Details
| Originalsprache | Englisch |
|---|---|
| Aufsatznummer | 6118302 |
| Seiten (von - bis) | 16-21 |
| Seitenumfang | 6 |
| Fachzeitschrift | IEEE journal of photovoltaics |
| Jahrgang | 2 |
| Ausgabenummer | 1 |
| Publikationsstatus | Veröffentlicht - 29 Dez. 2011 |
Abstract
In this paper, an interconnection method for the module integration of silicon solar cells by laser microwelding of the Al-metalized rear side of the solar cell to a metalized substrate is introduced. This laser microwelding process forms a direct mechanical and electrical connection between two Al-layers without the need for any soldering, conductive adhesives, or Ag-pastes. With a tensile tester, we measure tear-off stresses of up to 303kPa for our laser weld spots. Furthermore, carrier lifetime measurements show that no defects are induced into the Si-crystal by the laser process over a wide range of laser pulse energies and number of laser pulses. In order to demonstrate the applicability of this laser-based interconnection method, we present a proof-of-concept module consisting of five n-type back-junction back-contact solar cells with a conversion efficiency of 20.0%.
ASJC Scopus Sachgebiete
- Werkstoffwissenschaften (insg.)
- Elektronische, optische und magnetische Materialien
- Physik und Astronomie (insg.)
- Physik der kondensierten Materie
- Ingenieurwesen (insg.)
- Elektrotechnik und Elektronik
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in: IEEE journal of photovoltaics, Jahrgang 2, Nr. 1, 6118302, 29.12.2011, S. 16-21.
Publikation: Beitrag in Fachzeitschrift › Artikel › Forschung › Peer-Review
}
TY - JOUR
T1 - Aluminum-Based Mechanical and Electrical Laser Interconnection Process for Module Integration of Silicon Solar Cells
AU - Schulte-Huxel, Henning
AU - Bock, Robert
AU - Blankemeyer, Susanne
AU - Merkle, Agnes
AU - Brendel, Rolf
PY - 2011/12/29
Y1 - 2011/12/29
N2 - In this paper, an interconnection method for the module integration of silicon solar cells by laser microwelding of the Al-metalized rear side of the solar cell to a metalized substrate is introduced. This laser microwelding process forms a direct mechanical and electrical connection between two Al-layers without the need for any soldering, conductive adhesives, or Ag-pastes. With a tensile tester, we measure tear-off stresses of up to 303kPa for our laser weld spots. Furthermore, carrier lifetime measurements show that no defects are induced into the Si-crystal by the laser process over a wide range of laser pulse energies and number of laser pulses. In order to demonstrate the applicability of this laser-based interconnection method, we present a proof-of-concept module consisting of five n-type back-junction back-contact solar cells with a conversion efficiency of 20.0%.
AB - In this paper, an interconnection method for the module integration of silicon solar cells by laser microwelding of the Al-metalized rear side of the solar cell to a metalized substrate is introduced. This laser microwelding process forms a direct mechanical and electrical connection between two Al-layers without the need for any soldering, conductive adhesives, or Ag-pastes. With a tensile tester, we measure tear-off stresses of up to 303kPa for our laser weld spots. Furthermore, carrier lifetime measurements show that no defects are induced into the Si-crystal by the laser process over a wide range of laser pulse energies and number of laser pulses. In order to demonstrate the applicability of this laser-based interconnection method, we present a proof-of-concept module consisting of five n-type back-junction back-contact solar cells with a conversion efficiency of 20.0%.
KW - Al-metallization
KW - back-contact solar cells
KW - laser microwelding
KW - lead-free
KW - module-level interconnection
KW - photovoltaic module
UR - http://www.scopus.com/inward/record.url?scp=84865192278&partnerID=8YFLogxK
U2 - 10.1109/JPHOTOV.2011.2177072
DO - 10.1109/JPHOTOV.2011.2177072
M3 - Article
AN - SCOPUS:84865192278
VL - 2
SP - 16
EP - 21
JO - IEEE journal of photovoltaics
JF - IEEE journal of photovoltaics
SN - 2156-3381
IS - 1
M1 - 6118302
ER -