Details
| Originalsprache | Englisch |
|---|---|
| Titel des Sammelwerks | 2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2022 |
| Herausgeber (Verlag) | Institute of Electrical and Electronics Engineers Inc. |
| ISBN (elektronisch) | 9781665458368 |
| ISBN (Print) | 978-1-6654-5837-5 |
| Publikationsstatus | Veröffentlicht - 2022 |
| Veranstaltung | 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2022 - St Julian, Malta Dauer: 25 Apr. 2022 → 27 Apr. 2022 |
Publikationsreihe
| Name | 2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2022 |
|---|
Abstract
Basically, every human as well as electronical equipment on earth, is naturally exposed to ionizing radiation. This may lead to unwanted failures, especially in microelectronic devices. This becomes more severe due to the continuously downscaling of microelectronic structures. The use of SRAM-based FPGAs for aerospace applications is viewed critically [1]-[3]. Autonomous driving and the expectation of more than 8000 new launched satellites, for navigation and communication, in the next few years increases the need for radiation hardened (Rad-Hard) components, which are expensive. Therefore, the aim is to find commercials-of-The-shelf (COTS), which meets the need for this kind of harsh environment. Normally, Rad-Hard components are specially designed and tested especially for the application in automotive. It is well known that test time in all cases is expensive and time-consuming. Furthermore, simulations are more and more desired to decrease test times and allow a deeper look into the physical behavior of components and devices.
ASJC Scopus Sachgebiete
- Chemische Verfahrenstechnik (insg.)
- Fließ- und Transferprozesse von Flüssigkeiten
- Ingenieurwesen (insg.)
- Numerische Mechanik
- Ingenieurwesen (insg.)
- Elektrotechnik und Elektronik
- Ingenieurwesen (insg.)
- Maschinenbau
- Werkstoffwissenschaften (insg.)
- Elektronische, optische und magnetische Materialien
- Mathematik (insg.)
- Modellierung und Simulation
Zitieren
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- BibTex
- RIS
2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2022. Institute of Electrical and Electronics Engineers Inc., 2022. (2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2022).
Publikation: Beitrag in Buch/Bericht/Sammelwerk/Konferenzband › Aufsatz in Konferenzband › Forschung › Peer-Review
}
TY - GEN
T1 - Investigation of FPGA and SRAM Cells under Radiation Exposure
AU - Weide-Zaage, Kirsten
AU - Paya-Vaya, Guillermo
AU - Schmidt, Katharina
AU - Hagenah, Dorian
N1 - Publisher Copyright: © 2022 IEEE.
PY - 2022
Y1 - 2022
N2 - Basically, every human as well as electronical equipment on earth, is naturally exposed to ionizing radiation. This may lead to unwanted failures, especially in microelectronic devices. This becomes more severe due to the continuously downscaling of microelectronic structures. The use of SRAM-based FPGAs for aerospace applications is viewed critically [1]-[3]. Autonomous driving and the expectation of more than 8000 new launched satellites, for navigation and communication, in the next few years increases the need for radiation hardened (Rad-Hard) components, which are expensive. Therefore, the aim is to find commercials-of-The-shelf (COTS), which meets the need for this kind of harsh environment. Normally, Rad-Hard components are specially designed and tested especially for the application in automotive. It is well known that test time in all cases is expensive and time-consuming. Furthermore, simulations are more and more desired to decrease test times and allow a deeper look into the physical behavior of components and devices.
AB - Basically, every human as well as electronical equipment on earth, is naturally exposed to ionizing radiation. This may lead to unwanted failures, especially in microelectronic devices. This becomes more severe due to the continuously downscaling of microelectronic structures. The use of SRAM-based FPGAs for aerospace applications is viewed critically [1]-[3]. Autonomous driving and the expectation of more than 8000 new launched satellites, for navigation and communication, in the next few years increases the need for radiation hardened (Rad-Hard) components, which are expensive. Therefore, the aim is to find commercials-of-The-shelf (COTS), which meets the need for this kind of harsh environment. Normally, Rad-Hard components are specially designed and tested especially for the application in automotive. It is well known that test time in all cases is expensive and time-consuming. Furthermore, simulations are more and more desired to decrease test times and allow a deeper look into the physical behavior of components and devices.
KW - COTS
KW - Neutron
KW - Rad-Hard
KW - Radiation
KW - SEU
KW - Simulation
UR - http://www.scopus.com/inward/record.url?scp=85129458846&partnerID=8YFLogxK
U2 - 10.1109/EuroSimE54907.2022.9758864
DO - 10.1109/EuroSimE54907.2022.9758864
M3 - Conference contribution
AN - SCOPUS:85129458846
SN - 978-1-6654-5837-5
T3 - 2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2022
BT - 2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2022
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2022
Y2 - 25 April 2022 through 27 April 2022
ER -