).
Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review
}
TY - GEN
T1 - Multi-photon lithography of strip-loaded thin-film lithium niobate waveguides
AU - Rittmeier, Alexandra
AU - Chatzizyrli, Elisavet
AU - Gehrke, Philipp
AU - Sewidan, Muhamed A.
AU - Braun, Martin
AU - Afentaki, Angeliki
AU - Hoffmann, Gerd A.
AU - Neumann, Jörg
AU - Wienke, Andreas
AU - Kracht, Dietmar
AU - Kues, Michael
AU - Hinkelmann, Moritz
N1 - Publisher Copyright: © 2025 SPIE.
PY - 2025/1/27
Y1 - 2025/1/27
N2 - Photonic integrated circuits represent a promising technology for creating compact and cost-effective optical devices with multiple functions on a single chip. The advancement of integrated photonics is driven by research on new material platforms and production techniques. Lithium niobate (LN) is particularly attractive due to its advantageous optical properties like nonlinearity and electro optic effect. Integrated LN waveguides have been historically fabricated using multi-step methods, including lithographic patterning and dry etching. Additive manufacturing, in contrast, allows for rapid single-step production. This paper presents a novel etchless fabrication process using multi-photon lithography to create strip-loaded waveguides on thin-film LN. It demonstrates the reusability of thin-film LN substrates by erasing and reprinting strips, promoting rapid and sustainable photonic chip production. The study includes strip widths between 1 and 5 µm and thin-film layer thicknesses of 300, 600 and 900 nm, with experimental data supported by numerical simulations. We report propagation losses below 1 dB/cm at 1550 nm. Additionally, advantages and disadvantages of different strip-loaded LN waveguide designs for photonic packaging, e.g. higher coupling losses for smaller LN layer thickness, are discussed.
AB - Photonic integrated circuits represent a promising technology for creating compact and cost-effective optical devices with multiple functions on a single chip. The advancement of integrated photonics is driven by research on new material platforms and production techniques. Lithium niobate (LN) is particularly attractive due to its advantageous optical properties like nonlinearity and electro optic effect. Integrated LN waveguides have been historically fabricated using multi-step methods, including lithographic patterning and dry etching. Additive manufacturing, in contrast, allows for rapid single-step production. This paper presents a novel etchless fabrication process using multi-photon lithography to create strip-loaded waveguides on thin-film LN. It demonstrates the reusability of thin-film LN substrates by erasing and reprinting strips, promoting rapid and sustainable photonic chip production. The study includes strip widths between 1 and 5 µm and thin-film layer thicknesses of 300, 600 and 900 nm, with experimental data supported by numerical simulations. We report propagation losses below 1 dB/cm at 1550 nm. Additionally, advantages and disadvantages of different strip-loaded LN waveguide designs for photonic packaging, e.g. higher coupling losses for smaller LN layer thickness, are discussed.
KW - additive manufacturing
KW - Lithium niobate
KW - Multi-photon lithography
KW - photonic integrated chip
KW - strip-loaded waveguide
KW - TFLN
KW - Two-photon polymerization
UR - http://www.scopus.com/inward/record.url?scp=105002402282&partnerID=8YFLogxK
U2 - 10.1117/12.3043025
DO - 10.1117/12.3043025
M3 - Conference contribution
AN - SCOPUS:105002402282
T3 - Proceedings of SPIE - The International Society for Optical Engineering
BT - Integrated Optics
A2 - Garcia-Blanco, Sonia M.
A2 - Cheben, Pavel
PB - SPIE
T2 - Integrated Optics
Y2 - 27 January 2025 through 30 January 2025
ER -