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IEEE transactions on device and materials reliability

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Publications

  1. 2008

  2. Published

    Simulation of migration effects in solder bumps

    Weide-Zaage, K., Sept 2008, In: IEEE Transactions on Device and Materials Reliability. 8, 3, p. 442-448 7 p., 4595633.

    Research output: Contribution to journal › Article › Research › peer review

  3. 2006

  4. Published

    Modeling lateral parasitic transistors in smart power ICs

    Oehmen, J., Olbrich, M., Hedrich, L. & Barke, E., Sept 2006, In: IEEE Transactions on Device and Materials Reliability. 6, 3, p. 408-420 13 p., 1717490.

    Research output: Contribution to journal › Article › Research › peer review