Contact resistance of various metallisation schemes to superconducting boron doped diamond between 1.9 and 300 K

Publikation: Beitrag in FachzeitschriftArtikelForschungPeer-Review

Autoren

  • Scott Manifold
  • Georgina Klemencic
  • Evan L.H. Thomas
  • Soumen Mandal
  • Henry Alexander Bland
  • Sean R. Giblin
  • Oliver A. Williams

Externe Organisationen

  • Cardiff University
Forschungs-netzwerk anzeigen

Details

OriginalspracheEnglisch
Seiten (von - bis)13-19
Seitenumfang7
FachzeitschriftCARBON
Jahrgang179
PublikationsstatusVeröffentlicht - Juli 2021
Extern publiziertJa

Abstract

Diamond is a material that offers potential in numerous device applications. In particular, highly boron doped diamond is attractive due to its superconductivity and high Young's Modulus. The fabrication of stable, low resistance, ohmic contacts is essential to ensure proper device function. Previous work has established the efficacy of several methods of forming suitable contacts to diamond at room temperature and above, including carbide forming and carbon soluble metallisation schemes. Herein, the stability of several contact schemes (Ti, Cr, Mo, Ta and Pd) to highly boron doped nanocrystalline diamond was verified down to the cryogenic temperatures with modified Transmission Line Model (TLM) measurements. While all contact schemes remained ohmic, a significant temperature dependency is noted at T c and at the lowest temperatures the contact resistances ranged from Ti/Pt/Au with (8.83 ± 0.10) × 10 −4 Ω cm to Ta/Pt/Au with (8.07 ± 0.62) × 10 −6 Ω cm.

ASJC Scopus Sachgebiete

Zitieren

Contact resistance of various metallisation schemes to superconducting boron doped diamond between 1.9 and 300 K. / Manifold, Scott; Klemencic, Georgina; Thomas, Evan L.H. et al.
in: CARBON, Jahrgang 179, 07.2021, S. 13-19.

Publikation: Beitrag in FachzeitschriftArtikelForschungPeer-Review

Manifold S, Klemencic G, Thomas ELH, Mandal S, Bland HA, Giblin SR et al. Contact resistance of various metallisation schemes to superconducting boron doped diamond between 1.9 and 300 K. CARBON. 2021 Jul;179:13-19. doi: 10.1016/j.carbon.2021.02.079
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abstract = "Diamond is a material that offers potential in numerous device applications. In particular, highly boron doped diamond is attractive due to its superconductivity and high Young's Modulus. The fabrication of stable, low resistance, ohmic contacts is essential to ensure proper device function. Previous work has established the efficacy of several methods of forming suitable contacts to diamond at room temperature and above, including carbide forming and carbon soluble metallisation schemes. Herein, the stability of several contact schemes (Ti, Cr, Mo, Ta and Pd) to highly boron doped nanocrystalline diamond was verified down to the cryogenic temperatures with modified Transmission Line Model (TLM) measurements. While all contact schemes remained ohmic, a significant temperature dependency is noted at T c and at the lowest temperatures the contact resistances ranged from Ti/Pt/Au with (8.83 ± 0.10) × 10 −4 Ω cm to Ta/Pt/Au with (8.07 ± 0.62) × 10 −6 Ω cm.",
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AU - Manifold, Scott

AU - Klemencic, Georgina

AU - Thomas, Evan L.H.

AU - Mandal, Soumen

AU - Bland, Henry Alexander

AU - Giblin, Sean R.

AU - Williams, Oliver A.

N1 - Publisher Copyright: © 2021

PY - 2021/7

Y1 - 2021/7

N2 - Diamond is a material that offers potential in numerous device applications. In particular, highly boron doped diamond is attractive due to its superconductivity and high Young's Modulus. The fabrication of stable, low resistance, ohmic contacts is essential to ensure proper device function. Previous work has established the efficacy of several methods of forming suitable contacts to diamond at room temperature and above, including carbide forming and carbon soluble metallisation schemes. Herein, the stability of several contact schemes (Ti, Cr, Mo, Ta and Pd) to highly boron doped nanocrystalline diamond was verified down to the cryogenic temperatures with modified Transmission Line Model (TLM) measurements. While all contact schemes remained ohmic, a significant temperature dependency is noted at T c and at the lowest temperatures the contact resistances ranged from Ti/Pt/Au with (8.83 ± 0.10) × 10 −4 Ω cm to Ta/Pt/Au with (8.07 ± 0.62) × 10 −6 Ω cm.

AB - Diamond is a material that offers potential in numerous device applications. In particular, highly boron doped diamond is attractive due to its superconductivity and high Young's Modulus. The fabrication of stable, low resistance, ohmic contacts is essential to ensure proper device function. Previous work has established the efficacy of several methods of forming suitable contacts to diamond at room temperature and above, including carbide forming and carbon soluble metallisation schemes. Herein, the stability of several contact schemes (Ti, Cr, Mo, Ta and Pd) to highly boron doped nanocrystalline diamond was verified down to the cryogenic temperatures with modified Transmission Line Model (TLM) measurements. While all contact schemes remained ohmic, a significant temperature dependency is noted at T c and at the lowest temperatures the contact resistances ranged from Ti/Pt/Au with (8.83 ± 0.10) × 10 −4 Ω cm to Ta/Pt/Au with (8.07 ± 0.62) × 10 −6 Ω cm.

KW - Contact resistance

KW - Diamond: boron doped

KW - Metal contacts

KW - Superconductivity

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