Details
| Originalsprache | undefiniert/unbekannt |
|---|---|
| Titel des Sammelwerks | 2022 Asia-Pacific Microwave Conference (APMC) |
| Publikationsstatus | Veröffentlicht - 29 Nov. 2022 |
| Extern publiziert | Ja |
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Modelling Deposition Uniformity in Microwave Plasma CVD Diamond over 2“ Si wafers. / Cuenca, Jerome A.; Leigh, William; Thomas, Evan L.H. et al.
2022 Asia-Pacific Microwave Conference (APMC). 2022.
2022 Asia-Pacific Microwave Conference (APMC). 2022.
Publikation: Beitrag in Buch/Bericht/Sammelwerk/Konferenzband › Aufsatz in Konferenzband › Forschung › Peer-Review
Cuenca, JA, Leigh, W, Thomas, ELH, Mandal, S & Williams, OA 2022, Modelling Deposition Uniformity in Microwave Plasma CVD Diamond over 2“ Si wafers. in 2022 Asia-Pacific Microwave Conference (APMC). https://doi.org/10.23919/apmc55665.2022.9999754
Cuenca, J. A., Leigh, W., Thomas, E. L. H., Mandal, S., & Williams, O. A. (2022). Modelling Deposition Uniformity in Microwave Plasma CVD Diamond over 2“ Si wafers. In 2022 Asia-Pacific Microwave Conference (APMC) https://doi.org/10.23919/apmc55665.2022.9999754
Cuenca JA, Leigh W, Thomas ELH, Mandal S, Williams OA. Modelling Deposition Uniformity in Microwave Plasma CVD Diamond over 2“ Si wafers. in 2022 Asia-Pacific Microwave Conference (APMC). 2022 doi: 10.23919/apmc55665.2022.9999754
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@inproceedings{10810594e3754096b8831498af2f8160,
title = "Modelling Deposition Uniformity in Microwave Plasma CVD Diamond over 2“ Si wafers",
author = "Cuenca, {Jerome A.} and William Leigh and Thomas, {Evan L.H.} and Soumen Mandal and Williams, {Oliver A.}",
year = "2022",
month = nov,
day = "29",
doi = "10.23919/apmc55665.2022.9999754",
language = "Undefined/Unknown",
booktitle = "2022 Asia-Pacific Microwave Conference (APMC)",
}
Download
TY - GEN
T1 - Modelling Deposition Uniformity in Microwave Plasma CVD Diamond over 2“ Si wafers
AU - Cuenca, Jerome A.
AU - Leigh, William
AU - Thomas, Evan L.H.
AU - Mandal, Soumen
AU - Williams, Oliver A.
PY - 2022/11/29
Y1 - 2022/11/29
UR - http://dx.doi.org/10.23919/apmc55665.2022.9999754
U2 - 10.23919/apmc55665.2022.9999754
DO - 10.23919/apmc55665.2022.9999754
M3 - Aufsatz in Konferenzband
BT - 2022 Asia-Pacific Microwave Conference (APMC)
ER -