Details
| Original language | English |
|---|---|
| Pages (from-to) | 11-15 |
| Number of pages | 5 |
| Journal | Advances in Radio Science |
| Volume | 7 |
| Publication status | Published - 18 May 2009 |
Abstract
Combining the Molded Interconnect Device technology with the Laser Direct Structuring technology exhibits the potential of designing electrical and mechanical components on three-dimensional surfaces to increase functionality, level of integration and to reduce costs. When taking advantage of this technology especially in the design of RF devices, a precise knowledge of the electromagnetic parameters of the MID material is required, as the complex permeability and permittivity strongly influence the device performance. At present time, these materials are not electromagnetically characterized in the RF frequency range. In this paper different methods are therefore presented and compared with respect to their potentials for broadband electromagnetic characterization of Molded Interconnect Device materials.
ASJC Scopus subject areas
- Engineering(all)
- Electrical and Electronic Engineering
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In: Advances in Radio Science, Vol. 7, 18.05.2009, p. 11-15.
Research output: Contribution to journal › Article › Research › peer review
}
TY - JOUR
T1 - Comparison of methods for broadband electromagnetic characterization of Molded Interconnect Device materials
AU - Orlob, C.
AU - Kornek, D.
AU - Preihs, S.
AU - Rolfes, I.
PY - 2009/5/18
Y1 - 2009/5/18
N2 - Combining the Molded Interconnect Device technology with the Laser Direct Structuring technology exhibits the potential of designing electrical and mechanical components on three-dimensional surfaces to increase functionality, level of integration and to reduce costs. When taking advantage of this technology especially in the design of RF devices, a precise knowledge of the electromagnetic parameters of the MID material is required, as the complex permeability and permittivity strongly influence the device performance. At present time, these materials are not electromagnetically characterized in the RF frequency range. In this paper different methods are therefore presented and compared with respect to their potentials for broadband electromagnetic characterization of Molded Interconnect Device materials.
AB - Combining the Molded Interconnect Device technology with the Laser Direct Structuring technology exhibits the potential of designing electrical and mechanical components on three-dimensional surfaces to increase functionality, level of integration and to reduce costs. When taking advantage of this technology especially in the design of RF devices, a precise knowledge of the electromagnetic parameters of the MID material is required, as the complex permeability and permittivity strongly influence the device performance. At present time, these materials are not electromagnetically characterized in the RF frequency range. In this paper different methods are therefore presented and compared with respect to their potentials for broadband electromagnetic characterization of Molded Interconnect Device materials.
UR - http://www.scopus.com/inward/record.url?scp=71949089814&partnerID=8YFLogxK
U2 - 10.5194/ars-7-11-2009
DO - 10.5194/ars-7-11-2009
M3 - Article
AN - SCOPUS:71949089814
VL - 7
SP - 11
EP - 15
JO - Advances in Radio Science
JF - Advances in Radio Science
SN - 1684-9965
ER -