A 2-8V Vin 670mA Scalable Multi-Ratio SC DCDC Converter for MCU Integration in 28nm CMOS Achieving 91% Peak Efficiency

Gehl, A., Cherniak, K., Kharko, O., Marin, G., Bacinski, P., Prämaßing, F. & Wicht, B., 2023, ESSCIRC 2023- IEEE 49th European Solid State Circuits Conference (ESSCIRC). S. 425-428 4 S. (European Solid-State Circuits Conference; Band 2023-September).

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A Decentralized Coordination of Inverter-Based Generation Units for a Bottom-up Black Start without Communication

Mirzadeh, M. & Mertens, A., 2023, ICPE 2023-ECCE Asia : 11th International Conference on Power Electronics - Green World with Power Electronics. Institute of Electrical and Electronics Engineers Inc., S. 345-352 8 S. ( International Conference on Power Electronics).

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Calculation of Characteristic Modes of Antenna Arrays using Spherical Wave Functions and Transition Matrices

Mörlein, L., Mrochen, A. & Manteuffel, D., 2023, 17th European Conference on Antennas and Propagation, EuCAP 2023.

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Comparison of Floquet Port Based Unit Cell Design and Characteristic Mode Analysis for Anomalous Reflecting Metasurfaces

Hoffmann, A., Ponschab, M., Pietzka, M., Ribeiro, L. N., Gentner, P. K. & Manteuffel, D., 2023, 17th European Conference on Antennas and Propagation, EuCAP 2023.

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Experimental Validation of the Quasi-Three-Level Operation Mode for a Hybrid Modular Multilevel Converter with Series-Connected Clamping Switches

Lorenz, M. & Mertens, A., 2023, ICPE 2023-ECCE Asia : 11th International Conference on Power Electronics - Green World with Power Electronics. Institute of Electrical and Electronics Engineers Inc., S. 2218-2225 8 S. ( International Conference on Power Electronics).

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Exploiting Subword Permutations to Maximize CNN Compute Performance and Efficiency

Beyer, M., Gesper, S., Guntoro, A., Paya-Vaya, G. & Blume, H., 2023, Proceedings - 2023 IEEE 34th International Conference on Application-Specific Systems, Architectures and Processors, ASAP 2023. Institute of Electrical and Electronics Engineers Inc., S. 61-68 8 S. (Proceedings of the International Conference on Application-Specific Systems, Architectures and Processors; Band 2023-July).

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Implementation and Validation of a Long-Term Measurement System for Single Event Burnout at High Altitude

Beckemeier, C., Fauth, L. & Friebe, J., 2023, ICPE 2023-ECCE Asia - 11th International Conference on Power Electronics - ECCE Asia. Institute of Electrical and Electronics Engineers Inc., S. 3224-3229 6 S. (International Conference on Power Electronics).

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Learning-Based Scalable Video Coding with Spatial and Temporal Prediction

Benjak, M., Chen, Y. H., Peng, W. H. & Ostermann, J., 2023, 2023 IEEE International Conference on Visual Communications and Image Processing, VCIP 2023. Institute of Electrical and Electronics Engineers Inc.

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Millimeter Wave User Equipment Beamforming Concept Compliant With 3GPP Specifications

Hahn, T. & Manteuffel, D., 2023, 17th European Conference on Antennas and Propagation, EuCAP 2023.

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Prediction and Measurement of Bearing Currents in an Electric Traction Drive System

Holtje, P., Junemann, L., Knebusch, B., Euler-Rolle, N., Zeiler, A., Mertens, A. & Ponick, B., 2023, ICPE 2023-ECCE Asia : 11th International Conference on Power Electronics - Green World with Power Electronics. Institute of Electrical and Electronics Engineers Inc., S. 154-160 7 S. ( International Conference on Power Electronics).

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Rate Adaptation for Learned Two-layer B-frame Coding without Signaling Motion Information

Xie, H. S., Chen, Y. H., Peng, W. H., Benjak, M. & Ostermann, J., 2023, 2023 IEEE International Conference on Visual Communications and Image Processing, VCIP 2023. Institute of Electrical and Electronics Engineers Inc., (IEEE International Conference on Visual Communications and Image Processing).

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Real-time hybrid quantum-classical computations for trapped ions with Python control-flow

Schmale, T., Temesi, B., Trittschanke, N., Pulido-Mateo, N., Elenskiy, I., Krinner, L., Dubielzig, T., Ospelkaus, C., Weimer, H. & Borcherding, D., 2023, 2023 IEEE International Conference on Quantum Software: QSW 2023. Ali, S., Ardagna, C., Atukorala, N., Barzen, J., Chang, C. K., Chang, R. N., Fan, J., Faro, I., Feld, S., Fox, G. C., Jin, Z., Leymann, F., Neukart, F., de la Puente, S. & Wimmer, M. (Hrsg.). Institute of Electrical and Electronics Engineers Inc., S. 193-199 7 S.

Publikation: Beitrag in Buch/Bericht/Sammelwerk/Konferenzband › Aufsatz in Konferenzband › Forschung › Peer-Review