Mikrofluidische Galvanik zur Herstellung magnetoresistiver Schichten

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Titel in ÜbersetzungMicrofluidic electroplating for the production of magnetoresistive layers
OriginalspracheDeutsch
Titel des SammelwerksMikroSystemTechnik Kongress 2017 "MEMS, Mikroelektronik, Systeme", Proceedings
Herausgeber (Verlag)VDE Verlag GmbH
Seiten313-316
Seitenumfang4
ISBN (elektronisch)9783800744916
PublikationsstatusVeröffentlicht - 2017
VeranstaltungMikroSystemTechnik Kongress 2017: MEMS, Mikroelektronik, Systeme - München, Deutschland
Dauer: 23 Okt. 201725 Okt. 2017

Publikationsreihe

NameMikroSystemTechnik Kongress 2017 "MEMS, Mikroelektronik, Systeme", Proceedings

Abstract

A new method to create electroplated microstructures by pattern transfer is to be investigated. The new technique has no need of photolithography steps, a Silicone mold is employed instead. The Silicon mold consists of the anodic wire and the microfluidic channel, through which the electrolyte is pumped through. In this paper the ability of this plating technique to create magnetoresistive structures and the influence of the plating parameters on them is analyzed. The investigated parameters are as follow: current density, volume flow and the sampling rate of the current source. The samples are analyzed regarding their atomic composition, their sensitivity in a homogeneous magnetic field and the deposited height. The Atomic composition can ne varied from 75 % Nickel to 85% Nickel. The deposited layer have a height varying from 1.7 µm to 5 µm. Structures having a sensitivity to an extern magnetic field are realized. The change in resistivity is about 0.4 % ΔR / R0

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Mikrofluidische Galvanik zur Herstellung magnetoresistiver Schichten. / Rechel, Mathias; Taptimthong, Piriya; Arndt, Matthias et al.
MikroSystemTechnik Kongress 2017 "MEMS, Mikroelektronik, Systeme", Proceedings. VDE Verlag GmbH, 2017. S. 313-316 (MikroSystemTechnik Kongress 2017 "MEMS, Mikroelektronik, Systeme", Proceedings).

Publikation: Beitrag in Buch/Bericht/Sammelwerk/KonferenzbandAufsatz in KonferenzbandForschungPeer-Review

Rechel, M, Taptimthong, P, Arndt, M & Wurz, MC 2017, Mikrofluidische Galvanik zur Herstellung magnetoresistiver Schichten. in MikroSystemTechnik Kongress 2017 "MEMS, Mikroelektronik, Systeme", Proceedings. MikroSystemTechnik Kongress 2017 "MEMS, Mikroelektronik, Systeme", Proceedings, VDE Verlag GmbH, S. 313-316, MikroSystemTechnik Kongress 2017: MEMS, Mikroelektronik, Systeme, München, Bayern, Deutschland, 23 Okt. 2017.
Rechel, M., Taptimthong, P., Arndt, M., & Wurz, M. C. (2017). Mikrofluidische Galvanik zur Herstellung magnetoresistiver Schichten. In MikroSystemTechnik Kongress 2017 "MEMS, Mikroelektronik, Systeme", Proceedings (S. 313-316). (MikroSystemTechnik Kongress 2017 "MEMS, Mikroelektronik, Systeme", Proceedings). VDE Verlag GmbH.
Rechel M, Taptimthong P, Arndt M, Wurz MC. Mikrofluidische Galvanik zur Herstellung magnetoresistiver Schichten. in MikroSystemTechnik Kongress 2017 "MEMS, Mikroelektronik, Systeme", Proceedings. VDE Verlag GmbH. 2017. S. 313-316. (MikroSystemTechnik Kongress 2017 "MEMS, Mikroelektronik, Systeme", Proceedings).
Rechel, Mathias ; Taptimthong, Piriya ; Arndt, Matthias et al. / Mikrofluidische Galvanik zur Herstellung magnetoresistiver Schichten. MikroSystemTechnik Kongress 2017 "MEMS, Mikroelektronik, Systeme", Proceedings. VDE Verlag GmbH, 2017. S. 313-316 (MikroSystemTechnik Kongress 2017 "MEMS, Mikroelektronik, Systeme", Proceedings).
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abstract = "A new method to create electroplated microstructures by pattern transfer is to be investigated. The new technique has no need of photolithography steps, a Silicone mold is employed instead. The Silicon mold consists of the anodic wire and the microfluidic channel, through which the electrolyte is pumped through. In this paper the ability of this plating technique to create magnetoresistive structures and the influence of the plating parameters on them is analyzed. The investigated parameters are as follow: current density, volume flow and the sampling rate of the current source. The samples are analyzed regarding their atomic composition, their sensitivity in a homogeneous magnetic field and the deposited height. The Atomic composition can ne varied from 75 % Nickel to 85% Nickel. The deposited layer have a height varying from 1.7 µm to 5 µm. Structures having a sensitivity to an extern magnetic field are realized. The change in resistivity is about 0.4 % ΔR / R0",
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AU - Arndt, Matthias

AU - Wurz, Marc Christopher

N1 - Publisher Copyright: © 2017 MEMS.All right reserved. Copyright: Copyright 2020 Elsevier B.V., All rights reserved.

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N2 - A new method to create electroplated microstructures by pattern transfer is to be investigated. The new technique has no need of photolithography steps, a Silicone mold is employed instead. The Silicon mold consists of the anodic wire and the microfluidic channel, through which the electrolyte is pumped through. In this paper the ability of this plating technique to create magnetoresistive structures and the influence of the plating parameters on them is analyzed. The investigated parameters are as follow: current density, volume flow and the sampling rate of the current source. The samples are analyzed regarding their atomic composition, their sensitivity in a homogeneous magnetic field and the deposited height. The Atomic composition can ne varied from 75 % Nickel to 85% Nickel. The deposited layer have a height varying from 1.7 µm to 5 µm. Structures having a sensitivity to an extern magnetic field are realized. The change in resistivity is about 0.4 % ΔR / R0

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