ZuSE-KI-Mobil: AI Chip Design Platform for Automotive and Industrial Applications

Research output: Contribution to journalArticleResearchpeer review

Authors

  • Shaown Mojumder
  • Simon Friedrich
  • Emil Matúš
  • Matthias Lüders
  • Martin Friedrich
  • Oliver Renke
  • Holger Blume
  • Markus Kock
  • Gregor Schewior
  • Darius Grantz
  • Jens Benndorf
  • Julian Hoefer
  • Patrick Schmidt
  • Jürgen Becker
  • Nael Fasfous
  • Pierpaolo Mori
  • Hans Jörg Vögel
  • Samira Ahmadifarsani
  • Leonidas Kontopoulos
  • Ulf Schlichtmann
  • Yun Jin Li
  • Gerhard P. Fettweis

Research Organisations

External Research Organisations

  • Technische Universität Dresden (TUD)
  • Dream Chip Technologies GmbH
  • Karlsruhe Institute of Technology (KIT)
  • Bayerische Motoren Werke AG
  • Technical University of Munich (TUM)
  • Infineon Technologies AG
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Details

Original languageEnglish
Pages (from-to)2961-2974
Number of pages14
JournalIEEE Transactions on Very Large Scale Integration (VLSI) Systems
Volume33
Issue number11
Early online date12 Sept 2025
Publication statusPublished - 31 Oct 2025

Abstract

The ZuSE-KI-Mobil (ZuKIMo) research project presents a heterogeneous system-on-chip (SoC) designed for use in a variety of automotive and industrial edge applications. Implemented using GlobalFoundries (GF) 22-nm FD-SOI technology, the SoC features a modular architecture with a configurable, bit-serial, mixed-precision neural processing unit (NPU) core. This core can be adapted to different use cases, comes with a compact instruction set, and improves the performance of dilated convolutions. A hardware-accelerated, tunable image signal processor (ISP) hyperparameter pipeline reduces tuning time and increases detection confidence for AI tasks. The system also incorporates a selective, per-layer fault-tolerance mechanism and supports rapid prototyping via an Apache TVM-driven compiler flow and cycle-accurate simulation. The adaptable hardware generation process is designed with future chiplet-based scaling in mind, providing a flexible foundation for upcoming heterogeneous SoC designs.

Keywords

    AI accelerator, autonomous systems, compiler, edge computing, system-on-chip (SoC)

ASJC Scopus subject areas

Cite this

ZuSE-KI-Mobil: AI Chip Design Platform for Automotive and Industrial Applications. / Mojumder, Shaown; Friedrich, Simon; Matúš, Emil et al.
In: IEEE Transactions on Very Large Scale Integration (VLSI) Systems, Vol. 33, No. 11, 31.10.2025, p. 2961-2974.

Research output: Contribution to journalArticleResearchpeer review

Mojumder, S, Friedrich, S, Matúš, E, Lüders, M, Friedrich, M, Renke, O, Blume, H, Kock, M, Schewior, G, Grantz, D, Benndorf, J, Hoefer, J, Schmidt, P, Becker, J, Fasfous, N, Mori, P, Vögel, HJ, Ahmadifarsani, S, Kontopoulos, L, Schlichtmann, U, Li, YJ & Fettweis, GP 2025, 'ZuSE-KI-Mobil: AI Chip Design Platform for Automotive and Industrial Applications', IEEE Transactions on Very Large Scale Integration (VLSI) Systems, vol. 33, no. 11, pp. 2961-2974. https://doi.org/10.1109/TVLSI.2025.3603887
Mojumder, S., Friedrich, S., Matúš, E., Lüders, M., Friedrich, M., Renke, O., Blume, H., Kock, M., Schewior, G., Grantz, D., Benndorf, J., Hoefer, J., Schmidt, P., Becker, J., Fasfous, N., Mori, P., Vögel, H. J., Ahmadifarsani, S., Kontopoulos, L., ... Fettweis, G. P. (2025). ZuSE-KI-Mobil: AI Chip Design Platform for Automotive and Industrial Applications. IEEE Transactions on Very Large Scale Integration (VLSI) Systems, 33(11), 2961-2974. https://doi.org/10.1109/TVLSI.2025.3603887
Mojumder S, Friedrich S, Matúš E, Lüders M, Friedrich M, Renke O et al. ZuSE-KI-Mobil: AI Chip Design Platform for Automotive and Industrial Applications. IEEE Transactions on Very Large Scale Integration (VLSI) Systems. 2025 Oct 31;33(11):2961-2974. Epub 2025 Sept 12. doi: 10.1109/TVLSI.2025.3603887
Mojumder, Shaown ; Friedrich, Simon ; Matúš, Emil et al. / ZuSE-KI-Mobil : AI Chip Design Platform for Automotive and Industrial Applications. In: IEEE Transactions on Very Large Scale Integration (VLSI) Systems. 2025 ; Vol. 33, No. 11. pp. 2961-2974.
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