Details
| Original language | English |
|---|---|
| Title of host publication | Integrated Optics |
| Subtitle of host publication | Devices, Materials, and Technologies XXVII |
| Editors | Sonia M. Garcia-Blanco, Pavel Cheben |
| Publisher | SPIE |
| ISBN (electronic) | 9781510659537 |
| Publication status | Published - 17 Mar 2023 |
| Event | Integrated Optics: Devices, Materials, and Technologies XXVII 2023 - San Francisco, United States Duration: 30 Jan 2023 → 2 Feb 2023 |
Publication series
| Name | Proceedings of SPIE - The International Society for Optical Engineering |
|---|---|
| Volume | 12424 |
| ISSN (Print) | 0277-786X |
| ISSN (electronic) | 1996-756X |
Abstract
Photonic integrated circuits (PIC) have been established for miniaturized, on-chip optical systems. Current approaches for producing PICs mostly rely on semiconductor processing technologies, which are complex and cost-intensive. A promising alternative with the potential to revolutionize PIC fabrication is additive manufacturing (AM), which offers the opportunity to develop tailored and customized waveguide designs for functionalities needed in fast-evolving modern applications like the Internet of Things. Here, an AM technology called laser glass deposition (LGD) is presented for the production of on-chip core-cladding waveguides based on fused silica. Commercially available glass fibers with a diameter of 125 µm are fused onto a quartz glass substrate using a CO2-laser in a 2.5D-printing process. Test series are performed to determine the process window to reach a stable connection between fiber and substrate while maintaining the fiber´s optical functionality. To enable efficient light coupling into the waveguide, the fiber end facets are laser cleaved after the deposition within the same process environment. Again, parameter studies are performed to reach a high surface quality. Both the waveguides and the cleaved surfaces are characterized using different imaging techniques. In addition, the optical properties of the generated waveguides are analyzed.
Keywords
- additive manufacturing, Laser glass deposition, photonic integrated circuits, waveguides
ASJC Scopus subject areas
- Materials Science(all)
- Electronic, Optical and Magnetic Materials
- Physics and Astronomy(all)
- Condensed Matter Physics
- Computer Science(all)
- Computer Science Applications
- Mathematics(all)
- Applied Mathematics
- Engineering(all)
- Electrical and Electronic Engineering
Cite this
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- Harvard
- Apa
- Vancouver
- BibTeX
- RIS
Integrated Optics: Devices, Materials, and Technologies XXVII. ed. / Sonia M. Garcia-Blanco; Pavel Cheben. SPIE, 2023. 124240P (Proceedings of SPIE - The International Society for Optical Engineering; Vol. 12424).
Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review
}
TY - GEN
T1 - Laser-based, on-chip fabrication of glass-based core-cladding waveguides
AU - Kranert, Fabian
AU - Fawaz, Hussein
AU - Hinkelmann, Moritz
AU - Neumann, Jörg
AU - Kracht, Dietmar
N1 - Funding Information: The experiments were founded by the Deutsche Forschungsgemeinschaft (DFG, German Research Foundation) under Germany’s Excellence Strategy within the Cluster of Excellence PhoenixD (EXC 2122, Project ID 390833453).
PY - 2023/3/17
Y1 - 2023/3/17
N2 - Photonic integrated circuits (PIC) have been established for miniaturized, on-chip optical systems. Current approaches for producing PICs mostly rely on semiconductor processing technologies, which are complex and cost-intensive. A promising alternative with the potential to revolutionize PIC fabrication is additive manufacturing (AM), which offers the opportunity to develop tailored and customized waveguide designs for functionalities needed in fast-evolving modern applications like the Internet of Things. Here, an AM technology called laser glass deposition (LGD) is presented for the production of on-chip core-cladding waveguides based on fused silica. Commercially available glass fibers with a diameter of 125 µm are fused onto a quartz glass substrate using a CO2-laser in a 2.5D-printing process. Test series are performed to determine the process window to reach a stable connection between fiber and substrate while maintaining the fiber´s optical functionality. To enable efficient light coupling into the waveguide, the fiber end facets are laser cleaved after the deposition within the same process environment. Again, parameter studies are performed to reach a high surface quality. Both the waveguides and the cleaved surfaces are characterized using different imaging techniques. In addition, the optical properties of the generated waveguides are analyzed.
AB - Photonic integrated circuits (PIC) have been established for miniaturized, on-chip optical systems. Current approaches for producing PICs mostly rely on semiconductor processing technologies, which are complex and cost-intensive. A promising alternative with the potential to revolutionize PIC fabrication is additive manufacturing (AM), which offers the opportunity to develop tailored and customized waveguide designs for functionalities needed in fast-evolving modern applications like the Internet of Things. Here, an AM technology called laser glass deposition (LGD) is presented for the production of on-chip core-cladding waveguides based on fused silica. Commercially available glass fibers with a diameter of 125 µm are fused onto a quartz glass substrate using a CO2-laser in a 2.5D-printing process. Test series are performed to determine the process window to reach a stable connection between fiber and substrate while maintaining the fiber´s optical functionality. To enable efficient light coupling into the waveguide, the fiber end facets are laser cleaved after the deposition within the same process environment. Again, parameter studies are performed to reach a high surface quality. Both the waveguides and the cleaved surfaces are characterized using different imaging techniques. In addition, the optical properties of the generated waveguides are analyzed.
KW - additive manufacturing
KW - Laser glass deposition
KW - photonic integrated circuits
KW - waveguides
UR - http://www.scopus.com/inward/record.url?scp=85159773403&partnerID=8YFLogxK
U2 - 10.1117/12.2649880
DO - 10.1117/12.2649880
M3 - Conference contribution
AN - SCOPUS:85159773403
T3 - Proceedings of SPIE - The International Society for Optical Engineering
BT - Integrated Optics
A2 - Garcia-Blanco, Sonia M.
A2 - Cheben, Pavel
PB - SPIE
T2 - Integrated Optics: Devices, Materials, and Technologies XXVII 2023
Y2 - 30 January 2023 through 2 February 2023
ER -