Publications
- 2024
- Published
Simulation of Thermal–Electrical and Mechanical Behavior of Conductive Yarns
Weide-Zaage, K. & Huang, Y., 18 Jan 2024, In: Engineering Proceedings. 52, 1, 5 p., 17.Research output: Contribution to journal › Article › Research › peer review
- Published
Characterization of Soft Errors on a 28-nm SRAM-based FPGA under Neutron Radiation Exposure
Trumann, E., Thieu, G. B., Schmechel, J., Weide-Zaage, K., Wolff, D. V., Bausen, A., Paya-Vaya, G. & Müller, A., 2024, 2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems: EuroSimE . Institute of Electrical and Electronics Engineers Inc., 5 p.Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review
- Published
Dna Digital-storage: Advantages, Approach and Technical Implementation
Weide-Zaage, K., 2024, 2024 Pan Pacific Strategic Electronics Symposium: Pan Pacific. Institute of Electrical and Electronics Engineers Inc., 6 p.Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review
- Published
Simulation of Different SRAM Cells under Neutron Radiation with GEANT4
Weide-Zaage, K., Mandala, S. J., Trumann, E., Paya-Vaya, G., Wolff, D. V., Bausen, A. & Muller, A., 2024, 2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems: EuroSimE . Institute of Electrical and Electronics Engineers Inc., 4 p.Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review
- Published
Technical Implementation of DNA Data-Storage
Weide-Zaage, K., 2024, 2024 International Conference on Electronics Packaging (ICEP). Institute of Electrical and Electronics Engineers Inc., p. 111-112 2 p.Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review
- Published
The Comparison of the Reliability Performance of Different Top Metal Materials in MEMS Applications
Hein, V., Weide-Zaage, K. & Clausner, A., 2024, 2024 Pan Pacific Strategic Electronics Symposium: Pan Pacific. Institute of Electrical and Electronics Engineers Inc., 6 p.Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review
- 2023
- Published
Radiation Tolerant Reconfigurable Hardware Architecture Design Methodology
Trumann, E., Thieu, G. B., Schmechel, J., Weide-Zaage, K., Schmidt, K., Hagenah, D. & Payá Vayá, G., 16 Sept 2023, Applied Reconfigurable Computing. Architectures, Tools, and Applications: 19th International Symposium, ARC 2023, Proceedings. Palumbo, F., Keramidas, G., Voros, N. & Diniz, P. C. (eds.). Springer Science and Business Media Deutschland GmbH, p. 357-360 4 p. (Lecture Notes in Computer Science (including subseries Lecture Notes in Artificial Intelligence and Lecture Notes in Bioinformatics); vol. 14251 LNCS).Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review
- Published
A Probability Soft-Error Model for a 28-nm SRAM-based FPGA under Neutron Radiation Exposure
Thieu, G. B., Schmechel, J., Weide-Zaage, K., Schmidt, K., Hagenah, D. & Paya-Vaya, G., 2023, 2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems: EuroSimE . Institute of Electrical and Electronics Engineers Inc., ( International Conference on Thermal, Mechanical and Multi-physics Simulation and Experiments in Microelectronics and Microsystems).Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review
- 2022
- Published
Developing a micro-thermography system for thermal characterization of LED packages
Hollstein, K., Entholzner, D., Zhu, G., Weide-Zaage, K. & Benstetter, G., 1 Feb 2022, In: Microelectronic engineering. 254, 111694.Research output: Contribution to journal › Article › Research › peer review
- Published
Investigation of FPGA and SRAM Cells under Radiation Exposure
Weide-Zaage, K., Paya-Vaya, G., Schmidt, K. & Hagenah, D., 2022, 2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2022. Institute of Electrical and Electronics Engineers Inc., (2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2022).Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review
- 2021
- Published
Thermal analysis of the design parameters of a QFN package soldered on a PCB using a simulation approach
Hollstein, K., Yang, X. & Weide-Zaage, K., May 2021, In: Microelectronics reliability. 120, 114118.Research output: Contribution to journal › Article › Research › peer review
- Published
The Improvement of the Life Time Performance Estimation for Interconnect Stacks in Realistic Layouts
Hein, V. & Weide-Zaage, K., 19 Apr 2021, 2021 22nd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2021. Institute of Electrical and Electronics Engineers Inc., 9410880. (2021 22nd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2021).Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review
- 2020
- Published
Advances in Packaging for Emerging Technologies
Hollstein, K. & Weide-Zaage, K., 2020, 2020 Pan Pacific Microelectronics Symposium, Pan Pacific 2020. Institute of Electrical and Electronics Engineers Inc., 9059539Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review
- Published
Identification of influencing PCB design parameters on thermal performance of a QFN package
Hollstein, K., Yang, L., Gao, Y. & Weide-Zaage, K., 2020, 2020 21st International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2020. Institute of Electrical and Electronics Engineers Inc., 9152651Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review
- Published
Silicon Die Bonding using a Photostructurable Adhesive Material
Hollstein, K. & Weide-Zaage, K., 2020, 2020 International Wafer Level Packaging Conference, IWLPC 2020. Institute of Electrical and Electronics Engineers Inc., 9375868Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review
- 2019
- Published
New-Automotive -Autonomous Driving Challenges For The Microelectronic Components
Weide-Zaage, K., 22 Apr 2019, 2019 Pan Pacific Microelectronics Symposium, Pan Pacific 2019: Proceedings. Institute of Electrical and Electronics Engineers Inc., 6 p. 8696273Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review
- Published
Electromigration effects in corroded BGA
Weide-Zaage, K., Guedon-Gracia, A. & Fremont, H., Mar 2019, 2019 20th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2019: Proceedings. Institute of Electrical and Electronics Engineers Inc., 8724522Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review
- Published
Layout optimization of CMOS interconnects for heating, cooling and improved stress distribution
Hein, V., Weide-Zaage, K. & Yang, X., Mar 2019, 2019 20th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2019: Proceedings. Institute of Electrical and Electronics Engineers Inc., 8724562Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review
- Published
Simulations in terms of radiation effects on different BEOL material systems
Weide-Zaage, K., Paya-Vaya, G. & Eichin, P., Mar 2019, 2019 20th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2019: Proceedings. Institute of Electrical and Electronics Engineers Inc., 8724581Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review
- 2018
- Published
Thick AlCu-metal reliability characterization
Weide-Zaage, K., Tan, Y. & Hein, V., 30 May 2018, 2018 19th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2018. Institute of Electrical and Electronics Engineers Inc., p. 1-4 4 p.Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review