Organisation placeholder image, no image found

Institute of Microelectronic Systems

Organisational unit: Institute

Type of address: Visitor address.
Appelstraße 4
30167
Hannover
View graph of relations
101 - 120 out of 581Page size: 20

Publications

  1. 2022
  2. Published

    Efficient implementation of rank-only OS-CFAR with dedicated noise estimation

    Köhler, D., Meinl, F. & Blume, H., 2022, IET Conference Proceedings. 17 ed. Institution of Engineering and Technology, Vol. 2022. p. 312-317 6 p.

    Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review

  3. Published

    Entwicklung eines neuartigen LED-Gehäuses zur Integration in eine Fan-Out-Umgebung: Development of a novel LED package for the integration in a fan-out environment

    Hollstein, K., 2022, Hannover. 151 p.

    Research output: Thesis › Doctoral thesis

  4. Published

    Fault-tolerant Radar Signal Processing using Selective Observation Windows and Peak Detection

    Beyer, M., Guntoro, A. & Blume, H., 2022, 30th European Signal Processing Conference, EUSIPCO 2022 - Proceedings. p. 1876-1880 5 p. (European Signal Processing Conference; vol. 2022-August).

    Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review

  5. Published

    Interactive Synthetic Aperture Radar Simulator Generating and Visualizing Realistic FMCW Data

    Fahnemann, C., Rother, N. & Blume, H. C., 2022, IET Conference Proceedings. 17 ed. Vol. 2022. p. 725-730 6 p.

    Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review

  6. Published

    Investigation of FPGA and SRAM Cells under Radiation Exposure

    Weide-Zaage, K., Paya-Vaya, G., Schmidt, K. & Hagenah, D., 2022, 2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2022. Institute of Electrical and Electronics Engineers Inc., (2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2022).

    Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review

  7. Published

    Methodology for an Early Exploration of Embedded Systems using Portable Test and Stimulus Standard

    Kautz, F., Blume, H. & Sauer, C., 2022, 35th SBC/SBMicro/IEEE/ACM Symposium on Integrated Circuits and Systems Design, SBCCI 2022 - Proceedings. Institute of Electrical and Electronics Engineers Inc.

    Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review

  8. Published

    Monolithic Integration in E-Mode GaN Technology

    Kaufmann, M. P., 2022

    Research output: Thesis › Doctoral thesis

  9. Published

    Self-Supervised Velocity Estimation for Automotive Radar Object Detection Networks

    Niederlohner, D., Ulrich, M., Braun, S., Kohler, D., Faion, F., Glaser, C., Treptow, A. & Blume, H., 2022, 2022 IEEE Intelligent Vehicles Symposium (IV). Institute of Electrical and Electronics Engineers Inc., p. 352-359 8 p.

    Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review

  10. Published

    SmartHeaP: A High-level Programmable, Low Power, and Mixed-Signal Hearing Aid SoC in 22nm FD-SOI

    Karrenbauer, J. C., Klein, S. C., Schönewald, S. J., Gerlach, L. K., Blawat, M., Benndorf, J. & Blume, H. C., 2022, ESSCIRC 2022- IEEE 48th European Solid State Circuits Conference (ESSCIRC). p. 265-268 4 p.

    Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review

  11. 2021
  12. Published

    FPGA-based low-cost synchronized fiber network for experimental setups in space

    Oberschulte, T., Wendrich, T. & Blume, H., 15 Nov 2021, In: Journal of Instrumentation. 16, 11, P11016.

    Research output: Contribution to journal › Article › Research › peer review

  13. Published

    A Resonant One-Step 325 v to 3.3-10 v DC-DC Converter with Integrated Power Stage Benefiting from High-Voltage Loss-Reduction Techniques

    Rindfleisch, C. & Wicht, B., 1 Nov 2021, In: IEEE Journal of Solid-State Circuits. 56, 11, p. 3511-3520 10 p.

    Research output: Contribution to journal › Article › Research › peer review

  14. Published

    Evaluation of Different ASIP-Configurations for an Embedded Computed Order Tracking Algorithm

    Karrenbauer, J. C., Rinke, J. & Blume, H. C., 19 Oct 2021.

    Research output: Contribution to conference › Slides to presentation › Research

  15. Published

    Fixed Point Analysis Workflow for efficient Design of Convolutional Neural Networks in Hearing Aids

    Klein, S. C., Kantic, J. & Blume, H., 9 Oct 2021, In: Current Directions in Biomedical Engineering. 7, 2, p. 787-790 4 p.

    Research output: Contribution to journal › Article › Research › peer review

  16. Published

    Evaluation of Different Processor Architecture Organizations for On-Site Electronics in Harsh Environments

    Gesper, S., Weissbrich, M., Stuckenberg, T., Jaaskelainen, P., Blume, H. & Paya-Vaya, G., Aug 2021, In: International Journal of Parallel Programming. 49, 4, p. 541-569 29 p.

    Research output: Contribution to journal › Article › Research › peer review

  17. Published

    Automated Abstraction of Nonlinear Analog Circuits to Reliable Set-Valued Models with Reduced Overapproximation

    Rechmal-Lesse, M., Adhisantoso, Y. G., Koroa, G. A. & Olbrich, M., Jun 2021, In: Microelectronics Reliability. 121, 114119.

    Research output: Contribution to journal › Article › Research › peer review

  18. Published

    Psychophysical Study of Human Visual Perception of Flicker Artifacts in Automotive Digital Mirror Replacement Systems

    Behmann, N., Weddige, S. & Blume, H., May 2021, In: Journal of Perceptual Imaging. 4, 1, p. 10401-1-10401-9 9 p., art00002.

    Research output: Contribution to journal › Article › Research › peer review

  19. Published

    Thermal analysis of the design parameters of a QFN package soldered on a PCB using a simulation approach

    Hollstein, K., Yang, X. & Weide-Zaage, K., May 2021, In: Microelectronics reliability. 120, 114118.

    Research output: Contribution to journal › Article › Research › peer review

  20. Published

    The Improvement of the Life Time Performance Estimation for Interconnect Stacks in Realistic Layouts

    Hein, V. & Weide-Zaage, K., 19 Apr 2021, 2021 22nd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2021. Institute of Electrical and Electronics Engineers Inc., 9410880. (2021 22nd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2021).

    Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review

  21. Published

    Real time circle detection by simplified Hough transform on smartphones

    Schneider, V. J., 12 Apr 2021, Real-Time Image Processing and Deep Learning 2021. Kehtarnavaz, N. & Carlsohn, M. F. (eds.). Vol. 11736. 14 p. 117360F. (Proceedings of SPIE - The International Society for Optical Engineering; vol. 11736).

    Research output: Chapter in book/report/conference proceeding › Conference contribution › Research

  22. Published

    Session 33 Overview: High-Voltage, GaN and Wireless Power

    Chen, M., Wicht, B. & Miyaji, K., 18 Feb 2021, 2021 IEEE International Conference on Solid-State Circuits: Digest of Technical Papers. First Edition ed. Vol. 64. p. 458-459 2 p. (Digest of Technical Papers - IEEE International Solid State Circuits Conference).

    Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review

Previous 12 3 4 5 6 7 8 9 ...30 Next