Details
| Original language | English |
|---|---|
| Title of host publication | Proceedings |
| Subtitle of host publication | IEEE 68th Electronic Components and Technology Conference, ECTC 2018 |
| Publisher | Institute of Electrical and Electronics Engineers Inc. |
| Pages | 1434-1439 |
| Number of pages | 6 |
| ISBN (Print) | 9781538649985 |
| Publication status | Published - 7 Aug 2018 |
| Event | 68th IEEE Electronic Components and Technology Conference, ECTC 2018 - San Diego, United States Duration: 29 May 2018 → 1 Jun 2018 |
Publication series
| Name | Proceedings - Electronic Components and Technology Conference |
|---|---|
| Volume | 2018-May |
| ISSN (Print) | 0569-5503 |
Abstract
Nowadays ultrasonic (US) copper wire bonding gests more required and applied in power electronics. Despite its large amounts of usage, the underlying bonding mechanisms are still unclear. Among them, the dynamic changes of microwelds are essential to the bonding process as the bonding quality and reliability are greatly influenced by the formed microwelds. In this work, the formation and breakage of microwelds during US copper wire bonding are analyzed by molecular dynamics simulation. Due to the limit of the computational expense, a small local interface consisting of ~40000 atoms is simulated. In the model, the copper substrate is fixed while the movement of the copper wire is imposed. Microwelds are first formed during the downwards moving of the wire and get enlarged with further vertical displacement. The formed microwelds can be broken due to the vibration while new microwelds can be formed in the meantime. Because of the formation, deformation and breakage of the microwelds, the surface roughness can be significantly changed and the vertical displacement is the most influential factor. Defects caused by the microwelds formation and breakage can be clearly observed in the simulation results. The achieved information has a high potential to enhance the bonding quality and reliability.
Keywords
- Microwelds formation and breakage, Molecular dynamics simulation, Ultrasonic copper wire bonding
ASJC Scopus subject areas
- Materials Science(all)
- Electronic, Optical and Magnetic Materials
- Engineering(all)
- Electrical and Electronic Engineering
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Proceedings: IEEE 68th Electronic Components and Technology Conference, ECTC 2018. Institute of Electrical and Electronics Engineers Inc., 2018. p. 1434-1439 8429732 (Proceedings - Electronic Components and Technology Conference; Vol. 2018-May).
Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review
}
TY - GEN
T1 - Molecular dynamics simulation of microwelds formation and breakage during ultrasonic copper wire bonding
AU - Long, Yangyang
AU - He, Bo
AU - Cui, Weizhe
AU - Zhuang, Xiaoying
AU - Twiefel, Jens
N1 - Funding information: ACKNOWLEDGMENT The authors gratefully acknowledge the financial support from DFG (Deutsche Forschungsgemeinschaft) program (TW75/8-1|WA564/40-1) and Sofja Kovalevskaja Programme of Alexander von Humboldt Foundation.
PY - 2018/8/7
Y1 - 2018/8/7
N2 - Nowadays ultrasonic (US) copper wire bonding gests more required and applied in power electronics. Despite its large amounts of usage, the underlying bonding mechanisms are still unclear. Among them, the dynamic changes of microwelds are essential to the bonding process as the bonding quality and reliability are greatly influenced by the formed microwelds. In this work, the formation and breakage of microwelds during US copper wire bonding are analyzed by molecular dynamics simulation. Due to the limit of the computational expense, a small local interface consisting of ~40000 atoms is simulated. In the model, the copper substrate is fixed while the movement of the copper wire is imposed. Microwelds are first formed during the downwards moving of the wire and get enlarged with further vertical displacement. The formed microwelds can be broken due to the vibration while new microwelds can be formed in the meantime. Because of the formation, deformation and breakage of the microwelds, the surface roughness can be significantly changed and the vertical displacement is the most influential factor. Defects caused by the microwelds formation and breakage can be clearly observed in the simulation results. The achieved information has a high potential to enhance the bonding quality and reliability.
AB - Nowadays ultrasonic (US) copper wire bonding gests more required and applied in power electronics. Despite its large amounts of usage, the underlying bonding mechanisms are still unclear. Among them, the dynamic changes of microwelds are essential to the bonding process as the bonding quality and reliability are greatly influenced by the formed microwelds. In this work, the formation and breakage of microwelds during US copper wire bonding are analyzed by molecular dynamics simulation. Due to the limit of the computational expense, a small local interface consisting of ~40000 atoms is simulated. In the model, the copper substrate is fixed while the movement of the copper wire is imposed. Microwelds are first formed during the downwards moving of the wire and get enlarged with further vertical displacement. The formed microwelds can be broken due to the vibration while new microwelds can be formed in the meantime. Because of the formation, deformation and breakage of the microwelds, the surface roughness can be significantly changed and the vertical displacement is the most influential factor. Defects caused by the microwelds formation and breakage can be clearly observed in the simulation results. The achieved information has a high potential to enhance the bonding quality and reliability.
KW - Microwelds formation and breakage
KW - Molecular dynamics simulation
KW - Ultrasonic copper wire bonding
UR - http://www.scopus.com/inward/record.url?scp=85051982230&partnerID=8YFLogxK
U2 - 10.1109/ectc.2018.00219
DO - 10.1109/ectc.2018.00219
M3 - Conference contribution
AN - SCOPUS:85051982230
SN - 9781538649985
T3 - Proceedings - Electronic Components and Technology Conference
SP - 1434
EP - 1439
BT - Proceedings
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 68th IEEE Electronic Components and Technology Conference, ECTC 2018
Y2 - 29 May 2018 through 1 June 2018
ER -