Thin Film Transferring via PVA Substrate and Contacting of Sensor inside Elastomer Matrix

Publikation: Beitrag in Buch/Bericht/Sammelwerk/KonferenzbandAufsatz in KonferenzbandForschungPeer-Review

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  • Deutsches Institut für Kautschuktechnologie e.V. (DIK)
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OriginalspracheEnglisch
Titel des SammelwerksIEEE Sensors, SENSORS 2020
UntertitelConference Proceedings
Herausgeber (Verlag)Institute of Electrical and Electronics Engineers Inc.
ISBN (elektronisch)9781728168012
ISBN (Print)978-1-7281-6802-9
PublikationsstatusVeröffentlicht - 2020
Veranstaltung2020 IEEE Sensors, SENSORS 2020 - Virtual, Rotterdam, Niederlande
Dauer: 25 Okt. 202028 Okt. 2020

Publikationsreihe

NameProceedings of IEEE Sensors
Band2020-October
ISSN (Print)1930-0395
ISSN (elektronisch)2168-9229

Abstract

The integration of sensor-systems into elastomer bodies or onto flexible surfaces is a challenging task. Therefore, a new approach has been developed and investigated to create thin-film-based structures via PVD (physical vapor deposition) processes on water-soluble substrates such as polyvinyl-alcohol (PVA) and subsequently transferring the sensor structures onto unvulcanized rubber substrates. A contacting method using conductive polymer composites creates a reliable technique to electrically contact transferred thin film layers within an elastomer sandwich matrix.

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Thin Film Transferring via PVA Substrate and Contacting of Sensor inside Elastomer Matrix. / Bengsch, Sebastian; Giese, Ulrich; Fischer, Eike et al.
IEEE Sensors, SENSORS 2020: Conference Proceedings. Institute of Electrical and Electronics Engineers Inc., 2020. 9278876 (Proceedings of IEEE Sensors; Band 2020-October).

Publikation: Beitrag in Buch/Bericht/Sammelwerk/KonferenzbandAufsatz in KonferenzbandForschungPeer-Review

Bengsch, S, Giese, U, Fischer, E & Wurz, MC 2020, Thin Film Transferring via PVA Substrate and Contacting of Sensor inside Elastomer Matrix. in IEEE Sensors, SENSORS 2020: Conference Proceedings., 9278876, Proceedings of IEEE Sensors, Bd. 2020-October, Institute of Electrical and Electronics Engineers Inc., 2020 IEEE Sensors, SENSORS 2020, Virtual, Rotterdam, Niederlande, 25 Okt. 2020. https://doi.org/10.1109/SENSORS47125.2020.9278876
Bengsch, S., Giese, U., Fischer, E., & Wurz, M. C. (2020). Thin Film Transferring via PVA Substrate and Contacting of Sensor inside Elastomer Matrix. In IEEE Sensors, SENSORS 2020: Conference Proceedings Artikel 9278876 (Proceedings of IEEE Sensors; Band 2020-October). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/SENSORS47125.2020.9278876
Bengsch S, Giese U, Fischer E, Wurz MC. Thin Film Transferring via PVA Substrate and Contacting of Sensor inside Elastomer Matrix. in IEEE Sensors, SENSORS 2020: Conference Proceedings. Institute of Electrical and Electronics Engineers Inc. 2020. 9278876. (Proceedings of IEEE Sensors). doi: 10.1109/SENSORS47125.2020.9278876
Bengsch, Sebastian ; Giese, Ulrich ; Fischer, Eike et al. / Thin Film Transferring via PVA Substrate and Contacting of Sensor inside Elastomer Matrix. IEEE Sensors, SENSORS 2020: Conference Proceedings. Institute of Electrical and Electronics Engineers Inc., 2020. (Proceedings of IEEE Sensors).
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AU - Fischer, Eike

AU - Wurz, Marc Christopher

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