Details
| Original language | English |
|---|---|
| Title of host publication | Microelectronic manufacturing, yield, reliability, and failure analysis IV |
| Subtitle of host publication | 23 - 24 September 1998, Santa Clara, California |
| Place of Publication | Bellingham |
| Publisher | SPIE |
| Pages | 112-121 |
| Number of pages | 10 |
| ISBN (print) | 0-8194-2969-4 |
| Publication status | Published - 28 Aug 1998 |
| Event | Microelectronic Manufacturing Yield, Reliability, and Failure Analysis IV - Santa Clara, CA, United States Duration: 23 Sept 1998 → 24 Sept 1998 |
Publication series
| Name | Proceedings of SPIE - The International Society for Optical Engineering |
|---|---|
| Publisher | SPIE |
| Volume | 3510 |
| ISSN (Print) | 0277-786X |
Abstract
The trend in microelectronic is increasing power density of IC devices in conjunction with decreasing package size. Out of this a consideration of the thermal behaviour of the package and its vicinity, caused by a strong influence of the operating temperature on the component lifetime and its reliability is needed. A better outlet of the dissipated power is necessary. The temperature distribution in a package is influenced by the heat conduction in the package, depending on the different heat conductivities of the used materials. Also convection must be taken into account. In this paper a finite element model of a SOP8 plastic package mounted on a printed circuit board was investigated. The influence of the material properties of the package epoxy, the adhesive, the chip carrier and the material of the printed circuit board on the temperature distribution was investigated. Also the influence of the area covered by the adhesive on the temperature behaviour and the mechanical stress was investigated.
Keywords
- Finite elements, Material properties, Mechanical stress, Packaging, Simulation, Temperature distribution, Thermal resistance
ASJC Scopus subject areas
- Materials Science(all)
- Electronic, Optical and Magnetic Materials
- Physics and Astronomy(all)
- Condensed Matter Physics
- Computer Science(all)
- Computer Science Applications
- Mathematics(all)
- Applied Mathematics
- Engineering(all)
- Electrical and Electronic Engineering
Cite this
- Standard
- Harvard
- Apa
- Vancouver
- BibTeX
- RIS
Microelectronic manufacturing, yield, reliability, and failure analysis IV: 23 - 24 September 1998, Santa Clara, California. Bellingham: SPIE, 1998. p. 112-121 (Proceedings of SPIE - The International Society for Optical Engineering; Vol. 3510).
Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review
}
TY - GEN
T1 - Influence of the material properties on the thermal behaviour of a package
AU - Weide, Kirsten
AU - Keck, Christian
AU - Yu, Xiaoying
N1 - Copyright: Copyright 2005 Elsevier Science B.V., Amsterdam. All rights reserved.
PY - 1998/8/28
Y1 - 1998/8/28
N2 - The trend in microelectronic is increasing power density of IC devices in conjunction with decreasing package size. Out of this a consideration of the thermal behaviour of the package and its vicinity, caused by a strong influence of the operating temperature on the component lifetime and its reliability is needed. A better outlet of the dissipated power is necessary. The temperature distribution in a package is influenced by the heat conduction in the package, depending on the different heat conductivities of the used materials. Also convection must be taken into account. In this paper a finite element model of a SOP8 plastic package mounted on a printed circuit board was investigated. The influence of the material properties of the package epoxy, the adhesive, the chip carrier and the material of the printed circuit board on the temperature distribution was investigated. Also the influence of the area covered by the adhesive on the temperature behaviour and the mechanical stress was investigated.
AB - The trend in microelectronic is increasing power density of IC devices in conjunction with decreasing package size. Out of this a consideration of the thermal behaviour of the package and its vicinity, caused by a strong influence of the operating temperature on the component lifetime and its reliability is needed. A better outlet of the dissipated power is necessary. The temperature distribution in a package is influenced by the heat conduction in the package, depending on the different heat conductivities of the used materials. Also convection must be taken into account. In this paper a finite element model of a SOP8 plastic package mounted on a printed circuit board was investigated. The influence of the material properties of the package epoxy, the adhesive, the chip carrier and the material of the printed circuit board on the temperature distribution was investigated. Also the influence of the area covered by the adhesive on the temperature behaviour and the mechanical stress was investigated.
KW - Finite elements
KW - Material properties
KW - Mechanical stress
KW - Packaging
KW - Simulation
KW - Temperature distribution
KW - Thermal resistance
UR - http://www.scopus.com/inward/record.url?scp=0032404852&partnerID=8YFLogxK
U2 - 10.1117/12.324388
DO - 10.1117/12.324388
M3 - Conference contribution
AN - SCOPUS:0032404852
SN - 0-8194-2969-4
T3 - Proceedings of SPIE - The International Society for Optical Engineering
SP - 112
EP - 121
BT - Microelectronic manufacturing, yield, reliability, and failure analysis IV
PB - SPIE
CY - Bellingham
T2 - Microelectronic Manufacturing Yield, Reliability, and Failure Analysis IV
Y2 - 23 September 1998 through 24 September 1998
ER -