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Microelectronics Reliability

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Publications

  1. 2021

  2. Published

    Automated Abstraction of Nonlinear Analog Circuits to Reliable Set-Valued Models with Reduced Overapproximation

    Rechmal-Lesse, M., Adhisantoso, Y. G., Koroa, G. A. & Olbrich, M., Jun 2021, In: Microelectronics Reliability. 121, 114119.

    Research output: Contribution to journal › Article › Research › peer review

  3. Published

    Thermal analysis of the design parameters of a QFN package soldered on a PCB using a simulation approach

    Hollstein, K., Yang, X. & Weide-Zaage, K., May 2021, In: Microelectronics reliability. 120, 114118.

    Research output: Contribution to journal › Article › Research › peer review

  4. 2017

  5. Published

    Simulation of packaging under harsh environment conditions (temperature, pressure, corrosion and radiation)

    Weide-Zaage, K., Sept 2017, In: Microelectronics reliability. 76-77, p. 6-12 7 p.

    Research output: Contribution to journal › Article › Research › peer review

  6. 2016

  7. Published

    Effects of salt spray test on lead-free solder alloy

    Guédon-Gracia, A., Frémont, H., Plano, B., Delétage, J. Y. & Weide-Zaage, K., 1 Sept 2016, In: Microelectronics reliability. 64, p. 242-247 6 p.

    Research output: Contribution to journal › Article › Research › peer review

  8. Published

    Reliability evaluation of tungsten donut-via as an element of the highly robust metallization

    Hein, V., Erstling, M., Sethu, R. S., Weide-Zaage, K. & Bai, T., 1 Sept 2016, In: Microelectronics reliability. 64, p. 259-265 7 p.

    Research output: Contribution to journal › Article › Research › peer review

  9. 2015

  10. Published

    Dynamical IMC-growth calculation

    Meinshausen, L., Weide-Zaage, K. & Frémont, H., Aug 2015, In: Microelectronics reliability. 55, 9-10, p. 1832-1837 6 p.

    Research output: Contribution to journal › Article › Research › peer review

  11. Published

    Effect of thermal aging on the electrical resistivity of Fe-added SAC105 solder alloys

    Sabri, M. F. M., Nordin, N. I. M., Said, S. M., Amin, N. A. A. M., Arof, H., Jauhari, I., Ramli, R. & Weide-Zaage, K., Aug 2015, In: Microelectronics reliability. 55, 9-10, p. 1882-1885 4 p.

    Research output: Contribution to journal › Article › Research › peer review

  12. Published

    Electro- and thermomigration induced Cu3Sn and Cu6Sn5 formation in SnAg3.0Cu0.5 bumps

    Meinshausen, L., Frémont, H., Weide-Zaage, K. & Plano, B., 1 Jan 2015, In: Microelectronics reliability. 55, 1, p. 192-200 9 p.

    Research output: Contribution to journal › Article › Research › peer review

  13. 2014

  14. Published

    Degradation behavior in upstream/downstream via test structures

    Kludt, J., Weide-Zaage, K., Ackermann, M., Hein, V. & Kovács, C., 1 Sept 2014, In: Microelectronics reliability. 54, 9-10, p. 1724-1728 5 p.

    Research output: Contribution to journal › Article › Research › peer review

  15. Published

    Evaluation new corner stress relief structure layout for high robust metallization

    Hein, V., Kludt, J. & Weide-Zaage, K., 1 Sept 2014, In: Microelectronics reliability. 54, 9-10, p. 1977-1981 5 p.

    Research output: Contribution to journal › Article › Research › peer review

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