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apl. Prof. Dr.-Ing. Dipl.-Phys.  Kirsten Weide-Zaage

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Publications

  1. 2024
  2. Published

    Simulation of Thermal–Electrical and Mechanical Behavior of Conductive Yarns

    Weide-Zaage, K. & Huang, Y., 18 Jan 2024, In: Engineering Proceedings. 52, 1, 5 p., 17.

    Research output: Contribution to journalArticleResearchpeer review

  3. Published

    Characterization of Soft Errors on a 28-nm SRAM-based FPGA under Neutron Radiation Exposure

    Trumann, E., Thieu, G. B., Schmechel, J., Weide-Zaage, K., Wolff, D. V., Bausen, A., Paya-Vaya, G. & Müller, A., 2024, 2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems: EuroSimE . Institute of Electrical and Electronics Engineers Inc., 5 p.

    Research output: Chapter in book/report/conference proceedingConference contributionResearchpeer review

  4. Published

    Dna Digital-storage: Advantages, Approach and Technical Implementation

    Weide-Zaage, K., 2024, 2024 Pan Pacific Strategic Electronics Symposium: Pan Pacific. Institute of Electrical and Electronics Engineers Inc., 6 p.

    Research output: Chapter in book/report/conference proceedingConference contributionResearchpeer review

  5. Published

    Simulation of Different SRAM Cells under Neutron Radiation with GEANT4

    Weide-Zaage, K., Mandala, S. J., Trumann, E., Paya-Vaya, G., Wolff, D. V., Bausen, A. & Muller, A., 2024, 2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems: EuroSimE . Institute of Electrical and Electronics Engineers Inc., 4 p.

    Research output: Chapter in book/report/conference proceedingConference contributionResearchpeer review

  6. Published

    Technical Implementation of DNA Data-Storage

    Weide-Zaage, K., 2024, 2024 International Conference on Electronics Packaging (ICEP). Institute of Electrical and Electronics Engineers Inc., p. 111-112 2 p.

    Research output: Chapter in book/report/conference proceedingConference contributionResearchpeer review

  7. Published

    The Comparison of the Reliability Performance of Different Top Metal Materials in MEMS Applications

    Hein, V., Weide-Zaage, K. & Clausner, A., 2024, 2024 Pan Pacific Strategic Electronics Symposium: Pan Pacific. Institute of Electrical and Electronics Engineers Inc., 6 p.

    Research output: Chapter in book/report/conference proceedingConference contributionResearchpeer review

  8. 2023
  9. Published

    Radiation Tolerant Reconfigurable Hardware Architecture Design Methodology

    Trumann, E., Thieu, G. B., Schmechel, J., Weide-Zaage, K., Schmidt, K., Hagenah, D. & Payá Vayá, G., 16 Sept 2023, Applied Reconfigurable Computing. Architectures, Tools, and Applications: 19th International Symposium, ARC 2023, Proceedings. Palumbo, F., Keramidas, G., Voros, N. & Diniz, P. C. (eds.). Springer Science and Business Media Deutschland GmbH, p. 357-360 4 p. (Lecture Notes in Computer Science (including subseries Lecture Notes in Artificial Intelligence and Lecture Notes in Bioinformatics); vol. 14251 LNCS).

    Research output: Chapter in book/report/conference proceedingConference contributionResearchpeer review

  10. Published

    A Probability Soft-Error Model for a 28-nm SRAM-based FPGA under Neutron Radiation Exposure

    Thieu, G. B., Schmechel, J., Weide-Zaage, K., Schmidt, K., Hagenah, D. & Paya-Vaya, G., 2023, 2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems: EuroSimE . Institute of Electrical and Electronics Engineers Inc., ( International Conference on Thermal, Mechanical and Multi-physics Simulation and Experiments in Microelectronics and Microsystems).

    Research output: Chapter in book/report/conference proceedingConference contributionResearchpeer review

  11. 2022
  12. Published

    Developing a micro-thermography system for thermal characterization of LED packages

    Hollstein, K., Entholzner, D., Zhu, G., Weide-Zaage, K. & Benstetter, G., 1 Feb 2022, In: Microelectronic engineering. 254, 111694.

    Research output: Contribution to journalArticleResearchpeer review

  13. Published

    Investigation of FPGA and SRAM Cells under Radiation Exposure

    Weide-Zaage, K., Paya-Vaya, G., Schmidt, K. & Hagenah, D., 2022, 2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2022. Institute of Electrical and Electronics Engineers Inc., (2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2022).

    Research output: Chapter in book/report/conference proceedingConference contributionResearchpeer review

  14. 2021
  15. Published

    Thermal analysis of the design parameters of a QFN package soldered on a PCB using a simulation approach

    Hollstein, K., Yang, X. & Weide-Zaage, K., May 2021, In: Microelectronics reliability. 120, 114118.

    Research output: Contribution to journalArticleResearchpeer review

  16. Published

    The Improvement of the Life Time Performance Estimation for Interconnect Stacks in Realistic Layouts

    Hein, V. & Weide-Zaage, K., 19 Apr 2021, 2021 22nd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2021. Institute of Electrical and Electronics Engineers Inc., 9410880. (2021 22nd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2021).

    Research output: Chapter in book/report/conference proceedingConference contributionResearchpeer review

  17. 2020
  18. Published

    Advances in Packaging for Emerging Technologies

    Hollstein, K. & Weide-Zaage, K., 2020, 2020 Pan Pacific Microelectronics Symposium, Pan Pacific 2020. Institute of Electrical and Electronics Engineers Inc., 9059539

    Research output: Chapter in book/report/conference proceedingConference contributionResearchpeer review

  19. Published

    Identification of influencing PCB design parameters on thermal performance of a QFN package

    Hollstein, K., Yang, L., Gao, Y. & Weide-Zaage, K., 2020, 2020 21st International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2020. Institute of Electrical and Electronics Engineers Inc., 9152651

    Research output: Chapter in book/report/conference proceedingConference contributionResearchpeer review

  20. Published

    Silicon Die Bonding using a Photostructurable Adhesive Material

    Hollstein, K. & Weide-Zaage, K., 2020, 2020 International Wafer Level Packaging Conference, IWLPC 2020. Institute of Electrical and Electronics Engineers Inc., 9375868

    Research output: Chapter in book/report/conference proceedingConference contributionResearchpeer review

  21. 2019
  22. Published

    New-Automotive -Autonomous Driving Challenges For The Microelectronic Components

    Weide-Zaage, K., 22 Apr 2019, 2019 Pan Pacific Microelectronics Symposium, Pan Pacific 2019: Proceedings. Institute of Electrical and Electronics Engineers Inc., 6 p. 8696273

    Research output: Chapter in book/report/conference proceedingConference contributionResearchpeer review

  23. Published

    Electromigration effects in corroded BGA

    Weide-Zaage, K., Guedon-Gracia, A. & Fremont, H., Mar 2019, 2019 20th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2019: Proceedings. Institute of Electrical and Electronics Engineers Inc., 8724522

    Research output: Chapter in book/report/conference proceedingConference contributionResearchpeer review

  24. Published

    Layout optimization of CMOS interconnects for heating, cooling and improved stress distribution

    Hein, V., Weide-Zaage, K. & Yang, X., Mar 2019, 2019 20th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2019: Proceedings. Institute of Electrical and Electronics Engineers Inc., 8724562

    Research output: Chapter in book/report/conference proceedingConference contributionResearchpeer review

  25. Published

    Simulations in terms of radiation effects on different BEOL material systems

    Weide-Zaage, K., Paya-Vaya, G. & Eichin, P., Mar 2019, 2019 20th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2019: Proceedings. Institute of Electrical and Electronics Engineers Inc., 8724581

    Research output: Chapter in book/report/conference proceedingConference contributionResearchpeer review

  26. 2018
  27. Published

    Thick AlCu-metal reliability characterization

    Weide-Zaage, K., Tan, Y. & Hein, V., 30 May 2018, 2018 19th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2018. Institute of Electrical and Electronics Engineers Inc., p. 1-4 4 p.

    Research output: Chapter in book/report/conference proceedingConference contributionResearchpeer review

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