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Microelectronics Reliability

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Publications

  1. 2012

  2. Published

    Simulation of the influence of TiAl 3 layers on the thermal-electrical and mechanical behaviour of Al metallizations

    Kludt, J., Weide-Zaage, K., Ackermann, M. & Hein, V., Sept 2012, In: Microelectronics reliability. 52, 9-10, p. 1987-1992 6 p.

    Research output: Contribution to journal › Article › Research › peer review

  3. 2011

  4. Published

    Influence of air gaps on the thermal-electrical-mechanical behavior of a copper metallization

    Bauer, I., Weide-Zaage, K. & Meinshausen, L., Sept 2011, In: Microelectronics reliability. 51, 9-11, p. 1587-1591 5 p.

    Research output: Contribution to journal › Article › Research › peer review

  5. Published

    Migration induced material transport in Cu-Sn IMC and SnAgCu microbumps

    Meinshausen, L., Weide-Zaage, K. & Frémont, H., Sept 2011, In: Microelectronics reliability. 51, 9-11, p. 1860-1864 5 p.

    Research output: Contribution to journal › Article › Research › peer review

  6. 2009

  7. Published

    Investigation of stress distribution in via bottom of Cu-via structures with different via form by means of submodeling

    Ciptokusumo, J., Weide-Zaage, K. & Aubel, O., Sept 2009, In: Microelectronics reliability. 49, 9-11, p. 1090-1095 6 p.

    Research output: Contribution to journal › Article › Research › peer review

  8. 2008

  9. Published

    Determination of migration effects in Cu-via structures with respect to process-induced stress

    Weide-Zaage, K., Zhao, J., Ciptokusumo, J. & Aubel, O., Aug 2008, In: Microelectronics reliability. 48, 8-9, p. 1393-1397 5 p.

    Research output: Contribution to journal › Article › Research › peer review

  10. Published

    Simulation of migration effects in nanoscaled copper metallizations

    Weide-Zaage, K., Kashanchi, F. & Aubel, O., Aug 2008, In: Microelectronics reliability. 48, 8-9, p. 1398-1402 5 p.

    Research output: Contribution to journal › Article › Research › peer review

  11. 2007

  12. Published

    Dynamic void formation in a DD-copper-structure with different metallization geometry

    Weide-Zaage, K., Dalleau, D., Danto, Y. & Fremont, H., Feb 2007, In: Microelectronics reliability. 47, 2-3, p. 319-325 7 p.

    Research output: Contribution to journal › Article › Research › peer review

  13. 2005

  14. Published

    Moisture diffusion in printed circuit boards: Measurements and finite- element- simulations

    Weide-Zaage, K., Horaud, W. & Frémont, H., Sept 2005, In: Microelectronics reliability. 45, 9-11, p. 1662-1667 6 p.

    Research output: Contribution to journal › Article › Research › peer review

  15. 2004

  16. Published

    How to study delamination in plastic encapsulated devices

    Frémont, H., Delétage, J. Y., Weide-Zaage, K. & Danto, Y., Sept 2004, In: Microelectronics reliability. 44, 9-11 SPEC. ISS., p. 1311-1316 6 p.

    Research output: Contribution to journal › Article › Research › peer review

  17. 2003

  18. Published

    Simulation of time depending void formation in copper, aluminum and tungsten plugged via structures

    Dalleau, D., Weide-Zaage, K. & Danto, Y., Sept 2003, In: Microelectronics reliability. 43, 9-11, p. 1821-1826 6 p.

    Research output: Contribution to journal › Conference article › Research › peer review

  19. 2001

  20. Published

    Three-dimensional voids simulation in chip metallization structures: A contribution to reliability evaluation

    Dalleau, D. & Weide-Zaage, K., Sept 2001, In: Microelectronics reliability. 41, 9-10, p. 1625-1630 6 p.

    Research output: Contribution to journal › Article › Research › peer review

  21. External

    Epitaxial, high-K dielectrics on silicon: The example of praseodymium oxide

    Osten, H. J., Liu, J. P., Müssig, H. J. & Zaumseil, P., Jul 2001, In: Microelectronics reliability. 41, 7, p. 991-994 4 p.

    Research output: Contribution to journal › Article › Research › peer review

  22. 1999

  23. Published

    Impact of FEM simulation on reliability improvement of packaging

    Weide, K., 1999, In: Microelectronics reliability. 39, 6-7, p. 1079-1088 10 p.

    Research output: Contribution to journal › Conference article › Research › peer review

  24. 1997

  25. Published

    A study of the thermal - electrical- and mechanical influence on degradation in an aluminum - pad structure

    Yu, X. & Weide, K., 1997, In: Microelectronics reliability. 37, 10-11, p. 1545-1548 4 p.

    Research output: Contribution to journal › Article › Research › peer review

  26. 1996

  27. Published

    Finite element investigations of mechanical stress in metallization structures

    Weide, K., Yu, X. & Menhorn, F., 1996, In: Microelectronics reliability. 36, 11-12 SPEC. ISS., p. 1703-1706 4 p.

    Research output: Contribution to journal › Article › Research › peer review

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