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Institute of Micro Production Technology

Organisational unit: Institute

Type of address: Visitor address.
An der Universität 2
30823
Garbsen
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121 - 140 out of 318Page size: 20

Publications

  1. 2020
  2. Published

    Selbstschärfende Mikroschleifwerkzeuge

    Asadi, E., Hockauf, R. & Wurz, M. C., 2020, Jahrbuch Schleifen, Honen, Läppen und Polieren. Essen

    Research output: Chapter in book/report/conference proceeding › Contribution to book/anthology › Research › peer review

  3. Published

    Thin Film Transferring via PVA Substrate and Contacting of Sensor inside Elastomer Matrix

    Bengsch, S., Giese, U., Fischer, E. & Wurz, M. C., 2020, IEEE Sensors, SENSORS 2020: Conference Proceedings. Institute of Electrical and Electronics Engineers Inc., 9278876. (Proceedings of IEEE Sensors; vol. 2020-October).

    Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review

  4. Published

    Untersuchung der mikrofluidischen Galvanik zur Herstellung von magnetfeldsensitiven Schichten und deren Eigenschaften

    Rechel, M., 2020, Garbsen. 130 p.

    Research output: Thesis › Doctoral thesis

  5. 2019
  6. Published

    Integrated atomic quantum technologies in demanding environments: development and qualification of miniaturized optical setups and integration technologies for UHV and space operation

    Christ, M., Kassner, A., Smol, R., Bawamia, A., Heine, H., Herr, W., Peters, A., Wurz, M. C., Rasel, E. M., Wicht, A. & Krutzik, M., 1 Dec 2019, In: CEAS Space Journal. 11, 4, p. 561-566 6 p.

    Research output: Contribution to journal › Article › Research › peer review

  7. Published

    Novel Eddy-Current Sensor for Industrial Deep-Drawing Applications

    Arndt, M., Dencker, F. & Wurz, M. C., Oct 2019, 2019 IEEE Sensors, SENSORS 2019: Proceedings. Institute of Electrical and Electronics Engineers Inc., 4 p. 8956948. (Proceedings of IEEE Sensors; vol. 2019-October).

    Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review

  8. E-pub ahead of print

    „Hai-Tech“ spanend fertigen: Mikroschleifen – funktionalisierte Oberflächen – selbstschärfende Werkzeuge

    Wurz, M. C., Denkena, B., Asadi, E. & Hockauf, R., 23 Jul 2019, (E-pub ahead of print) In: WB Werkstatt und Betrieb. 2019, 6, p. 48-51

    Research output: Contribution to journal › Article › Research

  9. Published

    Integrated Atomic Quantum Technologies in Demanding Environments:: Development and Qualification of Miniaturized Optical Setups and Integration Technologies for UHV and Space Operation

    Christ, M., Kassner, A., Smol, R., Bawamia, A. I., Peters, A., Wurz, M. C., Rasel, E. M., Wicht, A. & Krutzik, M., 12 Jul 2019, International Conference on Space Optics, ICSO 2018: Proceedings. Sodnik, Z., Karafolas, N. & Cugny, B. (eds.). SPIE, 8 p. 1118088. (Proceedings of SPIE - The International Society for Optical Engineering; vol. 11180).

    Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review

  10. Published

    Substrate modification influence on properties of nanocomposite based on TiO2 and gold nanoparticles

    Mishin, M. V., Vorobyev, A. A., Kondrateva, A. S., Koroleva, E. Y., Karaseov, P. A., Bespalova, P. G., Shakhmin, A. L., Glukhovskoy, A., Wurz, M. C. & Filimonov, A. V., Jun 2019, In: Journal of Physics: Conference Series. 1236, 1, 012025.

    Research output: Contribution to journal › Conference article › Research › peer review

  11. Published

    Structuring of laser activated polymers for sensor applications

    Bengsch, S., Aue, M., Cromwell, K. & Wurz, M. C., May 2019, IEEE 69th Electronic Components and Technology Conference (ECTC): Proceedings. Institute of Electrical and Electronics Engineers Inc., p. 1883-1888 6 p. 8811368. (Proceedings - Electronic Components and Technology Conference; vol. 2019-May).

    Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review

  12. Published

    Herstellung induktiver elektrischer Bauelemente

    Wurz, M. C. (Inventor), Maier, H. J. (Inventor) & Beringer, S. (Inventor), 25 Apr 2019, IPC No. H01F27/32 A I, H01F5/00, Patent No. DE102017124675A1, 23 Oct 2017, Priority date 23 Oct 2017, Priority No. DE102017124675A

    Research output: Patent

  13. Published

    Magnetotransport properties of weakly coupled double trilayer graphene

    Xiao, X., Hong, S. J. (Contributor), Belke, C. (Contributor) & Haug, R., 1 Apr 2019.

    Research output: Contribution to conference › Poster › Research

  14. Published

    Introduction to cellular signal transduction: The connection between a biological system and its surroundings

    Boyd, J. W., Neubig, R. R., Han, A. & Prediger, M., 22 Mar 2019, Cellular Signal Transduction in Toxicology and Pharmacology: Data Collection, Analysis, and Interpretation. Boyd, J. W. & Neubig, R. R. (eds.). Wiley-Blackwell, p. 1-19 19 p.

    Research output: Chapter in book/report/conference proceeding › Contribution to book/anthology › Research › peer review

  15. Published

    AMR-based mechanical pressure sensors: a proof of concept

    Prediger, M. S., Rechel, M. & Wurz, M. C., Mar 2019.

    Research output: Contribution to conference › Paper › Research

  16. Published

    AMR Sensoren auf flexiblem substrat zur Messung von Verformungen eines hartmagnetischen Partikel-Elastomerverbunds

    Prediger, M. S., Wittek, C. G. R., Owiss, G. & Wurz, M. C., 2019, MikroSystemTechnik Kongress 2019: Mikroelektronik | MEMS-MOEMS | Systemintegration - Saulen der Digitalisierung und kunstlichen Intelligenz, Proceedings. 1. ed. VDE Verlag GmbH, p. 111-114 4 p.

    Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review

  17. Published

    Atomchips mit integrierten optischen Gittern zur Erzeugung von Bose-Einstein-Kondensaten

    Kassner, A., Dencker, F., Künzler, C., Heine, H., Herr, W., Christ, M., Krutzik, M., Rasel, E. M. & Wurz, M., 2019, MikroSystemTechnik Kongress 2019: Mikroelektronik | MEMS-MOEMS | Systemintegration - Saulen der Digitalisierung und kunstlichen Intelligenz, Proceedings. VDE Verlag GmbH, p. 541-544 4 p.

    Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review

  18. Published

    Atom chip technology for use under UHV conditions

    Kassner, A., Rechel, M., Heine, H., Herr, W., Christ, M., Krutzik, M., Rasel, E. M. & Wurz, M. C., 2019, Smart Systems Integration 2019: International Conference and Exhibition on Integration Issues of Miniaturized Systems, SSI 2019. Otto, T. (ed.). VDE Verlag GmbH, p. 69-75 7 p.

    Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review

  19. Published

    Elektrische Kontaktierung bauteilinhärenter Dehnungsmesssensorik mithilfe des Transient Liquid Phase (TLP) Bonding

    Ottermann, R., Knöpke, R. & Wurz, M. C., 2019, MikroSystemTechnik Kongress 2019: Mikroelektronik | MEMS-MOEMS | Systemintegration - Saulen der Digitalisierung und kunstlichen Intelligenz, Proceedings. VDE Verlag GmbH, p. 263-266 4 p.

    Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review

  20. Published

    Fertigung und Charakterisierung von in Leiterplatten integrierten Mikrotransformatoren

    Fischer, E., Cromwell, K. & Wurz, M., 2019, MikroSystemTechnik Kongress 2019: Mikroelektronik | MEMS-MOEMS | Systemintegration - Saulen der Digitalisierung und kunstlichen Intelligenz, Proceedings. VDE Verlag GmbH, p. 569-572 4 p.

    Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review

  21. Published

    MEMS basierte magnetische passive Mikrobauteile für Hochfrequenz-Leistungsanwendungen

    Dinulovic, D., Shousha, M., El Shafey, K., Haug, M. & Wurz, M., 2019, MikroSystemTechnik Kongress 2019: Mikroelektronik | MEMS-MOEMS | Systemintegration - Saulen der Digitalisierung und kunstlichen Intelligenz, Proceedings. VDE Verlag GmbH, p. 32-35 4 p.

    Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review

  22. Published

    Microfabricated Magnetics on Silicon for Point of Load High-Frequency DC-DC Converter Applications

    Dinulovic, D., Shousha, M., Haug, M., Gerfer, A., Beringer, S., Wurz, M. C., Thone, J. & Wens, M., 2019, In: IEEE Transactions on Industry Applications. 55, 5, p. 5068-5077 10 p., 8732443.

    Research output: Contribution to journal › Article › Research › peer review

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