Details
Originalsprache | Englisch |
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Titel des Sammelwerks | Extended Abstracts of the 2021 CHI Conference on Human Factors in Computing Systems, CHI EA 2021 |
Erscheinungsort | New York, NY, US |
Herausgeber (Verlag) | Association for Computing Machinery (ACM) |
Seiten | 1-5 |
ISBN (elektronisch) | 9781450380959 |
Publikationsstatus | Veröffentlicht - Mai 2021 |
Veranstaltung | CHI Conference on Human Factors in Computing Systems: Making Waves, Combining Strengths (CHI EA 2021) - Virtual, Online, Japan Dauer: 8 Mai 2021 → 13 Mai 2021 |
Publikationsreihe
Name | Conference on Human Factors in Computing Systems - Proceedings |
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Abstract
We present SpectroPhone, a surface material sensing approach based on the rear camera of a smartphone and external white LED light sources. Warm and cool white LEDs, as used for dual or quad flashlights in smartphones, differ in their spectral distribution in the red and blue range. Warm and cool white LEDs in combination can produce a characteristic spectral response curve, when their light is reflected from a surface. We show that with warm and cool white LEDs and the rear-camera of a smartphone 30 different materials can be distinguished with an accuracy of 99 %. Based on a dataset consisting of 13500 images of material surfaces taken at different LED light intensities, we report recognition rates of support vector machines with different parameters.
ASJC Scopus Sachgebiete
- Informatik (insg.)
- Mensch-Maschine-Interaktion
- Informatik (insg.)
- Computergrafik und computergestütztes Design
- Informatik (insg.)
- Software
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- BibTex
- RIS
Extended Abstracts of the 2021 CHI Conference on Human Factors in Computing Systems, CHI EA 2021. New York, NY, US: Association for Computing Machinery (ACM), 2021. S. 1-5 336 (Conference on Human Factors in Computing Systems - Proceedings).
Publikation: Beitrag in Buch/Bericht/Sammelwerk/Konferenzband › Aufsatz in Konferenzband › Forschung › Peer-Review
}
TY - GEN
T1 - SpectroPhone
T2 - CHI Conference on Human Factors in Computing Systems: Making Waves, Combining Strengths (CHI EA 2021)
AU - Schrapel, Maximilian
AU - Etgeton, Philipp
AU - Rohs, Michael
PY - 2021/5
Y1 - 2021/5
N2 - We present SpectroPhone, a surface material sensing approach based on the rear camera of a smartphone and external white LED light sources. Warm and cool white LEDs, as used for dual or quad flashlights in smartphones, differ in their spectral distribution in the red and blue range. Warm and cool white LEDs in combination can produce a characteristic spectral response curve, when their light is reflected from a surface. We show that with warm and cool white LEDs and the rear-camera of a smartphone 30 different materials can be distinguished with an accuracy of 99 %. Based on a dataset consisting of 13500 images of material surfaces taken at different LED light intensities, we report recognition rates of support vector machines with different parameters.
AB - We present SpectroPhone, a surface material sensing approach based on the rear camera of a smartphone and external white LED light sources. Warm and cool white LEDs, as used for dual or quad flashlights in smartphones, differ in their spectral distribution in the red and blue range. Warm and cool white LEDs in combination can produce a characteristic spectral response curve, when their light is reflected from a surface. We show that with warm and cool white LEDs and the rear-camera of a smartphone 30 different materials can be distinguished with an accuracy of 99 %. Based on a dataset consisting of 13500 images of material surfaces taken at different LED light intensities, we report recognition rates of support vector machines with different parameters.
KW - Material sensing
KW - Mobile Interaction
KW - Pattern recognition
UR - http://www.scopus.com/inward/record.url?scp=85105776624&partnerID=8YFLogxK
U2 - 10.1145/3411763.3451753
DO - 10.1145/3411763.3451753
M3 - Conference contribution
AN - SCOPUS:85105776624
T3 - Conference on Human Factors in Computing Systems - Proceedings
SP - 1
EP - 5
BT - Extended Abstracts of the 2021 CHI Conference on Human Factors in Computing Systems, CHI EA 2021
PB - Association for Computing Machinery (ACM)
CY - New York, NY, US
Y2 - 8 May 2021 through 13 May 2021
ER -