Details
| Originalsprache | Englisch |
|---|---|
| Titel des Sammelwerks | German Microwave Conference |
| Untertitel | GeMIC 2009 |
| Herausgeber (Verlag) | Institute of Electrical and Electronics Engineers Inc. |
| Seitenumfang | 4 |
| ISBN (Print) | 9783981266801 |
| Publikationsstatus | Veröffentlicht - 16 März 2009 |
| Veranstaltung | German Microwave Conference, GeMIC 2009 - Munich, Deutschland Dauer: 16 März 2009 → 18 März 2009 |
Abstract
The use of the Molded Interconnect Device technology combined with the Laser Direct Structuring technology exhibits the potential of designing electrical and mechanical components on three-dimensional surfaces to increase unctionality, level of integration and to reduce costs. When taking advantage of these technologies especially in the design of RF devices, a precise knowledge of the electromagnetic parameters of the MID material is required, as the complex permeability and permittivity strongly influence the device performance. At present time, these materials are not electromagnetically characterized in the RF frequency range. Therefore this paper presents a broadband electromagnetic characterization of an exemplarily chosen Molded Interconnect Device material. On the basis of the measurement results a first simple antenna design is realized and its measured and simulated input reflection coefficients are compared.
ASJC Scopus Sachgebiete
- Informatik (insg.)
- Hardware und Architektur
- Ingenieurwesen (insg.)
- Elektrotechnik und Elektronik
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German Microwave Conference: GeMIC 2009. Institute of Electrical and Electronics Engineers Inc., 2009. 4815856.
Publikation: Beitrag in Buch/Bericht/Sammelwerk/Konferenzband › Aufsatz in Konferenzband › Forschung › Peer-Review
}
TY - GEN
T1 - Characterization of Electromagnetic Properties of Molded Interconnect Device Materials
AU - Orlob, Christian
AU - Kornek, Daniel
AU - Preihs, Stephan
AU - Rolfes, Ilona
PY - 2009/3/16
Y1 - 2009/3/16
N2 - The use of the Molded Interconnect Device technology combined with the Laser Direct Structuring technology exhibits the potential of designing electrical and mechanical components on three-dimensional surfaces to increase unctionality, level of integration and to reduce costs. When taking advantage of these technologies especially in the design of RF devices, a precise knowledge of the electromagnetic parameters of the MID material is required, as the complex permeability and permittivity strongly influence the device performance. At present time, these materials are not electromagnetically characterized in the RF frequency range. Therefore this paper presents a broadband electromagnetic characterization of an exemplarily chosen Molded Interconnect Device material. On the basis of the measurement results a first simple antenna design is realized and its measured and simulated input reflection coefficients are compared.
AB - The use of the Molded Interconnect Device technology combined with the Laser Direct Structuring technology exhibits the potential of designing electrical and mechanical components on three-dimensional surfaces to increase unctionality, level of integration and to reduce costs. When taking advantage of these technologies especially in the design of RF devices, a precise knowledge of the electromagnetic parameters of the MID material is required, as the complex permeability and permittivity strongly influence the device performance. At present time, these materials are not electromagnetically characterized in the RF frequency range. Therefore this paper presents a broadband electromagnetic characterization of an exemplarily chosen Molded Interconnect Device material. On the basis of the measurement results a first simple antenna design is realized and its measured and simulated input reflection coefficients are compared.
UR - http://www.scopus.com/inward/record.url?scp=67650164434&partnerID=8YFLogxK
U2 - 10.1109/GEMIC.2009.4815856
DO - 10.1109/GEMIC.2009.4815856
M3 - Conference contribution
AN - SCOPUS:67650164434
SN - 9783981266801
BT - German Microwave Conference
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - German Microwave Conference, GeMIC 2009
Y2 - 16 March 2009 through 18 March 2009
ER -