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Microelectronics Reliability

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Publications

  1. 2021

  2. Published

    Automated Abstraction of Nonlinear Analog Circuits to Reliable Set-Valued Models with Reduced Overapproximation

    Rechmal-Lesse, M., Adhisantoso, Y. G., Koroa, G. A. & Olbrich, M., Jun 2021, In: Microelectronics Reliability. 121, 114119.

    Research output: Contribution to journal › Article › Research › peer review

  3. Published

    Thermal analysis of the design parameters of a QFN package soldered on a PCB using a simulation approach

    Hollstein, K., Yang, X. & Weide-Zaage, K., May 2021, In: Microelectronics reliability. 120, 114118.

    Research output: Contribution to journal › Article › Research › peer review

  4. 2017

  5. Published

    Simulation of packaging under harsh environment conditions (temperature, pressure, corrosion and radiation)

    Weide-Zaage, K., Sept 2017, In: Microelectronics reliability. 76-77, p. 6-12 7 p.

    Research output: Contribution to journal › Article › Research › peer review

  6. 2016

  7. Published

    Effects of salt spray test on lead-free solder alloy

    Guédon-Gracia, A., Frémont, H., Plano, B., Delétage, J. Y. & Weide-Zaage, K., 1 Sept 2016, In: Microelectronics reliability. 64, p. 242-247 6 p.

    Research output: Contribution to journal › Article › Research › peer review

  8. Published

    Reliability evaluation of tungsten donut-via as an element of the highly robust metallization

    Hein, V., Erstling, M., Sethu, R. S., Weide-Zaage, K. & Bai, T., 1 Sept 2016, In: Microelectronics reliability. 64, p. 259-265 7 p.

    Research output: Contribution to journal › Article › Research › peer review

  9. 2015

  10. Published

    Dynamical IMC-growth calculation

    Meinshausen, L., Weide-Zaage, K. & Frémont, H., Aug 2015, In: Microelectronics reliability. 55, 9-10, p. 1832-1837 6 p.

    Research output: Contribution to journal › Article › Research › peer review

  11. Published

    Effect of thermal aging on the electrical resistivity of Fe-added SAC105 solder alloys

    Sabri, M. F. M., Nordin, N. I. M., Said, S. M., Amin, N. A. A. M., Arof, H., Jauhari, I., Ramli, R. & Weide-Zaage, K., Aug 2015, In: Microelectronics reliability. 55, 9-10, p. 1882-1885 4 p.

    Research output: Contribution to journal › Article › Research › peer review

  12. Published

    Electro- and thermomigration induced Cu3Sn and Cu6Sn5 formation in SnAg3.0Cu0.5 bumps

    Meinshausen, L., Frémont, H., Weide-Zaage, K. & Plano, B., 1 Jan 2015, In: Microelectronics reliability. 55, 1, p. 192-200 9 p.

    Research output: Contribution to journal › Article › Research › peer review

  13. 2014

  14. Published

    Degradation behavior in upstream/downstream via test structures

    Kludt, J., Weide-Zaage, K., Ackermann, M., Hein, V. & Kovács, C., 1 Sept 2014, In: Microelectronics reliability. 54, 9-10, p. 1724-1728 5 p.

    Research output: Contribution to journal › Article › Research › peer review

  15. Published

    Evaluation new corner stress relief structure layout for high robust metallization

    Hein, V., Kludt, J. & Weide-Zaage, K., 1 Sept 2014, In: Microelectronics reliability. 54, 9-10, p. 1977-1981 5 p.

    Research output: Contribution to journal › Article › Research › peer review

  16. Published

    Qualification procedure for moisture in embedded capacitors

    Frémont, H., Kludt, J., Wade, M., Weide-Zaage, K., Bord-Majek, I. & Duchamp, G., 1 Sept 2014, In: Microelectronics reliability. 54, 9-10, p. 2013-2016 4 p.

    Research output: Contribution to journal › Article › Research › peer review

  17. Published

    Reliability of wafer level chip scale packages

    Rongen, R., Roucou, R., Vd Wel, P. J., Voogt, F., Swartjes, F. & Weide-Zaage, K., 1 Sept 2014, In: Microelectronics reliability. 54, 9-10, p. 1988-1994 7 p.

    Research output: Contribution to journal › Article › Research › peer review

  18. Published

    Robustness measurement of integrated circuits and its adaptation to aging effects.

    Barke, M., Kärgel, M., Olbrich, M. & Schlichtmann, U., 2014, In: Microelectron. Reliab.. 54, 6-7, p. 1058-1065

    Research output: Contribution to journal › Article › Research › peer review

  19. Published

    Simulation and measurement of the flip chip solder bumps with a Cu-plated plastic core

    Weide-Zaage, K., Schlobohm, J., Rongen, R. T. H., Voogt, F. C. & Roucou, R., 2014, In: Microelectronics reliability. 54, 6-7, p. 1206-1211 6 p.

    Research output: Contribution to journal › Article › Research › peer review

  20. 2013

  21. Published

    Dynamic simulation of migration induced failure mechanism in integrated circuit interconnects

    Moujbani, A., Kludt, J., Weide-Zaage, K., Ackermann, M., Hein, V. & Meinshausen, L., Sept 2013, In: Microelectronics reliability. 53, 9-11, p. 1365-1369 5 p.

    Research output: Contribution to journal › Article › Research › peer review

  22. Published

    Dynamic simulation of octahedron slotted metal structures

    Kludt, J., Weide-Zaage, K., Ackermann, M. & Hein, V., Sept 2013, In: Microelectronics reliability. 53, 9-11, p. 1606-1610 5 p.

    Research output: Contribution to journal › Article › Research › peer review

  23. Published

    Electro- and thermomigration-induced IMC formation in SnAg 3.0Cu0.5 solder joints on nickel gold pads

    Meinshausen, L., Frémont, H., Weide-Zaage, K. & Plano, B., Sept 2013, In: Microelectronics reliability. 53, 9-11, p. 1575-1580 6 p.

    Research output: Contribution to journal › Article › Research › peer review

  24. 2012

  25. Published

    Electro- and thermo-migration induced failure mechanisms in Package on Package

    Meinshausen, L., Weide-Zaage, K. & Frémont, H., Dec 2012, In: Microelectronics reliability. 52, 12, p. 2889-2906 18 p.

    Research output: Contribution to journal › Review article › Research › peer review

  26. Published

    A design for robust wide metal tracks

    Ackermann, M., Hein, V., Kovács, C. & Weide-Zaage, K., Sept 2012, In: Microelectronics reliability. 52, 9-10, p. 2447-2451 5 p.

    Research output: Contribution to journal › Article › Research › peer review

  27. Published

    Migration induced IMC formation in SAC305 solder joints on Cu, NiAu and NiP metal layers

    Meinshausen, L., Frémont, H. & Weide-Zaage, K., Sept 2012, In: Microelectronics reliability. 52, 9-10, p. 1827-1832 6 p.

    Research output: Contribution to journal › Article › Research › peer review

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