Details
| Original language | English |
|---|---|
| Article number | 108668 |
| Number of pages | 6 |
| Journal | Diamond and Related Materials |
| Volume | 120 |
| Early online date | 23 Oct 2021 |
| Publication status | Published - Dec 2021 |
Abstract
Machining of tungsten carbide requires the use of highly wear resistant grinding tools, like metal bonded grinding tools. The abrasive layer of these grinding tools can be regarded as Metal-Matrix-Composites reinforced with diamond particles. Copper-Matrix-Composites already are being used as heat sink materials through their outstanding high thermal conductivity. In this work, Cu/Diamond composites with 50 vol% diamond have been fabricated through field assisted sintering and the application of these composites as grinding layers in a deep feed grinding process of tungsten carbide was investigated. Through addition of chromium powder as a carbide former on the surface of the diamond particles, the critical bond strength and therefore the diamond grain retention was significantly increased by +363%. The addition of 2 wt% chromium to the copper matrix also resulted in a +84% increase of thermal conductivity relatively to the chromium free Cu/Diamond composite. Grinding of tungsten carbide as a dynamic stress test showed that the increased grain retention and thermal conductivity resulted in a decrease in grinding layer wear. Further chromium addition to 8 wt% chromium resulted in a decrease in thermal conductivity and the formation of adhesive cloggings on the grinding wheel surface during grinding.
Keywords
- Abrasion, Carbides, Composites, Cutting tools, High pressure high temperature (HTHP), Interface characterization, Mechanical properties characterization, Synthetic diamond, Thermal properties, Wear
ASJC Scopus subject areas
- Materials Science(all)
- Electronic, Optical and Magnetic Materials
- Chemistry(all)
- General Chemistry
- Engineering(all)
- Mechanical Engineering
- Materials Science(all)
- Materials Chemistry
- Engineering(all)
- Electrical and Electronic Engineering
Cite this
- Standard
- Harvard
- Apa
- Vancouver
- BibTeX
- RIS
In: Diamond and Related Materials, Vol. 120, 108668, 12.2021.
Research output: Contribution to journal › Article › Research › peer review
}
TY - JOUR
T1 - Fabrication and use of Cu-Cr-diamond composites for the application in deep feed grinding of tungsten carbide
AU - Denkena, B.
AU - Krödel, A.
AU - Lang, R.
N1 - Funding Information: The authors would like to thank the German Research Foundation (DFG) for their organizational and financial support within the project DE447/184-1 .
PY - 2021/12
Y1 - 2021/12
N2 - Machining of tungsten carbide requires the use of highly wear resistant grinding tools, like metal bonded grinding tools. The abrasive layer of these grinding tools can be regarded as Metal-Matrix-Composites reinforced with diamond particles. Copper-Matrix-Composites already are being used as heat sink materials through their outstanding high thermal conductivity. In this work, Cu/Diamond composites with 50 vol% diamond have been fabricated through field assisted sintering and the application of these composites as grinding layers in a deep feed grinding process of tungsten carbide was investigated. Through addition of chromium powder as a carbide former on the surface of the diamond particles, the critical bond strength and therefore the diamond grain retention was significantly increased by +363%. The addition of 2 wt% chromium to the copper matrix also resulted in a +84% increase of thermal conductivity relatively to the chromium free Cu/Diamond composite. Grinding of tungsten carbide as a dynamic stress test showed that the increased grain retention and thermal conductivity resulted in a decrease in grinding layer wear. Further chromium addition to 8 wt% chromium resulted in a decrease in thermal conductivity and the formation of adhesive cloggings on the grinding wheel surface during grinding.
AB - Machining of tungsten carbide requires the use of highly wear resistant grinding tools, like metal bonded grinding tools. The abrasive layer of these grinding tools can be regarded as Metal-Matrix-Composites reinforced with diamond particles. Copper-Matrix-Composites already are being used as heat sink materials through their outstanding high thermal conductivity. In this work, Cu/Diamond composites with 50 vol% diamond have been fabricated through field assisted sintering and the application of these composites as grinding layers in a deep feed grinding process of tungsten carbide was investigated. Through addition of chromium powder as a carbide former on the surface of the diamond particles, the critical bond strength and therefore the diamond grain retention was significantly increased by +363%. The addition of 2 wt% chromium to the copper matrix also resulted in a +84% increase of thermal conductivity relatively to the chromium free Cu/Diamond composite. Grinding of tungsten carbide as a dynamic stress test showed that the increased grain retention and thermal conductivity resulted in a decrease in grinding layer wear. Further chromium addition to 8 wt% chromium resulted in a decrease in thermal conductivity and the formation of adhesive cloggings on the grinding wheel surface during grinding.
KW - Abrasion
KW - Carbides
KW - Composites
KW - Cutting tools
KW - High pressure high temperature (HTHP)
KW - Interface characterization
KW - Mechanical properties characterization
KW - Synthetic diamond
KW - Thermal properties
KW - Wear
UR - http://www.scopus.com/inward/record.url?scp=85117683341&partnerID=8YFLogxK
U2 - 10.1016/j.diamond.2021.108668
DO - 10.1016/j.diamond.2021.108668
M3 - Article
AN - SCOPUS:85117683341
VL - 120
JO - Diamond and Related Materials
JF - Diamond and Related Materials
SN - 0925-9635
M1 - 108668
ER -