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Carbon doped SiGe heterojunction bipolar transistor module suitable for integration in a deep submicron CMOS process

Publikation: KonferenzbeitragPaperForschungPeer-Review

Autorschaft

  • H. J. Osten
  • D. Knoll
  • B. Heinemann
  • H. Rucker

Details

OriginalspracheEnglisch
Seiten19
Seitenumfang1
PublikationsstatusVeröffentlicht - 2000
Veranstaltung12 Asia-Pacific Microwave Conference - Sydney, Australia
Dauer: 3 Dez. 20006 Dez. 2000

Konferenz

Konferenz12 Asia-Pacific Microwave Conference
OrtSydney, Australia
Zeitraum3 Dez. 20006 Dez. 2000

Abstract

The incorporation of low concentrations of carbon (<10 20 cm -3) into the SiGe region of a heterojunction bipolar transistor (HBT) can significantly suppress boron outdiffusion caused by subsequent processing steps. This effect can be described by coupled diffusion of carbon atoms and Si point defects. We discuss the increase in performance and process margins in SiGe heterojunction bipolar technology by adding carbon. SiGe:C HBTs demonstrate excellent static parameters, exceeding the performance of state-of-the art SiGe:C HBTs C also enhances the high frequency performance, because it allows one to use a high B doping level in a very thin SiGe base layer without outdiffusion from SiGe, even if applying post-epitaxial implants and anneals. Finally, we demonstrate the first modular integration of SiGe:C HBTs into a 0.25 μm, epi-free, dual-gate CMOS platform.

ASJC Scopus Sachgebiete

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Carbon doped SiGe heterojunction bipolar transistor module suitable for integration in a deep submicron CMOS process. / Osten, H. J.; Knoll, D.; Heinemann, B. et al.
2000. 19 Beitrag in 12 Asia-Pacific Microwave Conference, Sydney, Australia.

Publikation: KonferenzbeitragPaperForschungPeer-Review

Osten, HJ, Knoll, D, Heinemann, B, Rucker, H & Ehwald, KE 2000, 'Carbon doped SiGe heterojunction bipolar transistor module suitable for integration in a deep submicron CMOS process', Beitrag in 12 Asia-Pacific Microwave Conference, Sydney, Australia, 3 Dez. 2000 - 6 Dez. 2000 S. 19.
Osten, H. J., Knoll, D., Heinemann, B., Rucker, H., & Ehwald, K. E. (2000). Carbon doped SiGe heterojunction bipolar transistor module suitable for integration in a deep submicron CMOS process. 19. Beitrag in 12 Asia-Pacific Microwave Conference, Sydney, Australia.
Osten HJ, Knoll D, Heinemann B, Rucker H, Ehwald KE. Carbon doped SiGe heterojunction bipolar transistor module suitable for integration in a deep submicron CMOS process. 2000. Beitrag in 12 Asia-Pacific Microwave Conference, Sydney, Australia.
Osten, H. J. ; Knoll, D. ; Heinemann, B. et al. / Carbon doped SiGe heterojunction bipolar transistor module suitable for integration in a deep submicron CMOS process. Beitrag in 12 Asia-Pacific Microwave Conference, Sydney, Australia.1 S.
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AU - Osten, H. J.

AU - Knoll, D.

AU - Heinemann, B.

AU - Rucker, H.

AU - Ehwald, K. E.

PY - 2000

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N2 - The incorporation of low concentrations of carbon (<10 20 cm -3) into the SiGe region of a heterojunction bipolar transistor (HBT) can significantly suppress boron outdiffusion caused by subsequent processing steps. This effect can be described by coupled diffusion of carbon atoms and Si point defects. We discuss the increase in performance and process margins in SiGe heterojunction bipolar technology by adding carbon. SiGe:C HBTs demonstrate excellent static parameters, exceeding the performance of state-of-the art SiGe:C HBTs C also enhances the high frequency performance, because it allows one to use a high B doping level in a very thin SiGe base layer without outdiffusion from SiGe, even if applying post-epitaxial implants and anneals. Finally, we demonstrate the first modular integration of SiGe:C HBTs into a 0.25 μm, epi-free, dual-gate CMOS platform.

AB - The incorporation of low concentrations of carbon (<10 20 cm -3) into the SiGe region of a heterojunction bipolar transistor (HBT) can significantly suppress boron outdiffusion caused by subsequent processing steps. This effect can be described by coupled diffusion of carbon atoms and Si point defects. We discuss the increase in performance and process margins in SiGe heterojunction bipolar technology by adding carbon. SiGe:C HBTs demonstrate excellent static parameters, exceeding the performance of state-of-the art SiGe:C HBTs C also enhances the high frequency performance, because it allows one to use a high B doping level in a very thin SiGe base layer without outdiffusion from SiGe, even if applying post-epitaxial implants and anneals. Finally, we demonstrate the first modular integration of SiGe:C HBTs into a 0.25 μm, epi-free, dual-gate CMOS platform.

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