LDS manufacturing technology for next generation radio frequency applications

Research output: Chapter in book/report/conference proceedingConference contributionResearchpeer review

Authors

  • Aline Friedrich
  • Bernd Geck
  • Malte Fengler

External Research Organisations

  • LPKF Laser & Electronics AG
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Details

Original languageEnglish
Title of host publication2016 12th International Congress Molded Interconnect Devices
Subtitle of host publicationScientific Proceedings, MID 2016
PublisherInstitute of Electrical and Electronics Engineers Inc.
ISBN (electronic)9781509054282
Publication statusPublished - 8 Nov 2016
Event12th International Congress on Molded Interconnect Devices, MID 2016 - Wurzburg, Germany
Duration: 28 Sept 201629 Sept 2016

Publication series

Name2016 12th International Congress Molded Interconnect Devices - Scientific Proceedings, MID 2016

Abstract

This contribution is focused on Laser Direct Structuring (LDS) fabrication for upcoming generations of RFapplications covering millimeter-wave frequencies. Starting with a short motivation the current situation of LDS fabricated RF devices is presented. Subsequently, the requirements on the manufacturing process for future applications are defined. The main LDS manufacturing parameters and their influences on the RF properties are discussed. Especially the influence of the surface roughness of the applied metalization is considered and evaluated. On the example of a millimeter wave dielectric antenna operating at 24 GHz and 77 GHz the suitability of LDS fabrication is verified. An RF characterization of the test antennas is done and the results are discussed. On basis of this, possible applications, in the automotive as well as consumer sector, are pointed out. Summarizing the main findings of this contribution the next steps to be taken for a fabrication of future LDS MID RF devices are derived.

Keywords

    dielectric horn antenna, laser direct structuring, millimeter wave, molded interconnect devices

ASJC Scopus subject areas

Cite this

LDS manufacturing technology for next generation radio frequency applications. / Friedrich, Aline; Geck, Bernd; Fengler, Malte.
2016 12th International Congress Molded Interconnect Devices : Scientific Proceedings, MID 2016. Institute of Electrical and Electronics Engineers Inc., 2016. 7738939 (2016 12th International Congress Molded Interconnect Devices - Scientific Proceedings, MID 2016).

Research output: Chapter in book/report/conference proceedingConference contributionResearchpeer review

Friedrich, A, Geck, B & Fengler, M 2016, LDS manufacturing technology for next generation radio frequency applications. in 2016 12th International Congress Molded Interconnect Devices : Scientific Proceedings, MID 2016., 7738939, 2016 12th International Congress Molded Interconnect Devices - Scientific Proceedings, MID 2016, Institute of Electrical and Electronics Engineers Inc., 12th International Congress on Molded Interconnect Devices, MID 2016, Wurzburg, Germany, 28 Sept 2016. https://doi.org/10.1109/ICMID.2016.7738939
Friedrich, A., Geck, B., & Fengler, M. (2016). LDS manufacturing technology for next generation radio frequency applications. In 2016 12th International Congress Molded Interconnect Devices : Scientific Proceedings, MID 2016 Article 7738939 (2016 12th International Congress Molded Interconnect Devices - Scientific Proceedings, MID 2016). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/ICMID.2016.7738939
Friedrich A, Geck B, Fengler M. LDS manufacturing technology for next generation radio frequency applications. In 2016 12th International Congress Molded Interconnect Devices : Scientific Proceedings, MID 2016. Institute of Electrical and Electronics Engineers Inc. 2016. 7738939. (2016 12th International Congress Molded Interconnect Devices - Scientific Proceedings, MID 2016). doi: 10.1109/ICMID.2016.7738939
Friedrich, Aline ; Geck, Bernd ; Fengler, Malte. / LDS manufacturing technology for next generation radio frequency applications. 2016 12th International Congress Molded Interconnect Devices : Scientific Proceedings, MID 2016. Institute of Electrical and Electronics Engineers Inc., 2016. (2016 12th International Congress Molded Interconnect Devices - Scientific Proceedings, MID 2016).
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