Laser-assisted bonding between silicon and glass for the production of hermetic packages

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Titel in ÜbersetzungLasergestütztes Bonden zwischen Silizium und Glas zur Herstellung von hermetischen Packages
OriginalspracheEnglisch
Titel des SammelwerksMikroSystemTechnik Kongress 2023 - Mikroelektronik, Mikrosystemtechnik und ihre Anwendungen - Nachhaltigkeit und Technologiesouveranitat, Proceedings
Seiten332-335
Seitenumfang4
ISBN (elektronisch)9783800762040
PublikationsstatusVeröffentlicht - 24 Okt. 2023

Abstract

Hermetic packages fabricated using silicon microtechnology are important for the actual miniaturisation of quantum sensors, which will provide high accuracy and sensitivity for future industrial systems. For this purpose, bonding between silicon and glass with a UV marking laser is investigated. Compared to other hermetic bonding methods, laser bonding allows a lower global temperature stress and shorter process times while having the potential for high mechanical bond strengths and high hermetic properties. The laser parameter of power, marking speed and number of repetitions, which control the local temperature input by the laser, are evaluated. With optimum parameters a mechanical strength of at least 42.2 MPa is achieved, based on the bonding area of 4.6 mm(exp 2). Here, the glass substrate breaks and the bond is not the limiting factor for the mechanical strength. A problem for the hermeticity is cracking of the glass substrate caused by too high temperature input which is shown in detail in this paper. This requires a high control of the temperature input by an automatic laser power regulation or substrate cooling for further optimization potential.

Schlagwörter

    Packages, Laserunterstütztes Bonding, Silizium-Glas

ASJC Scopus Sachgebiete

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Laser-assisted bonding between silicon and glass for the production of hermetic packages. / Koch, Jannik.
MikroSystemTechnik Kongress 2023 - Mikroelektronik, Mikrosystemtechnik und ihre Anwendungen - Nachhaltigkeit und Technologiesouveranitat, Proceedings. 2023. S. 332-335.

Publikation: Beitrag in Buch/Bericht/Sammelwerk/KonferenzbandAufsatz in KonferenzbandForschungPeer-Review

Koch, J 2023, Laser-assisted bonding between silicon and glass for the production of hermetic packages. in MikroSystemTechnik Kongress 2023 - Mikroelektronik, Mikrosystemtechnik und ihre Anwendungen - Nachhaltigkeit und Technologiesouveranitat, Proceedings. S. 332-335.
Koch, J. (2023). Laser-assisted bonding between silicon and glass for the production of hermetic packages. In MikroSystemTechnik Kongress 2023 - Mikroelektronik, Mikrosystemtechnik und ihre Anwendungen - Nachhaltigkeit und Technologiesouveranitat, Proceedings (S. 332-335)
Koch J. Laser-assisted bonding between silicon and glass for the production of hermetic packages. in MikroSystemTechnik Kongress 2023 - Mikroelektronik, Mikrosystemtechnik und ihre Anwendungen - Nachhaltigkeit und Technologiesouveranitat, Proceedings. 2023. S. 332-335
Koch, Jannik. / Laser-assisted bonding between silicon and glass for the production of hermetic packages. MikroSystemTechnik Kongress 2023 - Mikroelektronik, Mikrosystemtechnik und ihre Anwendungen - Nachhaltigkeit und Technologiesouveranitat, Proceedings. 2023. S. 332-335
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abstract = "Hermetic packages fabricated using silicon microtechnology are important for the actual miniaturisation of quantum sensors, which will provide high accuracy and sensitivity for future industrial systems. For this purpose, bonding between silicon and glass with a UV marking laser is investigated. Compared to other hermetic bonding methods, laser bonding allows a lower global temperature stress and shorter process times while having the potential for high mechanical bond strengths and high hermetic properties. The laser parameter of power, marking speed and number of repetitions, which control the local temperature input by the laser, are evaluated. With optimum parameters a mechanical strength of at least 42.2 MPa is achieved, based on the bonding area of 4.6 mm(exp 2). Here, the glass substrate breaks and the bond is not the limiting factor for the mechanical strength. A problem for the hermeticity is cracking of the glass substrate caused by too high temperature input which is shown in detail in this paper. This requires a high control of the temperature input by an automatic laser power regulation or substrate cooling for further optimization potential.",
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N2 - Hermetic packages fabricated using silicon microtechnology are important for the actual miniaturisation of quantum sensors, which will provide high accuracy and sensitivity for future industrial systems. For this purpose, bonding between silicon and glass with a UV marking laser is investigated. Compared to other hermetic bonding methods, laser bonding allows a lower global temperature stress and shorter process times while having the potential for high mechanical bond strengths and high hermetic properties. The laser parameter of power, marking speed and number of repetitions, which control the local temperature input by the laser, are evaluated. With optimum parameters a mechanical strength of at least 42.2 MPa is achieved, based on the bonding area of 4.6 mm(exp 2). Here, the glass substrate breaks and the bond is not the limiting factor for the mechanical strength. A problem for the hermeticity is cracking of the glass substrate caused by too high temperature input which is shown in detail in this paper. This requires a high control of the temperature input by an automatic laser power regulation or substrate cooling for further optimization potential.

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