Details
| Originalsprache | Englisch |
|---|---|
| Titel des Sammelwerks | Proceedings |
| Untertitel | IEEE 70th Electronic Components and Technology Conference, ECTC 2020 |
| Herausgeber (Verlag) | Institute of Electrical and Electronics Engineers Inc. |
| Seiten | 276-283 |
| Seitenumfang | 8 |
| ISBN (elektronisch) | 9781728161808 |
| ISBN (Print) | 978-1-7281-6181-5 |
| Publikationsstatus | Veröffentlicht - 2020 |
| Veranstaltung | 70th IEEE Electronic Components and Technology Conference, ECTC 2020 - Orlando, USA / Vereinigte Staaten Dauer: 3 Juni 2020 → 30 Juni 2020 |
Publikationsreihe
| Name | Proceedings - Electronic Components and Technology Conference |
|---|---|
| Band | 2020-June |
| ISSN (Print) | 0569-5503 |
Abstract
In this paper, the process chain of a novel 4×3 force sensor array prototype for in-situ detection of the stress distribution during ultrasonic (US) wire bonding process is demonstrated. The sensor is based on d15 lead zirconate titanate (PZT) 255 ceramic, which is cut into individual columns by precision dicing. Polyimide is then filled among the columns to constitute a new PZT/polyimide hybrid sensor platform. Each PZT column is responsible for the measurement of the local tangential force at the wire/substrate interface during US wire bonding.
ASJC Scopus Sachgebiete
- Werkstoffwissenschaften (insg.)
- Elektronische, optische und magnetische Materialien
- Ingenieurwesen (insg.)
- Elektrotechnik und Elektronik
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Proceedings: IEEE 70th Electronic Components and Technology Conference, ECTC 2020. Institute of Electrical and Electronics Engineers Inc., 2020. S. 276-283 9159495 (Proceedings - Electronic Components and Technology Conference; Band 2020-June).
Publikation: Beitrag in Buch/Bericht/Sammelwerk/Konferenzband › Aufsatz in Konferenzband › Forschung › Peer-Review
}
TY - GEN
T1 - Novel Piezoelectric Force Sensor Array for Investigation of Ultrasonic Wire Bonding
AU - Arndt, Matthias
AU - Long, Yangyang
AU - Dencker, Folke
AU - Reimann, Jannik
AU - Twiefel, Jens
AU - Wurz, Marc Christopher
N1 - Funding Information: ACKNOWLEDGMENT This work is supported by the German Research Foundation DFG (TW 75/8-1|WA 564/40-1|WU 558/11-1). Simulation images used courtesy of ANSYS, Inc.
PY - 2020
Y1 - 2020
N2 - In this paper, the process chain of a novel 4×3 force sensor array prototype for in-situ detection of the stress distribution during ultrasonic (US) wire bonding process is demonstrated. The sensor is based on d15 lead zirconate titanate (PZT) 255 ceramic, which is cut into individual columns by precision dicing. Polyimide is then filled among the columns to constitute a new PZT/polyimide hybrid sensor platform. Each PZT column is responsible for the measurement of the local tangential force at the wire/substrate interface during US wire bonding.
AB - In this paper, the process chain of a novel 4×3 force sensor array prototype for in-situ detection of the stress distribution during ultrasonic (US) wire bonding process is demonstrated. The sensor is based on d15 lead zirconate titanate (PZT) 255 ceramic, which is cut into individual columns by precision dicing. Polyimide is then filled among the columns to constitute a new PZT/polyimide hybrid sensor platform. Each PZT column is responsible for the measurement of the local tangential force at the wire/substrate interface during US wire bonding.
KW - process development
KW - PZT
KW - shear force sensor
KW - ultrasonic wire bonding
UR - http://www.scopus.com/inward/record.url?scp=85090293204&partnerID=8YFLogxK
U2 - 10.1109/ECTC32862.2020.00053
DO - 10.1109/ECTC32862.2020.00053
M3 - Conference contribution
AN - SCOPUS:85090293204
SN - 978-1-7281-6181-5
T3 - Proceedings - Electronic Components and Technology Conference
SP - 276
EP - 283
BT - Proceedings
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 70th IEEE Electronic Components and Technology Conference, ECTC 2020
Y2 - 3 June 2020 through 30 June 2020
ER -