Details
| Original language | English |
|---|---|
| Title of host publication | 2025 38th International Vacuum Nanoelectronics Conference, IVNC 2025 |
| ISBN (electronic) | 979-8-3315-3705-0 |
| Publication status | Published - 8 Jul 2025 |
Abstract
This study characterizes the field emission and heat development properties of polycrystalline diamond (PCD) coatings on diced n-Si field emitters. The emitter chip package consists of a diced field emitter array and a gold-coated glass extraction electrode fabricated using the Selective Laser Etching (SLE) process. In an attempt to ameliorate heat expansion issues observed in uncoated arrays, a thin layer of PCD was incorporated into the system, leveraging the materials potentially high thermal conductivity and low work function. Additionally, a thermography camera was used to characterize the electron source. The experiments confirmed that PCD-coated emitters operate more stably at lower voltages and exhibit significantly lower and more uniform thermal profiles.
Keywords
- diamond, silicon field emitters, PCD, glass extraction electrode, SLE, laser assisted bonding, FEA, dicing field emitters
ASJC Scopus subject areas
- Engineering(all)
- Electrical and Electronic Engineering
- Materials Science(all)
- Electronic, Optical and Magnetic Materials
- Physics and Astronomy(all)
- Instrumentation
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2025 38th International Vacuum Nanoelectronics Conference, IVNC 2025. 2025.
Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review
}
TY - GEN
T1 - Diamond Coating of Diced Si Field Emitters for Enhanced Field Emission Performance
AU - Buchta, Aleksandra Monika
AU - Thomas, Evan Lloyd Hunter
AU - Kassner, Alexander
AU - Dencker, Folke
AU - Wurz, Marc
N1 - Publisher Copyright: © 2025 IEEE.
PY - 2025/7/8
Y1 - 2025/7/8
N2 - This study characterizes the field emission and heat development properties of polycrystalline diamond (PCD) coatings on diced n-Si field emitters. The emitter chip package consists of a diced field emitter array and a gold-coated glass extraction electrode fabricated using the Selective Laser Etching (SLE) process. In an attempt to ameliorate heat expansion issues observed in uncoated arrays, a thin layer of PCD was incorporated into the system, leveraging the materials potentially high thermal conductivity and low work function. Additionally, a thermography camera was used to characterize the electron source. The experiments confirmed that PCD-coated emitters operate more stably at lower voltages and exhibit significantly lower and more uniform thermal profiles.
AB - This study characterizes the field emission and heat development properties of polycrystalline diamond (PCD) coatings on diced n-Si field emitters. The emitter chip package consists of a diced field emitter array and a gold-coated glass extraction electrode fabricated using the Selective Laser Etching (SLE) process. In an attempt to ameliorate heat expansion issues observed in uncoated arrays, a thin layer of PCD was incorporated into the system, leveraging the materials potentially high thermal conductivity and low work function. Additionally, a thermography camera was used to characterize the electron source. The experiments confirmed that PCD-coated emitters operate more stably at lower voltages and exhibit significantly lower and more uniform thermal profiles.
KW - diamond
KW - silicon field emitters
KW - PCD
KW - glass extraction electrode
KW - SLE
KW - laser assisted bonding
KW - FEA
KW - dicing field emitters
UR - http://www.scopus.com/inward/record.url?scp=105015395600&partnerID=8YFLogxK
U2 - 10.1109/IVNC65669.2025.11120853
DO - 10.1109/IVNC65669.2025.11120853
M3 - Conference contribution
SN - 979-8-3315-3706-7
BT - 2025 38th International Vacuum Nanoelectronics Conference, IVNC 2025
ER -