Details
| Originalsprache | Englisch |
|---|---|
| Titel des Sammelwerks | MikroSystemTechnik Kongress 2023 - Mikroelektronik, Mikrosystemtechnik und ihre Anwendungen - Nachhaltigkeit und Technologiesouveranitat, Proceedings |
| Herausgeber (Verlag) | VDE Verlag GmbH |
| Seiten | 763-766 |
| Seitenumfang | 4 |
| ISBN (elektronisch) | 9783800762040 |
| Publikationsstatus | Veröffentlicht - 2023 |
| Veranstaltung | MikroSystemTechnik Kongress 2023: Mikroelektronik, Mikrosystemtechnik und ihre Anwendungen - Nachhaltigkeit und Technologiesouveranitat MicroSystems - Dresden, Deutschland Dauer: 23 Okt. 2023 → 25 Okt. 2023 |
Abstract
The feasibility to achieve and maintain ultra-high vacuum (UHV) on chip-scale packages represents a major step towards the miniaturization of affordable and pocket-sized quantum systems. Various components, which are essential for these systems, are under research at the Institute of Micro Production Technology, including a hermetic micro-fabricated vacuum package. To achieve this, a UHV Bonder was developed and set up in its first initial iteration, capable of capsulating under UHV conditions and thereby providing a promising outlook for an integration of said components inside the package. A chamber base pressure of 8*10-9 mbar was reached without a bakeout before bonding and Au-Au samples have been successfully bonded at low temperatures (200°C) with an applied pressure of 600 N. Vacuum characteristics were analyzed using a residual gas analyzer (RGA), while the bonded samples were characterized through shear tests and examined with SEM.
ASJC Scopus Sachgebiete
- Ingenieurwesen (insg.)
- Elektrotechnik und Elektronik
- Werkstoffwissenschaften (insg.)
- Elektronische, optische und magnetische Materialien
- Werkstoffwissenschaften (insg.)
- Oberflächen, Beschichtungen und Folien
- Physik und Astronomie (insg.)
- Physik der kondensierten Materie
- Physik und Astronomie (insg.)
- Atom- und Molekularphysik sowie Optik
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MikroSystemTechnik Kongress 2023 - Mikroelektronik, Mikrosystemtechnik und ihre Anwendungen - Nachhaltigkeit und Technologiesouveranitat, Proceedings. VDE Verlag GmbH, 2023. S. 763-766.
Publikation: Beitrag in Buch/Bericht/Sammelwerk/Konferenzband › Aufsatz in Konferenzband › Forschung › Peer-Review
}
TY - GEN
T1 - Setup of an ultra-high vacuum bonder for the encapsulation of quantum systems
AU - Droese, Niklas
AU - Petring, Julian
AU - Hadeler, Steffen
AU - Kassner, Alexander
AU - Dencker, Folke
AU - Wurz, Marc C.
N1 - Publisher Copyright: © VDE VERLAG GMBH ∙ Berlin ∙ Offenbach.
PY - 2023
Y1 - 2023
N2 - The feasibility to achieve and maintain ultra-high vacuum (UHV) on chip-scale packages represents a major step towards the miniaturization of affordable and pocket-sized quantum systems. Various components, which are essential for these systems, are under research at the Institute of Micro Production Technology, including a hermetic micro-fabricated vacuum package. To achieve this, a UHV Bonder was developed and set up in its first initial iteration, capable of capsulating under UHV conditions and thereby providing a promising outlook for an integration of said components inside the package. A chamber base pressure of 8*10-9 mbar was reached without a bakeout before bonding and Au-Au samples have been successfully bonded at low temperatures (200°C) with an applied pressure of 600 N. Vacuum characteristics were analyzed using a residual gas analyzer (RGA), while the bonded samples were characterized through shear tests and examined with SEM.
AB - The feasibility to achieve and maintain ultra-high vacuum (UHV) on chip-scale packages represents a major step towards the miniaturization of affordable and pocket-sized quantum systems. Various components, which are essential for these systems, are under research at the Institute of Micro Production Technology, including a hermetic micro-fabricated vacuum package. To achieve this, a UHV Bonder was developed and set up in its first initial iteration, capable of capsulating under UHV conditions and thereby providing a promising outlook for an integration of said components inside the package. A chamber base pressure of 8*10-9 mbar was reached without a bakeout before bonding and Au-Au samples have been successfully bonded at low temperatures (200°C) with an applied pressure of 600 N. Vacuum characteristics were analyzed using a residual gas analyzer (RGA), while the bonded samples were characterized through shear tests and examined with SEM.
UR - http://www.scopus.com/inward/record.url?scp=85196911569&partnerID=8YFLogxK
M3 - Conference contribution
AN - SCOPUS:85196911569
SP - 763
EP - 766
BT - MikroSystemTechnik Kongress 2023 - Mikroelektronik, Mikrosystemtechnik und ihre Anwendungen - Nachhaltigkeit und Technologiesouveranitat, Proceedings
PB - VDE Verlag GmbH
T2 - Technology Congress 2023
Y2 - 23 October 2023 through 25 October 2023
ER -